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Journal Articles

Rapid Anneal-Free Welding of Cu Nanowires Network by Ultraviolet Light Irradiation for Transparent Electrodes in Optoelectronic Applications

Jun Wang, Yang Zhao, Han Chen, Yan Tang, Guozhen Liu, Renli Liang, Jiangnan Dai, Changqing Chen, Junyong Kang, Duanjun Cai
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031102.
Paper No: EP-19-1120
https://doi.org/10.1115/1.4046764
Published Online: April 17, 2020
View Article titled, Rapid Anneal-Free Welding of Cu Nanowires Network by Ultraviolet Light Irradiation for Transparent Electrodes in Optoelectronic Applications
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Topics: Electrodes, Irradiation (Radiation exposure), Nanowires, Transparency, Ultraviolet radiation, Light-emitting diodes, Welding
Journal Articles

Investigation on Laser Direct Welding of Quad Flat Pack Components

Jianwen Yuan, Chao Huang, Jimin Chen, Furong Liu, Yi Qiu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2013, 135(4): 044501.
Paper No: EP-13-1024
https://doi.org/10.1115/1.4025251
Published Online: September 6, 2013
View Article titled, Investigation on Laser Direct Welding of Quad Flat Pack Components
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Topics: Lasers, Temperature, Tensile strength, Welding, Solders, Laser welding, Tin
Journal Articles

Thermal Stresses Due to Laser Welding in Bridge-Wire Initiators

Michael R. Maughan, Robert R. Stephens, Donald M. Blackketter, Karl K. Rink
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011009.
https://doi.org/10.1115/1.3068318
Published Online: February 13, 2009
View Article titled, Thermal Stresses Due to Laser Welding in Bridge-Wire Initiators
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Topics: Finite element analysis, Glass, Press fits, Shear stress, Stress, Thermal stresses, Welding, Wire, Bridges (Structures), Laser welding
Journal Articles

Moire´ Interferometry Analysis of Laser Weld Induced Thermal Strain

V. T. Kowalski, A. S. Voloshin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1994, 116(3): 177–183.
https://doi.org/10.1115/1.2905683
Published Online: September 1, 1994
View Article titled, Moire´ Interferometry Analysis of Laser Weld Induced Thermal Strain
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Topics: Interferometry, Lasers, Welded joints, Diffraction gratings, Image processing, Manufacturing, Plates (structures), Separation (Technology), Thermal stresses, Welding
Journal Articles

A Study of Forces and Motion Generated During Pulsed Laser Welding of Optical Packages

S. Rangwala
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1991, 113(4): 343–349.
https://doi.org/10.1115/1.2905418
Published Online: December 1, 1991
View Article titled, A Study of Forces and Motion Generated During Pulsed Laser Welding of Optical Packages
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Topics: Laser welding, Lasers, Cooling, Dynamics (Mechanics), Laser beams, Manufacturing, Shrinkage (Materials), Thermal stresses, Waves, Welding