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Journal Articles

Optimization of the Reliability of Ball Grid Array Solder Joints Under Random Vibration Conditions Using an Improved Back Propagation Neural Network-Based Particle Swarm Algorithm

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Miao Zhu, Xuexia Yang, Yanxi Sun, Jinbao Lin, Erqiang Liu, Ze Wang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2025, 147(3): 031005.
Paper No: EP-24-1084
https://doi.org/10.1115/1.4068450
Published Online: May 16, 2025
View Articletitled, Optimization of the Reliability of Ball Grid Array Solder Joints Under Random Vibration Conditions Using an Improved Back Propagation Neural Network-Based Particle Swarm Algorithm
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Topics: Algorithms, Artificial neural networks, Ball-Grid-Array packaging, Optimization, Particulate matter, Random vibration, Reliability, Response surface methodology, Simulation, Solder joints
Journal Articles

Evaluation of Phase Transformation on Boron Decorated Sn-1.5Ag-0.7 Cu Joined Cu Pillar for Packaging Connection

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Ching-Yuan Ho, Haw-Teng Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2025, 147(3): 031004.
Paper No: EP-24-1023
https://doi.org/10.1115/1.4068448
Published Online: May 12, 2025
View Articletitled, Evaluation of Phase Transformation on Boron Decorated Sn-1.5Ag-0.7 Cu Joined Cu Pillar for Packaging Connection
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Topics: Boron, Columns (Structural), Grain size, High temperature, Intermetallic compounds, Solders, Tin, Storage, Packaging, Phase transitions
Journal Articles

Computational Framework for Computational Fluid Dynamics Analysis of Loop Thermosiphon Based Embedded Cooling Systems

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Caner Ekin Kiper, Ignacio Gallego-Marcos, Stevin Van Wyk, Yigit Akkus
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2025, 147(3): 031003.
Paper No: EP-24-1110
https://doi.org/10.1115/1.4068209
Published Online: April 7, 2025
View Articletitled, Computational Framework for Computational Fluid Dynamics Analysis of Loop Thermosiphon Based Embedded Cooling Systems
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Topics: Flow (Dynamics), Fluids, Relaxation (Physics), Simulation, Temperature, Vapors, Heat, Pressure, Computational fluid dynamics, Turbulence
Includes: Supplementary data
Journal Articles

Flow Characterization of Capillary Underfill in Multi-Chip Heterogenous Integration Using Computational Fluid Dynamics

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Muhammad Aqil Azman, Mohd Zulkifly Abdullah, Wei Keat Loh, Chun Keang Ooi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2025, 147(3): 031002.
Paper No: EP-24-1099
https://doi.org/10.1115/1.4068143
Published Online: March 28, 2025
View Articletitled, Flow Characterization of Capillary Underfill in Multi-Chip Heterogenous Integration Using Computational Fluid Dynamics
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Topics: Computational fluid dynamics, Flow (Dynamics), Simulation, Viscosity
Journal Articles

Enhancing Image Segmentation Model in Computing Void Percentage With Mask RCNN

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Calvin Ling, Aizat Abas, Chew Cheng Kai, Muhammad Taufik Azahari
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2025, 147(3): 031001.
Paper No: EP-24-1090
https://doi.org/10.1115/1.4067897
Published Online: March 14, 2025
View Articletitled, Enhancing Image Segmentation Model in Computing Void Percentage With Mask RCNN
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Topics: Convolutional neural networks, Image segmentation, Ball-Grid-Array packaging, Algorithms, Flip-chip devices, Flip-chip, Manufacturing
Journal Articles

Thomson Effect, Leg Design, Heat Interaction, and Material Impacts on Segmented Thermoelectric Cooler: Insights From Three-Dimensional Simulation

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Aakash Mani, Jahar Sarkar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2025, 147(2): 021010.
Paper No: EP-24-1093
https://doi.org/10.1115/1.4067775
Published Online: February 28, 2025
View Articletitled, Thomson Effect, Leg Design, Heat Interaction, and Material Impacts on Segmented Thermoelectric Cooler: Insights From Three-Dimensional Simulation
Open the PDF for Thomson Effect, Leg Design, Heat Interaction, and Material Impacts on Segmented Thermoelectric Cooler: Insights From Three-Dimensional Simulation in another window
Topics: Cooling, Heat, Temperature, Thermoelectric coolers, Thermoelectricity, Design, Simulation
Journal Articles

Applications, Design Methods, and Challenges for Additive Manufacturing of Thermal Solutions for Heterogeneous Integration of Electronics

Open Access
Ercan M. Dede, Feng Zhou, Yuqing Zhou, Danny J. Lohan, Mehdi Asheghi, Kenneth E. Goodson, Kris Erickson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2025, 147(2): 021009.
Paper No: EP-24-1066
https://doi.org/10.1115/1.4067649
Published Online: February 20, 2025
View Articletitled, Applications, Design Methods, and Challenges for Additive Manufacturing of Thermal Solutions for Heterogeneous Integration of Electronics
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Topics: Additive manufacturing, Ceramics, Design, Electronics, Heat sinks, Manifolds, Manufacturing, Metals, Polymers, Cooling
Journal Articles

Optimization of Micropillars Electroplating Bonding Processes and Additives

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Qiang Zhang, Changping Chen, Haoze Yang, Jiameng Zhang, Mengtao Xiao, Long Dou, Junhui Li
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2025, 147(2): 021008.
Paper No: EP-24-1086
https://doi.org/10.1115/1.4067651
Published Online: February 4, 2025
View Articletitled, Optimization of Micropillars Electroplating Bonding Processes and Additives
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Topics: Bonding, Convection, Copper, Electroplating, Flow (Dynamics), Current density, Columns (Structural)
Journal Articles

Microbead Encapsulation for Protection of Electronic Components

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Jeffrey R Hill, Alex Chen, Natasha Wilson, Cayden Boll, MeiLi O’Bannon, Dallan Trentman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2025, 147(2): 021007.
Paper No: EP-24-1085
https://doi.org/10.1115/1.4067650
Published Online: February 4, 2025
View Articletitled, Microbead Encapsulation for Protection of Electronic Components
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Topics: Compacting, Electronic components, Epoxy resins, Printed circuit boards, Shock (Mechanics), Surface roughness, Testing, Modeling, Failure, Stress
Journal Articles

Electrochemical Linked to Mechanical Simulation for an Assessment of State-of-Health of Thin-Flexible Li-Ion Batteries on Dynamic Flexing and Calendar Aging

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Pradeep Lall, Hyesoo Jang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2025, 147(2): 021006.
Paper No: EP-24-1003
https://doi.org/10.1115/1.4067266
Published Online: January 23, 2025
View Articletitled, Electrochemical Linked to Mechanical Simulation for an Assessment of State-of-Health of Thin-Flexible Li-Ion Batteries on Dynamic Flexing and Calendar Aging
Open the PDF for Electrochemical Linked to Mechanical Simulation for an Assessment of State-of-Health of Thin-Flexible Li-Ion Batteries on Dynamic Flexing and Calendar Aging in another window
Topics: Batteries, Cycles, Simulation, Stress, Engineering simulation, Lithium-ion batteries, Electrodes
Journal Articles

Performance Analysis of a Brazed Plate Heat Exchanger During Condensation of R1233zd(E)

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R. Khalid, M. McMullen, R. L. Amalfi, A. Ortega, A. P. Wemhoff
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2025, 147(2): 021005.
Paper No: EP-24-1060
https://doi.org/10.1115/1.4067377
Published Online: December 31, 2024
View Articletitled, Performance Analysis of a Brazed Plate Heat Exchanger During Condensation of R1233zd(E)
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Topics: Condensation, Condensers (steam plant), Flow (Dynamics), Fluids, Friction, Heat exchangers, Pressure, Refrigerants, Temperature, Heat transfer
Journal Articles

Wideband Equivalent Circuit Modeling and Parameter Extraction Method for Through Via in Ceramic Package Substrate

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Pan Ren, Chulin Wang, Yaya Liang, Xuan Zhao, Xiaojie Li, Du Pingan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2025, 147(2): 021004.
Paper No: EP-24-1071
https://doi.org/10.1115/1.4067269
Published Online: December 20, 2024
View Articletitled, Wideband Equivalent Circuit Modeling and Parameter Extraction Method for Through Via in Ceramic Package Substrate
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Topics: Capacitance, Ceramics, Circuits, Skin effect
Journal Articles

Understanding the Impact of Data Center Liquid Cooling on Energy and Performance of Machine Learning and Artificial Intelligence Workloads

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Bharath Ramakrishnan, Cam Turner, Husam Alissa, Dennis Trieu, Felipe Rivera, Luke Melton, Muralikrishna Rao, Sruti Chigullapalli, Tatek Getachew, Vladimir Prodanovic, Robert Lankston, Christian Belady, Vaidehi Oruganti
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2025, 147(2): 021003.
Paper No: EP-24-1082
https://doi.org/10.1115/1.4067136
Published Online: December 11, 2024
View Articletitled, Understanding the Impact of Data Center Liquid Cooling on Energy and Performance of Machine Learning and Artificial Intelligence Workloads
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Topics: Artificial intelligence, Cooling, Data centers, Energy consumption, Graphics processing units, Machine learning, Temperature, Stress, Coolants
Journal Articles

Anand Model Constants of Sn–Ag–Cu Solders: What Do They Actually Mean?

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Mohammad A. Gharaibeh, James M. Pitarresi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2025, 147(2): 021001.
Paper No: EP-24-1080
https://doi.org/10.1115/1.4067137
Published Online: December 9, 2024
View Articletitled, Anand Model Constants of Sn–Ag–Cu Solders: What Do They Actually Mean?
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Topics: Deformation, Density, Finite element analysis, Solders, Stress, Thermomechanics, Creep, Simulation, Alloys, Hardening
Journal Articles

Sequential Versus Concurrent Effects in Combined Stress Solder Joint Reliability

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Ekene Gabriel Okafor, Collin Ruby, Mathew Norris, Andrew Leda, David Ryan Huitink
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2025, 147(2): 021002.
Paper No: EP-24-1081
https://doi.org/10.1115/1.4067189
Published Online: December 9, 2024
View Articletitled, Sequential Versus Concurrent Effects in Combined Stress Solder Joint Reliability
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Topics: Current density, Electrodiffusion, Fatigue, Reliability, Solder joints, Stress, Temperature, Spectral energy distribution, Vehicles
Journal Articles

Application of the Nonlinear Fracture Mechanics Parameter Δ T * to Wire-Liftoff Lifetime Estimation of Power Modules at Elevated Temperatures

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Nobuyuki Shishido, Yutaka Hayama, Yuki Akinaga, Shinya Taketomi, Masaaki Koganemaru, Seiya Hagihara, Noriyuki Miyazaki
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2025, 147(1): 011010.
Paper No: EP-24-1039
https://doi.org/10.1115/1.4066100
Published Online: August 24, 2024
View Articletitled, Application of the Nonlinear Fracture Mechanics Parameter Δ T * to Wire-Liftoff Lifetime Estimation of Power Modules at Elevated Temperatures
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Topics: Creep, Cycles, Fatigue, Fracture (Materials), Fracture mechanics, Temperature, Wire, Computational methods, Finite element analysis
Journal Articles

Experimental Method to Measure High-Temperature Hygroscopic Swelling in Epoxy Mold Compounds and Dielectric Build-Up Films

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Ian Chin, Wei Keat Loh, Seow Chien Kee, Yi He, Mohd. Zulkifly Abdullah, Masahiro Tsuriya
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2025, 147(1): 011009.
Paper No: EP-23-1055
https://doi.org/10.1115/1.4066083
Published Online: August 24, 2024
View Articletitled, Experimental Method to Measure High-Temperature Hygroscopic Swelling in Epoxy Mold Compounds and Dielectric Build-Up Films
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Topics: Absorption, Epoxy resins, High temperature, Temperature, Thermal expansion
Journal Articles

Transient Liquid Phase Bond Acceleration Using Copper Nanowires

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John Harris, David Huitink
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2025, 147(1): 011008.
Paper No: EP-24-1038
https://doi.org/10.1115/1.4066042
Published Online: August 17, 2024
View Articletitled, Transient Liquid Phase Bond Acceleration Using Copper Nanowires
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Topics: Copper, Nanowires, Solders, Tension-leg platforms, Transients (Dynamics), Temperature
Journal Articles

Effect of Dispensing Type on Void Formation Using Convolutional Neural Network

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Muhammad Taufik Azahari, Calvin Ling, Aizat Abas, Fei Chong Ng
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2025, 147(1): 011006.
Paper No: EP-23-1004
https://doi.org/10.1115/1.4065078
Published Online: August 9, 2024
View Articletitled, Effect of Dispensing Type on Void Formation Using Convolutional Neural Network
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Topics: Convolutional neural networks, Epoxy adhesives, Epoxy resins, Flip-chip devices, Flip-chip, Flow (Dynamics), Image processing
Journal Articles

Incorporating Tensile Stress Into Electromigration Life Prediction for Cu/SAC305/Cu Solder Joints

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Whit Vinson, David Huitink
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2025, 147(1): 011007.
Paper No: EP-24-1056
https://doi.org/10.1115/1.4066014
Published Online: August 9, 2024
View Articletitled, Incorporating Tensile Stress Into Electromigration Life Prediction for Cu/SAC305/Cu Solder Joints
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Topics: Current density, Electrodiffusion, Failure, Solder joints, Solders, Stress, Temperature, Tension, Testing, Electrons