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Journal Articles

Submillimeter Reflector for Edge-Emitting Laser Package

Available to Purchase
Kuo-Tung Huang, Ying-Che Suang, Hsin-Lin Wu, Cheng-Han Wang, Qi-Hong Yang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2025, 147(3): 034501.
Paper No: EP-24-1088
https://doi.org/10.1115/1.4068142
Published Online: March 28, 2025
View Articletitled, Submillimeter Reflector for Edge-Emitting Laser Package
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Topics: Lasers
Journal Articles

Epoxy-Printed Circuit Board Interfacial Fracture Reliability Under Three-Point and Four-Point Bend Loading After Sustained Elevated Temperature Exposure

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Pradeep Lall, Aathi Raja Ram Pandurangan, Ken Blecker
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2024, 146(3): 034502.
Paper No: EP-22-1028
https://doi.org/10.1115/1.4064604
Published Online: March 7, 2024
View Articletitled, Epoxy-Printed Circuit Board Interfacial Fracture Reliability Under Three-Point and Four-Point Bend Loading After Sustained Elevated Temperature Exposure
Open the PDF for Epoxy-Printed Circuit Board Interfacial Fracture Reliability Under Three-Point and Four-Point Bend Loading After Sustained Elevated Temperature Exposure in another window
Topics: Epoxy adhesives, Epoxy resins, Fracture (Materials), Fracture toughness, Stress, Delamination, Temperature, Reliability, Printed circuit boards
Journal Articles

A Comparative Numerical Analysis of Cold Plates for Thermal Management of Chips With Hotspots

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Mahdi Farahikia, Ping-Chuan Wang, Louis Reyes, Matthew Krumholtz
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2024, 146(3): 034501.
Paper No: EP-23-1066
https://doi.org/10.1115/1.4064523
Published Online: February 7, 2024
View Articletitled, A Comparative Numerical Analysis of Cold Plates for Thermal Management of Chips With Hotspots
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Topics: Coolants, Fins, Numerical analysis, Plates (structures), Pumps, Temperature, Temperature distribution, Thermal management, Thermal resistance, Flow (Dynamics)
Journal Articles

A Comparison of Biaxial Bending Strength of Thin Silicon Dies in the Ball-on-Ring and PoEF Tests

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M. Y. Tsai, T. C. Kuo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2023, 145(3): 034502.
Paper No: EP-22-1060
https://doi.org/10.1115/1.4056717
Published Online: February 8, 2023
View Articletitled, A Comparison of Biaxial Bending Strength of Thin Silicon Dies in the Ball-on-Ring and PoEF Tests
Open the PDF for A Comparison of Biaxial Bending Strength of Thin Silicon Dies in the Ball-on-Ring and PoEF Tests in another window
Topics: Bending strength, Silicon, Stress, Displacement, Failure mechanisms
Journal Articles

Artificial Intelligence for Power Electronics in Electric Vehicles: Challenges and Opportunities

Free
Paul Paret, Donal Finegan, Sreekant Narumanchi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2023, 145(3): 034501.
Paper No: EP-22-1053
https://doi.org/10.1115/1.4056306
Published Online: December 9, 2022
View Articletitled, Artificial Intelligence for Power Electronics in Electric Vehicles: Challenges and Opportunities
Open the PDF for Artificial Intelligence for Power Electronics in Electric Vehicles: Challenges and Opportunities in another window
Topics: Artificial intelligence, Design, Electric vehicles, Electronics, Thermal management, Semiconductor devices, Reliability, Manufacturing, Semiconductors (Materials)
Journal Articles

Multifunctional Magnetic Nanocomposite Encapsulant for Electromagnetic Interference Shielding in Power Electronics

Free
Hayden Carlton, Ange Iradukunda, Asif Imran, Sarah Myane, Noah Akey, Fang Luo, David Huitink
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. June 2022, 144(2): 024502.
Paper No: EP-21-1049
https://doi.org/10.1115/1.4053642
Published Online: February 16, 2022
View Articletitled, Multifunctional Magnetic Nanocomposite Encapsulant for Electromagnetic Interference Shielding in Power Electronics
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Topics: Electromagnetic interference, Electronics, Nanocomposites, Silicones, Nanoparticles, Iron
Journal Articles

Simplified and Detailed Analysis of Data Center Particulate Contamination at Server and Room Level Using Computational Fluid Dynamics

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Satyam Saini, Pardeep Shahi, Pratik Bansode, Jimil M. Shah, Dereje Agonafer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. June 2022, 144(2): 024501.
Paper No: EP-21-1070
https://doi.org/10.1115/1.4053363
Published Online: January 28, 2022
View Articletitled, Simplified and Detailed Analysis of Data Center Particulate Contamination at Server and Room Level Using Computational Fluid Dynamics
Open the PDF for Simplified and Detailed Analysis of Data Center Particulate Contamination at Server and Room Level Using Computational Fluid Dynamics in another window
Topics: Computational fluid dynamics, Data centers, Heat sinks, Particulate matter, Simulation, Contamination, Flow (Dynamics), Particle flow
Journal Articles

Experimental Study on Thermal Contact Resistance Improvement for Optical Fiber by Using Low-Melting Temperature Alloy

Available to Purchase
Wen-Xiao Chu, Hao-Yu Lin, Chi-Chuan Wang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2020, 142(1): 014502.
Paper No: EP-19-1039
https://doi.org/10.1115/1.4044774
Published Online: September 24, 2019
View Articletitled, Experimental Study on Thermal Contact Resistance Improvement for Optical Fiber by Using Low-Melting Temperature Alloy
Open the PDF for Experimental Study on Thermal Contact Resistance Improvement for Optical Fiber by Using Low-Melting Temperature Alloy in another window
Topics: Contact resistance, Melting, Optical fiber, Temperature, Pressure, Alloys, Stress, Heating, Surface roughness, Heat sinks
Journal Articles

Additive-Manufactured Organic Interposers

Available to Purchase
A. Roshanghias, M. Krivec, J. Bardong, A. Binder
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2020, 142(1): 014501.
Paper No: EP-19-1040
https://doi.org/10.1115/1.4044279
Published Online: September 19, 2019
View Articletitled, Additive-Manufactured Organic Interposers
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Topics: Additive manufacturing, Manufacturing, Printing
Journal Articles

Investigation on Laser Direct Welding of Quad Flat Pack Components

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Jianwen Yuan, Chao Huang, Jimin Chen, Furong Liu, Yi Qiu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2013, 135(4): 044501.
Paper No: EP-13-1024
https://doi.org/10.1115/1.4025251
Published Online: September 6, 2013
View Articletitled, Investigation on Laser Direct Welding of Quad Flat Pack Components
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Topics: Lasers, Temperature, Tensile strength, Welding, Solders, Laser welding, Tin
Journal Articles

Heat Conduction in Mobile Electronic Equipment: Study on the Effects of Some Key Parameters on Heat Source Temperature Based on a Three-Layer Model

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Wataru Nakayama
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2013, 135(3): 034501.
Paper No: EP-11-1100
https://doi.org/10.1115/1.4024367
Published Online: June 4, 2013
View Articletitled, Heat Conduction in Mobile Electronic Equipment: Study on the Effects of Some Key Parameters on Heat Source Temperature Based on a Three-Layer Model
Open the PDF for Heat Conduction in Mobile Electronic Equipment: Study on the Effects of Some Key Parameters on Heat Source Temperature Based on a Three-Layer Model in another window
Topics: Heat, Heat conduction, Temperature, Thermal conductivity, Electronic equipment
Journal Articles

A Novel Low Cost Package for Radio Frequency Applications

Available to Purchase
Sandeep Chaturvedi, Shiban K. Koul
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. June 2013, 135(2): 024501.
Paper No: EP-11-1096
https://doi.org/10.1115/1.4023041
Published Online: March 28, 2013
View Articletitled, A Novel Low Cost Package for Radio Frequency Applications
Open the PDF for A Novel Low Cost Package for Radio Frequency Applications in another window
Topics: Design, Laminates, Manufacturing, Simulation, Strip transmission lines, Strips
Journal Articles

Thermal Assessment of Naturally Cooled Electronic Enclosures With Rectangular Fins

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A. Tamayol, F. McGregor, M. Bahrami
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2012, 134(3): 034501.
https://doi.org/10.1115/1.4007077
Published Online: July 24, 2012
View Articletitled, Thermal Assessment of Naturally Cooled Electronic Enclosures With Rectangular Fins
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Topics: Fins, Heat transfer, Natural convection, Radiation (Physics), Temperature
Journal Articles

Bio-inspired Passive Skin Cooling for Handheld Microelectronics Devices

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Zhi Huang, Xinsheng Zhang, Ming Zhou, Xiaoding Xu, Xianzheng Zhang, Xuejiao Hu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2012, 134(1): 014501.
https://doi.org/10.1115/1.4005908
Published Online: March 19, 2012
View Articletitled, Bio-inspired Passive Skin Cooling for Handheld Microelectronics Devices
Open the PDF for Bio-inspired Passive Skin Cooling for Handheld Microelectronics Devices in another window
Topics: Biomimetics, Cooling, Energy dissipation, Heat, Microelectronic devices, Skin, Temperature, Natural convection
Journal Articles

Optimization of Microwave Packaging Structure for Directly Modulated Laser Modules Using Three-Dimensional Electromagnetic Model

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Wei Han, Marc Rensing, Peter O’Brien, Frank H. Peters
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2011, 133(4): 044502.
https://doi.org/10.1115/1.4005292
Published Online: December 9, 2011
View Articletitled, Optimization of Microwave Packaging Structure for Directly Modulated Laser Modules Using Three-Dimensional Electromagnetic Model
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Topics: Lasers, Manufacturing, Microwaves, Optimization, Packaging, Reflection, Resonance, Strip transmission lines, Simulation results, Simulation
Journal Articles

A Creep Model for Solder Alloys

Available to Purchase
Yongchang Lee, Cemal Basaran
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2011, 133(4): 044501.
https://doi.org/10.1115/1.4005288
Published Online: November 17, 2011
View Articletitled, A Creep Model for Solder Alloys
Open the PDF for A Creep Model for Solder Alloys in another window
Topics: Alloys, Creep, Solders
Journal Articles

Accelerated Life Testing in Epoxy Packaged High Luminosity Light Emitting Diodes

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Eduardo Nogueira, Manuel Vázquez, Carlos Algora
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2011, 133(3): 034501.
https://doi.org/10.1115/1.4004659
Published Online: September 14, 2011
View Articletitled, Accelerated Life Testing in Epoxy Packaged High Luminosity Light Emitting Diodes
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Topics: Epoxy adhesives, Epoxy resins, Failure, Light-emitting diodes, Temperature, Circuits
Journal Articles

Improved Packaging Design for Maximizing the Thermal Performance of Multifinger Collector-Up HBTs

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Hsien-Cheng Tseng
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2011, 133(1): 014501.
https://doi.org/10.1115/1.4003515
Published Online: March 9, 2011
View Articletitled, Improved Packaging Design for Maximizing the Thermal Performance of Multifinger Collector-Up HBTs
Open the PDF for Improved Packaging Design for Maximizing the Thermal Performance of Multifinger Collector-Up HBTs in another window
Topics: Design, Gallium arsenide, Genetic algorithms, Optimization, Packaging, Thermal resistance, Transistors, Thermal stability, Thermal management
Journal Articles

Effects of the Thermocompression Bonding on the Microstructure and Contact Resistance for the Ultrafine Pitch Chip-on-Glass Packaging With Nonconductive Film

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Jianhua Zhang, Jinsong Zhang, Lianqiao Yang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2010, 132(4): 044501.
https://doi.org/10.1115/1.4002898
Published Online: December 3, 2010
View Articletitled, Effects of the Thermocompression Bonding on the Microstructure and Contact Resistance for the Ultrafine Pitch Chip-on-Glass Packaging With Nonconductive Film
Open the PDF for Effects of the Thermocompression Bonding on the Microstructure and Contact Resistance for the Ultrafine Pitch Chip-on-Glass Packaging With Nonconductive Film in another window
Topics: Bonding, Contact resistance, Packaging, Tin, Temperature, Pressure, Glass, High temperature, Melting point
Journal Articles

Experimental Analysis Model of an Active Cooling Method for 3D-ICs Utilizing Multidimensional Configured Thermoelectric Coolers

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Huy N. Phan, Dereje Agonafer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. June 2010, 132(2): 024501.
https://doi.org/10.1115/1.4001831
Published Online: June 23, 2010
View Articletitled, Experimental Analysis Model of an Active Cooling Method for 3D-ICs Utilizing Multidimensional Configured Thermoelectric Coolers
Open the PDF for Experimental Analysis Model of an Active Cooling Method for 3D-ICs Utilizing Multidimensional Configured Thermoelectric Coolers in another window
Topics: Cooling, Thermal management, Temperature, Heat sinks, Reliability, Thermoelectric coolers, Air flow