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Journal Articles

Mixed Convection of Impinging Air Cooling Over Heat Sink in Telecom System Application

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Siddharth Bhopte, Musa S. Alshuqairi, Dereje Agonafer, Fellow ASME, Gamal Refai-Ahmed, Fellow ASME
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 519–523.
https://doi.org/10.1115/1.1827267
Published Online: January 24, 2005
View Article titled, Mixed Convection of Impinging Air Cooling Over Heat Sink in Telecom System Application
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Topics: Heat sinks, Mixed convection, Reynolds number, Nozzles, Cooling, Computer simulation, Heat, Flow (Dynamics), Rayleigh number
Journal Articles

Effect of Underfill Entrapment on the Reliability of Flip-Chip Solder Joint

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Y. C. Chan, M. O. Alam, K. C. Hung, H. Lu, C. Bailey
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 541–545.
https://doi.org/10.1115/1.1756590
Published Online: January 24, 2005
View Article titled, Effect of Underfill Entrapment on the Reliability of Flip-Chip Solder Joint
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Topics: Bonding, Flip-chip, Flip-chip devices, Flow (Dynamics), Reliability, Solder joints, Solders, Modeling
Journal Articles

An Analytical Study of the Optimized Performance of an Impingement Heat Sink

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S. B. Sathe, B. G. Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 528–534.
https://doi.org/10.1115/1.1827269
Published Online: January 24, 2005
View Article titled, An Analytical Study of the Optimized Performance of an Impingement Heat Sink
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Topics: Design, Flow (Dynamics), Heat sinks, Pressure drop, Computation, Heat transfer, Fins
Journal Articles

Evaluation of Thermal Enhancements to Flip-Chip-Plastic Ball Grid Array Packages

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K. Ramakrishna, Fellow ASME,, T.-Y. Tom Lee, Mem. ASME,
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 449–456.
https://doi.org/10.1115/1.1827260
Published Online: January 24, 2005
View Article titled, Evaluation of Thermal Enhancements to Flip-Chip-Plastic Ball Grid Array Packages
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Topics: Flat heat pipes, Forced convection, Mixed convection, Natural convection, Printed circuit boards, Thermal conductivity, Thermal resistance, Heat transfer, Copper, Junctions
Journal Articles

Chimney Effect on Natural Air Cooling of Electronic Equipment Under Inclination

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Yoji Kitamura, Masaru Ishizuka
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 423–428.
https://doi.org/10.1115/1.1827256
Published Online: January 24, 2005
View Article titled, Chimney Effect on Natural Air Cooling of Electronic Equipment Under Inclination
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Topics: Cooling, Electronic equipment, Temperature, Natural convection, Flow (Dynamics), Computer simulation
Journal Articles

Thermal Model of a Thinned-Die Cooling System

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N. Boiadjieva, P. Koev
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 435–439.
https://doi.org/10.1115/1.1826079
Published Online: January 24, 2005
View Article titled, Thermal Model of a Thinned-Die Cooling System
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Topics: Air flow, Cooling systems, Flat heat pipes, Flow (Dynamics), Heat exchangers, Temperature, Cooling, Heat, Silicon
Journal Articles

Design of Cooling Systems for Electronic Equipment Using Both Experimental and Numerical Inputs

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Tunc Icoz, Yogesh Jaluria
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 465–471.
https://doi.org/10.1115/1.1827262
Published Online: January 24, 2005
View Article titled, Design of Cooling Systems for Electronic Equipment Using Both Experimental and Numerical Inputs
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Topics: Computer simulation, Cooling systems, Design, Electronic equipment, Flow (Dynamics), Heat, Temperature, Turbulence, Cooling, Heat transfer
Journal Articles

h adiabatic and u max ′

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Robert J. Moffat
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 501–509.
https://doi.org/10.1115/1.1827265
Published Online: January 24, 2005
View Article titled, h adiabatic and u max ′
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Topics: Computational fluid dynamics, Flow (Dynamics), Heat transfer, Temperature, Turbulence, Heat transfer coefficients, Heat conduction, Heating, Coolants, Computer cooling
Journal Articles

Methodology for an Integrated (Electrical/Mechanical) Design of PWBA

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Wonkee Ahn, Dereje Agonafer, Fellow ASME, Shlomo Novotny, Fellow ASME
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 524–527.
https://doi.org/10.1115/1.1827268
Published Online: January 24, 2005
View Article titled, Methodology for an Integrated (Electrical/Mechanical) Design of PWBA
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Topics: Design, Mechanical computer-aided design, Printed circuit boards, Manufacturing
Journal Articles

Optimal Design for PPF Heat Sinks in Electronics Cooling Applications

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Han-Ting Chen, Jenn-Tsong Horng, Po-Li Chen, Ying-Huei Hung
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 410–422.
https://doi.org/10.1115/1.1826078
Published Online: January 24, 2005
View Article titled, Optimal Design for PPF Heat Sinks in Electronics Cooling Applications
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Topics: Design, Heat sinks, Optimization
Journal Articles

Dynamic Reduced Electrothermal Model for Integrated Power Electronics Modules (IPEM)

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M. Herna´ndez-Mora, J. E. Gonza´lez, M. Ve´lez-Reyes, J. M. Ortiz-Rodrı´guez, Y. Pang, E. Scott
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 477–490.
https://doi.org/10.1115/1.1827264
Published Online: January 24, 2005
View Article titled, Dynamic Reduced Electrothermal Model for Integrated Power Electronics Modules (IPEM)
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Topics: Capacitance, Electronics, Heat transfer, Simulation, Temperature, Thermal analysis, Transients (Dynamics), Computer software, Heat, Design
Journal Articles

Experimental and Numerical Thermal Transient Behavior of Chips in a Liquid Channel During Loss of Pumping Power

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C. P. Tso, K. W. Tou, H. Bhowmik
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 546–553.
https://doi.org/10.1115/1.1827270
Published Online: January 24, 2005
View Article titled, Experimental and Numerical Thermal Transient Behavior of Chips in a Liquid Channel During Loss of Pumping Power
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Topics: Natural convection, Steady state, Transients (Dynamics), Heat, Temperature, Flow (Dynamics), Coolants, Water, Heat transfer, Pumps
Journal Articles

Thermal Performance of Next Generation of Modulated Pump Lasers in Telco Equipment

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Gamal Refai-Ahmed, Fellow ASME, Stephanie Trottier
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 535–540.
https://doi.org/10.1115/1.1773199
Published Online: January 24, 2005
View Article titled, Thermal Performance of Next Generation of Modulated Pump Lasers in Telco Equipment
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Topics: Cycles, Lasers, Pumps, Temperature, Thermal resistance
Journal Articles

Thermal Performance Optimization of Radio Frequency Packages for Wireless Communication

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Victor Adrian Chiriac, Tien-Yu Tom Lee, Vern Hause
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 429–434.
https://doi.org/10.1115/1.1827257
Published Online: January 24, 2005
View Article titled, Thermal Performance Optimization of Radio Frequency Packages for Wireless Communication
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Topics: Heat, Junctions, Optimization, Solders, Temperature, Thermal conductivity, Thermal resistance, Epoxy adhesives, Epoxy resins, Numerical analysis
Journal Articles

Determination of Temperatures and Heat Fluxes on Surfaces and Interfaces of Multidomain Three-Dimensional Electronic Components

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Brian H. Dennis, Zhen-xue Han, George S. Dulikravich
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 457–464.
https://doi.org/10.1115/1.1827261
Published Online: January 24, 2005
View Article titled, Determination of Temperatures and Heat Fluxes on Surfaces and Interfaces of Multidomain Three-Dimensional Electronic Components
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Topics: Ball-Grid-Array packaging, Boundary-value problems, Errors, Flux (Metallurgy), Heat, Heat conduction, Temperature, Temperature distribution, Finite element analysis, Finite element methods
Journal Articles

Development of Compact Models for Electronics Cooling: Using the Multigrid Operator to Generate Reduced-Order Description of Devices

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Prabhu Sathyamurthy, Manoj Nagulapally, Rajesh Nair
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 472–476.
https://doi.org/10.1115/1.1827263
Published Online: January 24, 2005
View Article titled, Development of Compact Models for Electronics Cooling: Using the Multigrid Operator to Generate Reduced-Order Description of Devices
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Topics: Capacitance, Computer cooling, Heat, Junctions, Linear systems, Simulation, Steady state, Temperature, Topology, Transients (Dynamics)
Journal Articles

Impact of TXV and Compressor in the Stability of a High-End Computer Refrigeration System

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Yasin Makwana, Dereje Agonafer, Fellow ASME, Dan Manole
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 554–559.
https://doi.org/10.1115/1.1827272
Published Online: January 24, 2005
View Article titled, Impact of TXV and Compressor in the Stability of a High-End Computer Refrigeration System
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Topics: Compressors, Refrigeration, Temperature, Stress, Computers, Stability, Vapors, Valves
Journal Articles

A New Role of CFD Simulation in Thermal Design of Compact Electronic Equipment: Application of the Build-up Approach to Thermal Analysis of a Benchmark Model

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Wataru Nakayama, Ryuichi Matsuki, Yukari Hacho, Kiyoko Yajima
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 440–448.
https://doi.org/10.1115/1.1827259
Published Online: January 24, 2005
View Article titled, A New Role of CFD Simulation in Thermal Design of Compact Electronic Equipment: Application of the Build-up Approach to Thermal Analysis of a Benchmark Model
Open the PDF for A New Role of CFD Simulation in Thermal Design of Compact Electronic Equipment: Application of the Build-up Approach to Thermal Analysis of a Benchmark Model in another window
Topics: Computational fluid dynamics, Design, Electronic equipment, Simulation, Thermal analysis, Taguchi methods, Temperature, Thermal resistance
Journal Articles

Cluster of High-Powered Racks Within a Raised-Floor Computer Data Center: Effect of Perforated Tile Flow Distribution on Rack Inlet Air Temperatures

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Roger Schmidt, Ethan Cruz
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 510–518.
https://doi.org/10.1115/1.1827266
Published Online: January 24, 2005
View Article titled, Cluster of High-Powered Racks Within a Raised-Floor Computer Data Center: Effect of Perforated Tile Flow Distribution on Rack Inlet Air Temperatures
Open the PDF for Cluster of High-Powered Racks Within a Raised-Floor Computer Data Center: Effect of Perforated Tile Flow Distribution on Rack Inlet Air Temperatures in another window
Topics: Data centers, Flow (Dynamics), Temperature, Tiles, Computers
Journal Articles

The Challenges of Electronic Cooling: Past, Current and Future

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Richard C. Chu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 491–500.
https://doi.org/10.1115/1.1839594
Published Online: January 24, 2005
View Article titled, The Challenges of Electronic Cooling: Past, Current and Future
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Topics: Cooling