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Keywords: BGA
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Journal Articles
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041005.
Paper No: EP-17-1072
Published Online: September 10, 2018
...Qiming Zhang; Jeffery C. C. Lo; S. W. Ricky Lee; Wei Xu In recent years, due to the increased size of ball grid array (BGA) devices, the assembly of BGAs on printed circuit boards through surface mount technology has encountered unprecedented challenges from thermal warpage. The excessive warpage...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041004.
Paper No: EP-17-1062
Published Online: August 20, 2018
... response of the assembly over time. Reliability tests were performed using the resonance tracking sinusoidal test method for assemblies, each consisting of a centrally mounted ball grid array (BGA) device assembled with 63Sn37Pb and SAC105 solder alloys. These tests show that the resonance tracking method...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. June 2018, 140(2): 020905.
Paper No: EP-17-1083
Published Online: May 9, 2018
... 09 2017 13 01 2018 BGA Connectors Harsh environment Physics of failure Reliability Autonomous vehicles represent a major innovation in the automotive industry. A key ingredient in these vehicles is the integration of electronics to improve safety, add comfort, sense...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. December 2017, 139(4): 041007.
Paper No: EP-17-1007
Published Online: October 13, 2017
...Byung-Seung Yim; Young-Eui Shin; Jong-Min Kim In this work, a novel ball grid array (BGA) interconnection process has been developed using solderable polymer–solder composites (SPCs) with low-melting-point alloy (LMPA) fillers to enhance the processability of the conventional capillary underfill...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. December 2017, 139(4): 041001.
Paper No: EP-16-1151
Published Online: July 27, 2017
... LECTRONIC P ACKAGING . Manuscript received December 31, 2016; final manuscript received March 28, 2017; published online July 27, 2017. Assoc. Editor: Eric Wong. 31 12 2016 28 03 2017 3D packaging BGA Embedded passives Flip chip Wireless Today's radio frequency (RF) modules...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2017, 139(3): 031009.
Paper No: EP-17-1012
Published Online: July 14, 2017
... layouts. Area array BGA Conductive adhesives Conductive Inks Conformal coatings Electronic Flip chip High density interconnects Microsystems PWB Rework SMT Underfill Wirebond 30 01 2017 31 05 2017 Contributed by the Electronic and Photonic Packaging Division...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 011003.
Paper No: EP-15-1113
Published Online: March 10, 2016
... described. Also, a simple equation for estimating ball grid array (BGA) solder joint axial stiffness was developed. The results of the analytical solution were validated with modal analysis measurements and finite element (FE) models data in terms of natural frequencies and mode shapes. Then, the analytical...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. December 2015, 137(4): 041004.
Paper No: EP-14-1080
Published Online: October 1, 2015
...Tzeng Yih-Fong; Chen Fu-Chen; Chen Chih-Huang This paper presents an integrated approach combining principal component analysis (PCA) and Taguchi methods to develop a ball grid array (BGA), gold (Au) wire bonding process with multiple quality characteristics optimization. Eight main process factors...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. June 2015, 137(2): 021012.
Paper No: EP-14-1077
Published Online: June 1, 2015
... on to apply beyond the region of the test. Individual ball grid array (BGA) scale Sn3Ag0.5Cu (SAC305) solder joints were subjected to isothermal shear fatigue testing at room temperature and 65 °C. The resulting mechanical response degradation and crack behavior, including strain hardening, crack initiation...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 483–495.
Published Online: March 21, 2005
... circuit manufacture solders tensile testing printed circuit testing finite element analysis tin alloys silver alloys lead alloys failure analysis testing 62/63/2 solder in situ solder characterization area array package chips BGA printed wiring boards test methods failure modes...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 446–451.
Published Online: January 13, 2005
...) solders flip-chip devices high-temperature electronics flip-chip bump/UBM BGA lead-free solder reliability test In packages, defects are mostly found in solder joints. To meet the requirement of environment protection, the related research and development of the lead-free solder become...