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Journal Articles

Accelerated Life Testing (ALT) in Microelectronics and Photonics: Its Role, Attributes, Challenges, Pitfalls, and Interaction With Qualification Tests

E. Suhir

Publisher: ASME

J. Electron. Packag. September 2002, 124(3): 281–291.

https://doi.org/10.1115/1.1486470

Published Online: July 26, 2002

View Articletitled, Accelerated Life Testing (ALT) in Microelectronics and Photonics: Its Role, Attributes, Challenges, Pitfalls, and Interaction With Qualification Tests

Topics: Failure, Failure mechanisms, Lasers, Life testing, Probability, Reliability, Stress, Temperature, Design, Microelectronic devices

Journal Articles

Parametric Design and Reliability Analysis of Wire Interconnect Technology Wafer Level Packaging

Y. T. Lin, Graduate Assistant, C. T. Peng, Graduate Assistant, K. N. Chiang, Associate Professor

Publisher: ASME

J. Electron. Packag. September 2002, 124(3): 234–239.

https://doi.org/10.1115/1.1481368

Published Online: July 26, 2002

View Articletitled, Parametric Design and Reliability Analysis of Wire Interconnect Technology Wafer Level Packaging

Topics: Copper, Event history analysis, Finite element methods, Flip-chip, Packaging, Reliability, Semiconductor wafers, Solders, Wire, Finite element analysis

Journal Articles

Reliability Modeling for Ball Grid Array Assembly With a Large Number of Warpage Affected Solder Joints

Y. W. Chan, T. H. Ju, Saeed A. Hareb, Y. C. Lee, Jih-Shun Wu, Mirng-Ji Lii

Publisher: ASME

J. Electron. Packag. September 2002, 124(3): 246–253.

https://doi.org/10.1115/1.1451844

Published Online: July 26, 2002

View Articletitled, Reliability Modeling for Ball Grid Array Assembly With a Large Number of Warpage Affected Solder Joints

Topics: Manufacturing, Reliability, Shapes, Solder joints, Solders, Warping, Modeling, Ball-Grid-Array packaging, Fatigue life, Cavities

Journal Articles

Damage Accumulation During Stress Relaxation of Polymer Films in Bending

D. Ingman, Y. Michlin

Publisher: ASME

J. Electron. Packag. September 2002, 124(3): 260–265.

https://doi.org/10.1115/1.1463731

Published Online: July 26, 2002

View Articletitled, Damage Accumulation During Stress Relaxation of Polymer Films in Bending

Topics: Damage, Relaxation (Physics), Stress, Strips, Deformation, Polymer films

Journal Articles

Reliability of Anisotropically Conductive Adhesive Joints on a Flip-Chip/FR-4 Substrate

Johan Liu, Zonghe Lai

Publisher: ASME

J. Electron. Packag. September 2002, 124(3): 240–245.

https://doi.org/10.1115/1.1478059

Published Online: July 26, 2002

View Articletitled, Reliability of Anisotropically Conductive Adhesive Joints on a Flip-Chip/FR-4 Substrate

Topics: Adhesive joints, Adhesives, Contact resistance, Cycles, Failure, Flip-chip, Reliability, Temperature, Testing, Electrical resistance

Journal Articles

Thermomechanical Durability of High I/O BGA Packages

P. Davuluri, S. Shetty, A. Dasgupta, S. Young

Publisher: ASME

J. Electron. Packag. September 2002, 124(3): 266–270.

https://doi.org/10.1115/1.1477192

Published Online: July 26, 2002

View Articletitled, Thermomechanical Durability of High I/O BGA Packages

Topics: Ball-Grid-Array packages, Cycles, Durability, Failure, Modeling, Solder joints, Solders, Stress, Stress analysis (Engineering), Thermomechanics

Journal Articles

High Cycle Fatigue Resistance and Reliability Assessment of Flexible Printed Circuitry

Elena Martynenko, Wen Zhou, Alexander Chudnovsky, Ron S. Li, Larry Poglitsch

Publisher: ASME

J. Electron. Packag. September 2002, 124(3): 254–259.

https://doi.org/10.1115/1.1462628

Published Online: July 26, 2002

View Articletitled, High Cycle Fatigue Resistance and Reliability Assessment of Flexible Printed Circuitry

Topics: Displacement, Failure, Fatigue, Fracture (Materials), High cycle fatigue, Reliability, Stress, Temperature, Circuits, Testing

Journal Articles

Evaluation and Improvement of the Adhesive Fracture Toughness of CVD Diamond on Silicon Substrate

Shoji Kamiya, Hironori Takahashi, Masumi Saka, Hiroyuki Abe´

Publisher: ASME

J. Electron. Packag. September 2002, 124(3): 271–276.

https://doi.org/10.1115/1.1481374

Published Online: July 26, 2002

View Articletitled, Evaluation and Improvement of the Adhesive Fracture Toughness of CVD Diamond on Silicon Substrate

Topics: Adhesives, Diamonds, Fracture toughness, Methane, Particulate matter, Silicon, Synthetic diamonds, Fracture (Materials), Graphite

Journal Articles

Micro-Mechanics of Creep-Fatigue Damage in PB-SN Solder Due to Thermal Cycling—Part II: Mechanistic Insights and Cyclic Durability Predictions From Monotonic Data

Pradeep Sharma, Abhijit Dasgupta

Publisher: ASME

J. Electron. Packag. September 2002, 124(3): 298–304.

https://doi.org/10.1115/1.1493203

Published Online: July 26, 2002

View Articletitled, Micro-Mechanics of Creep-Fatigue Damage in PB-SN Solder Due to Thermal Cycling—Part II: Mechanistic Insights and Cyclic Durability Predictions From Monotonic Data

Topics: Creep, Cycles, Damage, Durability, Failure, Fatigue, Grain size, Hydrostatics, Micromechanics (Engineering), Solders

Journal Articles

Validation of Electronic Package Reliability Using Speckle Interferometry

H.-Y. Yeh, K. Cote

Publisher: ASME

J. Electron. Packag. September 2002, 124(3): 277–280.

https://doi.org/10.1115/1.1478060

Published Online: July 26, 2002

View Articletitled, Validation of Electronic Package Reliability Using Speckle Interferometry

Topics: Creep, Displacement measurement, Electronic packages, Electronic speckle pattern interferometry, Interferometry, Reliability, Thermal expansion, Solder joints, Temperature, Cycles

Journal Articles

Micro-Mechanics of Creep-Fatigue Damage in PB-SN Solder Due to Thermal Cycling—Part I: Formulation

Pradeep Sharma, Abhijit Dasgupta

Publisher: ASME

J. Electron. Packag. September 2002, 124(3): 292–297.

https://doi.org/10.1115/1.1493202

Published Online: July 26, 2002

View Articletitled, Micro-Mechanics of Creep-Fatigue Damage in PB-SN Solder Due to Thermal Cycling—Part I: Formulation

Topics: Creep, Damage, Fatigue, Grain boundaries, Nucleation (Physics), Solders, Stress, Particulate matter, Micromechanics (Engineering)

Journal Articles

Interfacial Versus Cohesive Failure on Polymer-Metal Interfaces in Electronic Packaging—Effects of Interface Roughness

Qizhou Yao, Jianmin Qu

Publisher: ASME

J. Electron. Packag. June 2002, 124(2): 127–134.

https://doi.org/10.1115/1.1459470

Published Online: May 2, 2002

View Articletitled, Interfacial Versus Cohesive Failure on Polymer-Metal Interfaces in Electronic Packaging—Effects of Interface Roughness

Topics: Adhesion, Electronic packaging, Failure, Fracture (Materials), Metals, Polymers, Surface roughness, Interface roughness, Aluminum, Fracture mechanics

Journal Articles

Thermomechanical Analysis of Solder Joints Under Thermal and Vibrational Loading

Cemal Basaran, Assoc. Prof., and Director,, Rumpa Chandaroy, Staff Consultant,

Publisher: ASME

J. Electron. Packag. March 2002, 124(1): 60–66.

https://doi.org/10.1115/1.1400752

Published Online: March 15, 2001

View Articletitled, Thermomechanical Analysis of Solder Joints Under Thermal and Vibrational Loading

Topics: Constitutive equations, Damage, Fatigue life, Solder joints, Stress, Thermomechanics, Vibration, Finite element analysis, Reliability, Thermal expansion

Journal Articles

A Nested Finite Element Methodology (NFEM) for Stress Analysis of Electronic Products—Part I: Theory and Formulation

Krishna Darbha, Abhijit Dasgupta, Professor

Publisher: ASME

J. Electron. Packag. June 2001, 123(2): 141–146.

https://doi.org/10.1115/1.1328744

Published Online: October 10, 2000

View Articletitled, A Nested Finite Element Methodology (NFEM) for Stress Analysis of Electronic Products—Part I: Theory and Formulation

Topics: Displacement, Finite element analysis, Potential energy, Stress, Stress analysis (Engineering), Creep, Thermomechanics, Electronic products

Journal Articles

A Nested Finite Element Methodology (NFEM) for Stress Analysis of Electronic Products—Part II: Durability Analysis of Flip Chip and Chip Scale Interconnects

Krishna Darbha, Abhijit Dasgupta, Professor

Publisher: ASME

J. Electron. Packag. June 2001, 123(2): 147–155.

https://doi.org/10.1115/1.1328745

Published Online: October 10, 2000

View Articletitled, A Nested Finite Element Methodology (NFEM) for Stress Analysis of Electronic Products—Part II: Durability Analysis of Flip Chip and Chip Scale Interconnects

Topics: Ball-Grid-Array packaging, Creep, Finite element analysis, Flip-chip devices, Manufacturing, Solders, Stress, Stress analysis (Engineering), Durability, Temperature

Journal Articles

Development of Reliability and Moldability on Fine Pitch Ball Grid Array by Optimizing Materials

Takashi Aihara, Shingo Ito, Hideaki Sasajima, Ken Oota

Publisher: ASME

J. Electron. Packag. March 2001, 123(1): 88–94.

https://doi.org/10.1115/1.1329129

Published Online: August 8, 2000

View Articletitled, Development of Reliability and Moldability on Fine Pitch Ball Grid Array by Optimizing Materials

Topics: Ball-Grid-Array packaging, Fracture (Materials), Molding, Solders, Warping, Insulation, Reliability, Fillers (Materials)

Journal Articles

Interfacial Delamination Near Solder Bumps and UBM in Flip-Chip Packages

Yu Gu, Toshio Nakamura, Mem. ASME, William T. Chen, Brian Cotterell

Publisher: ASME

J. Electron. Packag. September 2001, 123(3): 295–301.

https://doi.org/10.1115/1.1348338

Published Online: August 1, 2000

View Articletitled, Interfacial Delamination Near Solder Bumps and UBM in Flip-Chip Packages

Topics: Delamination, Fracture (Materials), Solders, Stress, Fracture (Process), Flip-chip packages, Finite element analysis

Journal Articles

Autoclave Reliability of MEMS Pressure and Temperature Sensors Embedded in Carbon Fiber Composites

Amir Javidinejad, Shiv P. Joshi

Publisher: ASME

J. Electron. Packag. March 2001, 123(1): 79–82.

https://doi.org/10.1115/1.1322563

Published Online: May 26, 2000

View Articletitled, Autoclave Reliability of MEMS Pressure and Temperature Sensors Embedded in Carbon Fiber Composites

Topics: Composite materials, Pressure, Pressure sensors, Sensors, Temperature sensors, Carbon fibers, Microelectromechanical systems, Reliability, Cycles

Journal Articles

Thermal and Mechanical Loading Effects on the Reliability of Organic Flip Chip Package

Teck Joo Goh

Publisher: ASME

J. Electron. Packag. March 2001, 123(1): 83–87.

https://doi.org/10.1115/1.1289999

Published Online: April 10, 2000

View Articletitled, Thermal and Mechanical Loading Effects on the Reliability of Organic Flip Chip Package

Topics: Design, Finite element analysis, Finite element model, Flip-chip, Flip-chip devices, Flip-chip packages, Heat sinks, Reliability, Stress, Silicon

Journal Articles

Fatigue of Chip Scale Package Interconnects Due to Cyclic Bending

S. Shetty, V. Lehtinen, A. Dasgupta, V. Halkola, T. Reinikainen

Publisher: ASME

J. Electron. Packag. September 2001, 123(3): 302–308.

https://doi.org/10.1115/1.1362673

Published Online: March 25, 2000

View Articletitled, Fatigue of Chip Scale Package Interconnects Due to Cyclic Bending

Topics: Cycles, Failure, Fatigue, Fatigue testing, Finite element analysis, Solder joints, Stress, Durability, Fatigue life

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Accelerated Life Testing (ALT) in Microelectronics and Photonics: Its Role, Attributes, Challenges, Pitfalls, and Interaction With Qualification Tests

Parametric Design and Reliability Analysis of Wire Interconnect Technology Wafer Level Packaging

Reliability Modeling for Ball Grid Array Assembly With a Large Number of Warpage Affected Solder Joints

Damage Accumulation During Stress Relaxation of Polymer Films in Bending

Reliability of Anisotropically Conductive Adhesive Joints on a Flip-Chip/FR-4 Substrate

Thermomechanical Durability of High I/O BGA Packages

High Cycle Fatigue Resistance and Reliability Assessment of Flexible Printed Circuitry

Evaluation and Improvement of the Adhesive Fracture Toughness of CVD Diamond on Silicon Substrate

Micro-Mechanics of Creep-Fatigue Damage in PB-SN Solder Due to Thermal Cycling—Part II: Mechanistic Insights and Cyclic Durability Predictions From Monotonic Data

Validation of Electronic Package Reliability Using Speckle Interferometry

Micro-Mechanics of Creep-Fatigue Damage in PB-SN Solder Due to Thermal Cycling—Part I: Formulation

Interfacial Versus Cohesive Failure on Polymer-Metal Interfaces in Electronic Packaging—Effects of Interface Roughness

Thermomechanical Analysis of Solder Joints Under Thermal and Vibrational Loading

A Nested Finite Element Methodology (NFEM) for Stress Analysis of Electronic Products—Part I: Theory and Formulation

A Nested Finite Element Methodology (NFEM) for Stress Analysis of Electronic Products—Part II: Durability Analysis of Flip Chip and Chip Scale Interconnects

Development of Reliability and Moldability on Fine Pitch Ball Grid Array by Optimizing Materials

Interfacial Delamination Near Solder Bumps and UBM in Flip-Chip Packages

Autoclave Reliability of MEMS Pressure and Temperature Sensors Embedded in Carbon Fiber Composites

Thermal and Mechanical Loading Effects on the Reliability of Organic Flip Chip Package

Fatigue of Chip Scale Package Interconnects Due to Cyclic Bending

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