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Journal Articles

Enhancing Mechanical Reliability of Silver-Sintered Joints With Copper Nanowires in High-Power Electronic Devices

Alicia Medina Garcia, John Harris, David R. Huitink

Publisher: ASME

J. Electron. Packag. December 2024, 146(4): 041122.

Paper No: EP-24-1043

https://doi.org/10.1115/1.4066834

Published Online: October 22, 2024

View Article titled, Enhancing Mechanical Reliability of Silver-Sintered Joints With Copper Nanowires in High-Power Electronic Devices

Topics: Copper, Nanowires, Reliability, Silver, Temperature, Sinter (Metallurgy), Shear strength

Journal Articles

Behavior of Polymeric Substrates and Sintered Silver Printed Hybrid Electronic Assemblies Subject to Extreme Acceleration Levels and Elevated Temperatures

Hayden Richards, Hisham Abusalma, Abhijit Dasgupta, Andres Bujanda, Harvey Tsang, Matthew Bowman

Publisher: ASME

J. Electron. Packag. December 2024, 146(4): 041121.

Paper No: EP-24-1044

https://doi.org/10.1115/1.4066833

Published Online: October 16, 2024

View Article titled, Behavior of Polymeric Substrates and Sintered Silver Printed Hybrid Electronic Assemblies Subject to Extreme Acceleration Levels and Elevated Temperatures

Topics: Domes (Structural elements), Shock (Mechanics), Silver, Temperature, Testing, Polysulfone, Reliability

Journal Articles

Impact of Encapsulated Phase Change Material Additives for Improved Thermal Performance of Silicone Gel Insulation

Joshua Kasitz, Muhammad Ghufran, David Huitink

Publisher: ASME

J. Electron. Packag. December 2024, 146(4): 041120.

Paper No: EP-24-1041

https://doi.org/10.1115/1.4066480

Published Online: September 30, 2024

View Article titled, Impact of Encapsulated Phase Change Material Additives for Improved Thermal Performance of Silicone Gel Insulation

Topics: Composite materials, Phase change materials, Silicones, Temperature, Particulate matter, Testing, Cooling, Insulation, Needles, Latent heat

Journal Articles

Extreme Drop Durability of Sintered Silver Traces Printed With Extrusion and Aerosol Jet Processes

Hisham Abusalma, Hayden Richards, Abhijit Dasgupta, Andres Bujanda, Harvey Tsang, Jian Yu

Publisher: ASME

J. Electron. Packag. December 2024, 146(4): 041119.

Paper No: EP-24-1050

https://doi.org/10.1115/1.4066320

Published Online: September 12, 2024

View Article titled, Extreme Drop Durability of Sintered Silver Traces Printed With Extrusion and Aerosol Jet Processes

Topics: Aerosols, Cantilevers, Durability, Extruding, Finite element analysis, Silver, Testing, Printing, Shock (Mechanics), Strain gages

Journal Articles

Development of a Thermal Metrology Standard for Evaluation of Cold Plate Thermal Resistance as a Performance Metric

Victor A. Martinez, Carol Caceres, Alfonso Ortega

Publisher: ASME

J. Electron. Packag. December 2024, 146(4): 041118.

Paper No: EP-24-1040

https://doi.org/10.1115/1.4066101

Published Online: August 24, 2024

View Article titled, Development of a Thermal Metrology Standard for Evaluation of Cold Plate Thermal Resistance as a Performance Metric

Topics: Temperature, Thermal resistance, Thermocouples, Coolants, Errors, Flow (Dynamics), Heat exchangers, Uncertainty

Journal Articles

Reliability Assessment and Multiphysics Simulation of Additively Printed Wearable Humidity Sensor With Supercapacitive Material for Astronaut in Extreme Condition

Pradeep Lall, Hyesoo Jang, Curtis Hill

Publisher: ASME

J. Electron. Packag. December 2024, 146(4): 041114.

Paper No: EP-24-1002

https://doi.org/10.1115/1.4065940

Published Online: August 17, 2024

View Article titled, Reliability Assessment and Multiphysics Simulation of Additively Printed Wearable Humidity Sensor With Supercapacitive Material for Astronaut in Extreme Condition

Topics: Capacitance, Sensors, Temperature, Water, Simulation, Reliability, Printing

Journal Articles

Methodology to Characterize Row Manifolds for High Power Direct to Chip Liquid Cooling Data Centers

Pardeep Shahi, Ali Heydari, Bahareh Eslami, Vahideh Radmard, Chandraprakash Hinge, Himanshu Modi, Lochan Sai Reddy Chinthaparthy, Mohammad Tradat, Dereje Agonafer, Jeremy Rodriguez

Publisher: ASME

J. Electron. Packag. December 2024, 146(4): 041117.

Paper No: EP-24-1030

https://doi.org/10.1115/1.4065948

Published Online: August 17, 2024

View Article titled, Methodology to Characterize Row Manifolds for High Power Direct to Chip Liquid Cooling Data Centers

Topics: Cooling, Data centers, Flow (Dynamics), Manifolds, Pressure, Pressure drop, Temperature, Modeling, Coolants, Calibration

Journal Articles

Process Recipe and Functional Circuitry Performance on Aerosol Jet Printed Water-Based Silver Ink

Pradeep Lall, Sabina Bimali, Scott Miller

Publisher: ASME

J. Electron. Packag. December 2024, 146(4): 041116.

Paper No: EP-24-1029

https://doi.org/10.1115/1.4066041

Published Online: August 17, 2024

View Article titled, Process Recipe and Functional Circuitry Performance on Aerosol Jet Printed Water-Based Silver Ink

Topics: Circuits, Design, Inks, Printing, Shear (Mechanics), Silver, Sintering, Aerosols, Stress, Water

Journal Articles

Thermal Property Estimation of Thin-Layered Structures by Means of Thermoreflectance Measurement and Network Identification by Deconvolution Algorithm

Daiki Higuma, João Vitor Thomsen Silveira, Byunggi Kim, Masahiro Nomura, Kazuyoshi Fushinobu

Publisher: ASME

J. Electron. Packag. December 2024, 146(4): 041115.

Paper No: EP-24-1015

https://doi.org/10.1115/1.4066086

Published Online: August 17, 2024

View Article titled, Thermal Property Estimation of Thin-Layered Structures by Means of Thermoreflectance Measurement and Network Identification by Deconvolution Algorithm

Topics: Algorithms, Lasers, Thermal conductivity, Thermal properties, Thermoreflectance, Temperature, Heat, Flow (Dynamics), Thermal resistance, Interfacial thermal resistance

Journal Articles

Electrically Conductive Adhesives in Microelectronics Packaging

Mukund Ayalasomayajula, Mohit Ravi Khurana, Prince Shiva Chaudhary

Publisher: ASME

J. Electron. Packag. December 2024, 146(4): 041109.

Paper No: EP-23-1091

https://doi.org/10.1115/1.4065939

Published Online: August 9, 2024

View Article titled, Electrically Conductive Adhesives in Microelectronics Packaging

Topics: Adhesives, Fillers (Materials), Anisotropy, Particulate matter

Journal Articles

Convection Cooling of Power Electronics Operating in Deep-Space

Jessica Harsono, Joseph P. Kozak, Hala Tomey, William Yerkes, Jonathan Neville

Publisher: ASME

J. Electron. Packag. December 2024, 146(4): 041111.

Paper No: EP-24-1027

https://doi.org/10.1115/1.4065947

Published Online: August 9, 2024

View Article titled, Convection Cooling of Power Electronics Operating in Deep-Space

Topics: Design, Electronics, Fans, Forced convection, Heat, Simulation, Temperature, Thermal management, Packaging, Cooling

Journal Articles

Virtual Testbed for Economical and Reliability Analysis of Battery Thermal Management Control Strategies

Mostafa Olyaei, Sagar Singh, Kaiying Jiang, Yashraj Gurumukhi, Kenneth Goodson, Mehdi Asheghi, Nenad Miljkovic

Publisher: ASME

J. Electron. Packag. December 2024, 146(4): 041110.

Paper No: EP-24-1024

https://doi.org/10.1115/1.4065988

Published Online: August 9, 2024

View Article titled, Virtual Testbed for Economical and Reliability Analysis of Battery Thermal Management Control Strategies

Topics: Batteries, Cycles, Temperature, Thermal management, Cooling

Journal Articles

Electrochemical Additive Manufacturing-Based Design of a Heat Sink for Single-Phase Natural Convection Immersion Cooling Application

Jacob Lamotte-Dawaghreh, Joseph Herring, Sai Abhideep Pundla, Rohit Suthar, Vivek Nair, Pratik Bansode, Gautam Gupta, Dereje Agonafer, Joseph Madril, Tim Ouradnik, Michael Matthews, Ian Winfield

Publisher: ASME

J. Electron. Packag. December 2024, 146(4): 041113.

Paper No: EP-24-1048

https://doi.org/10.1115/1.4065987

Published Online: August 9, 2024

View Article titled, Electrochemical Additive Manufacturing-Based Design of a Heat Sink for Single-Phase Natural Convection Immersion Cooling Application

Topics: Computational fluid dynamics, Cooling, Design, Heat sinks, Natural convection, Temperature, Triply periodic minimal surfaces, Manufacturing, Porosity

Journal Articles

Impact of Immersion Cooling on Thermomechanical Properties of Halogen-Free Substrate Core

Pratik Bansode, Rohit Suthar, Rabin Bhandari, Akshay Lakshminarayana, Naga Tejesh Eda, Gautam Gupta, Vibin Simon, Himanshu Modi, Vivek Nair, Pardeep Shahi, Satyam Saini, Krishna Bhavana Sivaraju, Dereje Agonafer

Publisher: ASME

J. Electron. Packag. December 2024, 146(4): 041112.

Paper No: EP-24-1042

https://doi.org/10.1115/1.4066044

Published Online: August 9, 2024

View Article titled, Impact of Immersion Cooling on Thermomechanical Properties of Halogen-Free Substrate Core

Topics: Cooling, Elastic moduli, Fluids, Temperature, Thermomechanics, Heat, Energy dissipation, Glass transition, Data centers, Reliability

Journal Articles

Thermal Spreading Resistance of Surface Adjacent Localized Heating-Induced Size Effects in Semiconductors

Amir Abdolhosseinzadeh, Nazli Donmezer

Publisher: ASME

J. Electron. Packag. December 2024, 146(4): 041108.

Paper No: EP-24-1026

https://doi.org/10.1115/1.4065945

Published Online: July 26, 2024

View Article titled, Thermal Spreading Resistance of Surface Adjacent Localized Heating-Induced Size Effects in Semiconductors

Topics: Heat, Heating, Phonons, Temperature

Journal Articles

Liquid-to-Air Coolant Distribution Units Performance and Considerations for Server Rooms Upgrade With Conventional Air Conditioning

Ali Heydari, Qusai Soud, Mohammad Tradat, Ahmad R. Gharaibeh, Najmeh Fallahtafti, Jeremy Rodriguez, Bahgat Sammakia

Publisher: ASME

J. Electron. Packag. December 2024, 146(4): 041106.

Paper No: EP-24-1021

https://doi.org/10.1115/1.4065942

Published Online: July 26, 2024

View Article titled, Liquid-to-Air Coolant Distribution Units Performance and Considerations for Server Rooms Upgrade With Conventional Air Conditioning

Topics: Air conditioning, Coolants, Cooling, Temperature, Vehicles, Stress, Heat, HVAC equipment, Noise (Sound), Flow (Dynamics)

Journal Articles

Cold Gas Spraying Copper Metal on AlN Ceramics as an Alternative to Thick Direct Bond Copper Substrates for Power Electronics

Margie Guerrero-Fernandez, Pedro Quintero, Ozan Cagatay Ozdemir

Publisher: ASME

J. Electron. Packag. December 2024, 146(4): 041107.

Paper No: EP-24-1022

https://doi.org/10.1115/1.4065943

Published Online: July 26, 2024

View Article titled, Cold Gas Spraying Copper Metal on AlN Ceramics as an Alternative to Thick Direct Bond Copper Substrates for Power Electronics

Topics: Coating processes, Coatings, Copper, Plasma spraying, Spraying (Coating processes), Sprays, Surface roughness, Ceramics, Electronics, Experimental design

Journal Articles

Thermal-Hydraulic Characterization of a Thermosyphon Cooling System for Highly Compact Edge MicroDataCenter

Enzo M. Minazzo, Gautier Rouaze, Jackson B. Marcinichen, John R. Thome, Fred Buining

Publisher: ASME

J. Electron. Packag. December 2024, 146(4): 041105.

Paper No: EP-24-1033

https://doi.org/10.1115/1.4065863

Published Online: July 25, 2024

View Article titled, Thermal-Hydraulic Characterization of a Thermosyphon Cooling System for Highly Compact Edge MicroDataCenter

Topics: Condensers (steam plant), Cooling systems, Fluids, Heat, Secondary cells, Stress, Temperature, Thermal resistance, Pipeline risers, Risers (Casting)

Journal Articles

Variable Area Jet Impingement for Enhanced Junction Temperature Control of High-Power Electronics

Reece Whitt, David Huitink

Publisher: ASME

J. Electron. Packag. December 2024, 146(4): 041104.

Paper No: EP-24-1025

https://doi.org/10.1115/1.4065944

Published Online: July 25, 2024

View Article titled, Variable Area Jet Impingement for Enhanced Junction Temperature Control of High-Power Electronics

Topics: Electronics, Flow (Dynamics), Heat transfer, Junctions, Nozzles, Temperature, Temperature control, Testing, Transients (Dynamics), Actuators

Journal Articles

Acoustic Characterization of Integrated Circuits During Operation

Josef Frankhouse, Changgen Li, Han Hu

Publisher: ASME

J. Electron. Packag. December 2024, 146(4): 041103.

Paper No: EP-24-1036

https://doi.org/10.1115/1.4065649

Published Online: June 20, 2024

View Article titled, Acoustic Characterization of Integrated Circuits During Operation

Topics: Acoustic emissions, Acoustics, Electronics, Integrated circuits, Signals, Stress, Waves, Sensors, Monitoring systems

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Enhancing Mechanical Reliability of Silver-Sintered Joints With Copper Nanowires in High-Power Electronic Devices

Behavior of Polymeric Substrates and Sintered Silver Printed Hybrid Electronic Assemblies Subject to Extreme Acceleration Levels and Elevated Temperatures

Impact of Encapsulated Phase Change Material Additives for Improved Thermal Performance of Silicone Gel Insulation

Extreme Drop Durability of Sintered Silver Traces Printed With Extrusion and Aerosol Jet Processes

Development of a Thermal Metrology Standard for Evaluation of Cold Plate Thermal Resistance as a Performance Metric

Reliability Assessment and Multiphysics Simulation of Additively Printed Wearable Humidity Sensor With Supercapacitive Material for Astronaut in Extreme Condition

Methodology to Characterize Row Manifolds for High Power Direct to Chip Liquid Cooling Data Centers

Process Recipe and Functional Circuitry Performance on Aerosol Jet Printed Water-Based Silver Ink

Thermal Property Estimation of Thin-Layered Structures by Means of Thermoreflectance Measurement and Network Identification by Deconvolution Algorithm

Electrically Conductive Adhesives in Microelectronics Packaging

Convection Cooling of Power Electronics Operating in Deep-Space

Virtual Testbed for Economical and Reliability Analysis of Battery Thermal Management Control Strategies

Electrochemical Additive Manufacturing-Based Design of a Heat Sink for Single-Phase Natural Convection Immersion Cooling Application

Impact of Immersion Cooling on Thermomechanical Properties of Halogen-Free Substrate Core

Thermal Spreading Resistance of Surface Adjacent Localized Heating-Induced Size Effects in Semiconductors

Liquid-to-Air Coolant Distribution Units Performance and Considerations for Server Rooms Upgrade With Conventional Air Conditioning

Cold Gas Spraying Copper Metal on AlN Ceramics as an Alternative to Thick Direct Bond Copper Substrates for Power Electronics

Thermal-Hydraulic Characterization of a Thermosyphon Cooling System for Highly Compact Edge MicroDataCenter

Variable Area Jet Impingement for Enhanced Junction Temperature Control of High-Power Electronics

Acoustic Characterization of Integrated Circuits During Operation

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