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Journal Articles

Spray Cooling of IGBT Devices

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Robert G. Mertens, Louis Chow, Kalpathy B. Sundaram, R. Brian Cregger, Daniel P. Rini, Louis Turek, Benjamin A. Saarloos
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 316–323.
https://doi.org/10.1115/1.2753937
Published Online: May 18, 2007
View Articletitled, Spray Cooling of IGBT Devices
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Topics: Cooling, Heat flux, Sprays, Temperature, Water, Junctions, Cycles
Journal Articles

Flexible Profile Compact Thermal Models for Practical Geometries

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Mohamed-Nabil Sabry
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 256–259.
https://doi.org/10.1115/1.2753908
Published Online: April 16, 2007
View Articletitled, Flexible Profile Compact Thermal Models for Practical Geometries
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Topics: Boundary-value problems, Errors, Heat, Heat flux, Heating, Temperature, Temperature gradient, Integrated circuit packaging, Multi-chip modules, Reliability
Journal Articles

Chip to System Levels Thermal Needs and Alternative Thermal Technologies for High Brightness LEDS

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Mehmet Arik, Anant Setlur, Stanton Weaver, Deborah Haitko, James Petroski
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 328–338.
https://doi.org/10.1115/1.2753958
Published Online: April 9, 2007
View Articletitled, Chip to System Levels Thermal Needs and Alternative Thermal Technologies for High Brightness LEDS
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Topics: Brightness (Photometry), Design, Heat, Light-emitting diodes, Phosphors, Silicones, Temperature, Thermal management, Temperature distribution, Packaging
Journal Articles

Experimental Investigation of Compact Evaporators for Ultralow Temperature Refrigeration of Microprocessors

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Robert Wadell, Yogendra K. Joshi, Andrei G. Fedorov
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 291–299.
https://doi.org/10.1115/1.2753919
Published Online: March 28, 2007
View Articletitled, Experimental Investigation of Compact Evaporators for Ultralow Temperature Refrigeration of Microprocessors
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Topics: Flow (Dynamics), Heat, Heat flux, Heat transfer, Refrigeration, Temperature, Pressure drop, Refrigerants, Microchannels
Journal Articles

Viscoelastic Influence on Dynamic Properties of PCB Under Drop Impact

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Fang Liu, Guang Meng, Mei Zhao
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 266–272.
https://doi.org/10.1115/1.2753910
Published Online: March 15, 2007
View Articletitled, Viscoelastic Influence on Dynamic Properties of PCB Under Drop Impact
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Topics: Damping, Deflection, Dynamics (Mechanics), Springs, Viscoelasticity, Viscosity, Dynamic analysis
Journal Articles

Investigations of the Thermal Spreading Effects of Rectangular Conduction Plates and Vapor Chamber

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Yen-Shu Chen, Kuo-Hsiang Chien, Chi-Chuan Wang, Tzu-Chen Hung, Yuh-Ming Ferng, Bau-Shei Pei
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 348–355.
https://doi.org/10.1115/1.2753970
Published Online: December 19, 2006
View Articletitled, Investigations of the Thermal Spreading Effects of Rectangular Conduction Plates and Vapor Chamber
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Topics: Heat, Heat conduction, Plates (structures), Temperature, Temperature distribution, Thermal resistance, Vapors, Heat transfer, Flat heat pipes, Computer simulation
Journal Articles

Numerical Study of Turbulent Heat Transfer and Pressure Drop Characteristics in a Water-Cooled Minichannel Heat Sink

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X. L. Xie, W. Q. Tao, Y. L. He
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 247–255.
https://doi.org/10.1115/1.2753887
Published Online: December 13, 2006
View Articletitled, Numerical Study of Turbulent Heat Transfer and Pressure Drop Characteristics in a Water-Cooled Minichannel Heat Sink
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Topics: Cooling, Heat flux, Heat sinks, Heat transfer, Pressure drop, Temperature, Thermal resistance, Turbulence, Wall thickness, Water
Journal Articles

Simulations of Process-Induced Warpage During IC Encapsulation Process

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Shiang-Yu Teng, Sheng-Jye Hwang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 307–315.
https://doi.org/10.1115/1.2753936
Published Online: December 11, 2006
View Articletitled, Simulations of Process-Induced Warpage During IC Encapsulation Process
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Topics: Shrinkage (Materials), Simulation, Warping, Temperature
Journal Articles

Thermal Induced Stresses in Bridge-Wire Initiator Glass-to-Metal Seals

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Luke M. Thompson, Michael R. Maughan, Karl K. Rink, Donald M. Blackketter, Robert R. Stephens
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 300–306.
https://doi.org/10.1115/1.2753920
Published Online: November 29, 2006
View Articletitled, Thermal Induced Stresses in Bridge-Wire Initiator Glass-to-Metal Seals
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Topics: Finite element analysis, Glass, Stress, Wire, Manufacturing, Bridges (Structures), Cooling, Temperature
Journal Articles

Parametric and Optimal Design in Electronic Packaging Using DSC: Computational, Geometrical, and Material Aspects

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Russell Whitenack, Chandra Desai, Mostafa Rassaian
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 356–365.
https://doi.org/10.1115/1.2753981
Published Online: November 13, 2006
View Articletitled, Parametric and Optimal Design in Electronic Packaging Using DSC: Computational, Geometrical, and Material Aspects
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Topics: Cycles, Design, Electronic packaging, Failure, Plasticity, Shapes, Solders
Journal Articles

Numerical Optimization of the Thermoelectric Cooling Devices

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Boris Abramzon
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 339–347.
https://doi.org/10.1115/1.2753959
Published Online: November 5, 2006
View Articletitled, Numerical Optimization of the Thermoelectric Cooling Devices
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Topics: Cooling, Optimization, Temperature, Thermoelectric coolers, Electric current
Journal Articles

Jet Impingement Cooling of Chips Equipped With Multiple Cylindrical Pedestal Fins

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D. H. Lee, Y. S. Chung, P. M. Ligrani
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 221–228.
https://doi.org/10.1115/1.2753884
Published Online: October 30, 2006
View Articletitled, Jet Impingement Cooling of Chips Equipped With Multiple Cylindrical Pedestal Fins
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Topics: Flow (Dynamics), Flow separation, Flow visualization, Jets, Nozzles, Pressure, Fins, Temperature, Impingement cooling, Reynolds number
Journal Articles

Effect of RCC on the Reliability of Adhesive Flip Chip Joints

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Laura K. Frisk, Kati H. Kokko
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 260–265.
https://doi.org/10.1115/1.2753909
Published Online: October 27, 2006
View Articletitled, Effect of RCC on the Reliability of Adhesive Flip Chip Joints
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Topics: Adhesives, Bonding, Flip-chip, Flip-chip devices, Particulate matter, Pressure, Reliability, Temperature, Failure, Delamination
Journal Articles

Stochastic Characterization and Models to Predict Performance Uncertainty in Photonic Packages

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S. Radhakrishnan, G. Subbarayan, L. Nguyen, W. Mazotti
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 229–235.
https://doi.org/10.1115/1.2753885
Published Online: October 22, 2006
View Articletitled, Stochastic Characterization and Models to Predict Performance Uncertainty in Photonic Packages
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Topics: Epoxy adhesives, Epoxy resins, Uncertainty, Viscoelasticity, Temperature, Modeling, Lasers, Displacement
Journal Articles

Effect of Voids on Thermomechanical Durability of Pb-Free BGA Solder Joints: Modeling and Simulation

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Leila Jannesari Ladani, Abhijit Dasgupta
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 273–277.
https://doi.org/10.1115/1.2753911
Published Online: September 8, 2006
View Articletitled, Effect of Voids on Thermomechanical Durability of Pb-Free BGA Solder Joints: Modeling and Simulation
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Topics: Ball-Grid-Array packaging, Creep, Damage, Durability, Finite element analysis, Modeling, Solders, Thermomechanics, Reliability, Solder joints
Journal Articles

A CFD Application to Optimize T-Shaped Fins: Comparisons to the Constructal Theory’s Results

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Giulio Lorenzini, Simone Moretti
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 324–327.
https://doi.org/10.1115/1.2756852
Published Online: August 31, 2006
View Articletitled, A CFD Application to Optimize T-Shaped Fins: Comparisons to the Constructal Theory’s Results
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Topics: Computational fluid dynamics, Fins, Heat
Journal Articles

On-Wafer Capacitors Under Mechanical Stress

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Päivi H. Karjalainen, Pekka Heino
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 287–290.
https://doi.org/10.1115/1.2753918
Published Online: August 24, 2006
View Articletitled, On-Wafer Capacitors Under Mechanical Stress
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Topics: Capacitors, Semiconductor wafers, Stress, Complementary metal oxide semiconductors
Journal Articles

Configuration Selection, Modeling, and Preliminary Testing in Support of Constant Force Electrical Connectors

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Brent L. Weight, Christopher A. Mattson, Spencer P. Magleby, Larry L. Howell
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 236–246.
https://doi.org/10.1115/1.2721080
Published Online: July 25, 2006
View Articletitled, Configuration Selection, Modeling, and Preliminary Testing in Support of Constant Force Electrical Connectors
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Topics: Design, Engineering prototypes, Modeling, Optimization, Testing, Displacement, Manufacturing, Deflection, Wear
Journal Articles

Strain Rate Dependent Constitutive Model of Multiaxial Ratchetting of 63Sn–37Pb Solder

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Gang Chen, Xu Chen, Kwang Soo Kim, Mohammad Abdel-Karim, Masao Sakane
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 278–286.
https://doi.org/10.1115/1.2753917
Published Online: July 20, 2006
View Articletitled, Strain Rate Dependent Constitutive Model of Multiaxial Ratchetting of 63Sn–37Pb Solder
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Topics: Constitutive equations, Hardening, Kinematics, Shear (Mechanics), Solders, Stress, Deformation
Journal Articles

Mechanical Reliability and Bump Degradation of ACF Flip Chip Packages Using BCB (Cyclotene™) Bumping Dielectrics Under Temperature Cycling

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Woon-Seong Kwon, Hyoung-Joon Kim, Kyung-Wook Paik, Se-Young Jang, Soon-Min Hong
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 202–207.
https://doi.org/10.1115/1.1756143
Published Online: July 8, 2004
View Articletitled, Mechanical Reliability and Bump Degradation of ACF Flip Chip Packages Using BCB (Cyclotene™) Bumping Dielectrics Under Temperature Cycling
Open the PDF for Mechanical Reliability and Bump Degradation of ACF Flip Chip Packages Using BCB (Cyclotene™) Bumping Dielectrics Under Temperature Cycling in another window
Topics: Adhesion, Aluminum, Cycles, Damage, Delamination, Dielectric materials, Displacement, Flip-chip packages, Fracture (Materials), Fracture (Process)