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Keywords: Monte Carlo methods
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021002.
Published Online: June 22, 2011
... advantages include convenient processing, and thus low cost. Disadvantages include induced thermal stresses due to the mismatch in the coefficients of thermal expansion and low thermal conductivity of the polymer. composite materials disperse systems molecular dynamics method Monte Carlo methods...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 114–119.
Published Online: March 14, 2003
... as shown in Fig. 1 ( b ). Strength Reliability Silicon Grinding Defects Dicing Defects flip-chip devices Weibull distribution fracture toughness integrated circuit reliability integrated circuit packaging Monte Carlo methods silicon 27 December 2001 14 03 2003...