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Journal Articles

Experimental Investigation of Boiling Heat Transfer in a Liquid Chamber With Partially Soluble Nanofluids

Noriyuki Unno, Kazuhisa Yuki, Risako Kibushi, Atsuyuki Mitani

J. Electron. Packag. March 2023, 145(1): 011104.

Paper No: EP-22-1019

DOI: https://doi.org/10.1115/1.4055841

Published Online: October 22, 2022

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Topics: Boiling, Critical heat flux, Heat flux, Heat transfer, Nanofluids, Water, Thermal resistance, Aluminum, Wall temperature, Temperature

Journal Articles

Parametric Effects on Pool Boiling Heat Transfer and Critical Heat Flux: A Critical Review

Tolga Emir, Hamza Ourabi, Mete Budakli, Mehmet Arik

J. Electron. Packag. December 2022, 144(4): 040801.

Paper No: EP-21-1129

DOI: https://doi.org/10.1115/1.4054184

Published Online: April 28, 2022

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Topics: Boiling, Bubbles, Critical heat flux, Heat transfer, Pool boiling, Pressure, Nucleation (Physics), Fluids, Water, Heat

Journal Articles

Ultra-Compact Microscale Heat Exchanger for Advanced Thermal Management in Data Centers

Raffaele L. Amalfi, Todd Salamon, Filippo Cataldo, Jackson B. Marcinichen, John R. Thome

J. Electron. Packag. June 2022, 144(2): 021110.

Paper No: EP-21-1048

DOI: https://doi.org/10.1115/1.4052767

Published Online: November 22, 2021

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Topics: Condensers (steam plant), Cooling, Flow (Dynamics), Heat, Heat exchangers, Refrigerants, Stress, Temperature, Pressure drop, Test facilities

Journal Articles

A Smart Temperature-Regulating Garment for Portable, High-Efficiency and Comfortable Cooling

Weicheng Shu, Xinfeng Zhang, Xuan Yang, Xiaobing Luo

J. Electron. Packag. September 2022, 144(3): 031010.

Paper No: EP-21-1079

DOI: https://doi.org/10.1115/1.4051754

Published Online: September 15, 2021

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Topics: Cooling, Temperature, Temperature control, Water, Water temperature, Weight (Mass)

Includes: Supplementary data

Journal Articles

A New Correlation for Subcooled Flow Boiling Heat Transfer in a Vertical Narrow Microchannel

Zengchao Chen, Wei Li, Junye Li, Kan Zhou, Zhaozan Feng

J. Electron. Packag. March 2021, 143(1): 014501.

Paper No: EP-19-1083

DOI: https://doi.org/10.1115/1.4046755

Published Online: June 4, 2020

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Topics: Boiling, Flow (Dynamics), Fluids, Heat transfer, Microchannels, Subcooling, Water

Journal Articles

An Overview of Thermal and Mechanical Design, Control, and Testing of the World's Most Powerful and Fastest Supercomputer

Anil Yuksel, Vic Mahaney, Chris Marroquin, Shurong Tian, Mark Hoffmeyer, Mark Schultz, Todd Takken

J. Electron. Packag. March 2021, 143(1): 011005.

Paper No: EP-19-1099

DOI: https://doi.org/10.1115/1.4046847

Published Online: June 4, 2020

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Topics: Design, Graphics processing units, Manufacturing, Water, Flow (Dynamics), Testing, Cooling

Journal Articles

A Novel Activated Carbon Enabled Steam Generation System Under Simulated Solar Light

Ashreet Mishra, Agwu A. G. Nnanna

J. Electron. Packag. September 2019, 141(3): 031015.

Paper No: EP-18-1090

DOI: https://doi.org/10.1115/1.4044716

Published Online: September 24, 2019

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Topics: Activated carbon, Evaporation, Nanofluids, Nanoparticles, Steam, Sunlight, Water, Solar energy

Journal Articles

Thermal Analysis of Cold Plate for Direct Liquid Cooling of High Performance Servers

Bharath Ramakrishnan, Yaser Hadad, Sami Alkharabsheh, Paul R. Chiarot, Bahgat Sammakia

J. Electron. Packag. December 2019, 141(4): 041005.

Paper No: EP-18-1069

DOI: https://doi.org/10.1115/1.4044130

Published Online: July 12, 2019

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Topics: Computer simulation, Coolants, Cooling, Flow (Dynamics), Pressure drop, Temperature, Thermal resistance, Heat, Heat transfer coefficients, Heat transfer

Journal Articles

Characterization of Hybrid Wicking Structures for Flexible Vapor Chambers

Dylan P. McNally, Ryan Lewis, Y. C. Lee

J. Electron. Packag. March 2019, 141(1): 011005.

Paper No: EP-18-1064

DOI: https://doi.org/10.1115/1.4042255

Published Online: February 25, 2019

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Topics: Columns (Structural), Flow (Dynamics), Permeability, Pressure, Vapors, Testing, Copper, Water

Journal Articles

Experimental Investigation of Embedded Micropin-Fins for Single-Phase Heat Transfer and Pressure Drop

Chirag R. Kharangate, Ki Wook Jung, Sangwoo Jung, Daeyoung Kong, Joseph Schaadt, Madhusudan Iyengar, Chris Malone, Hyoungsoon Lee, Mehdi Asheghi, Kenneth E. Goodson

J. Electron. Packag. June 2018, 140(2): 021001.

Paper No: EP-17-1126

DOI: https://doi.org/10.1115/1.4039475

Published Online: May 9, 2018

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Topics: Fins, Flow (Dynamics), Fluids, Friction, Heat transfer, Pressure drop, Reynolds number, Water, Heat, Temperature

Journal Articles

Display Light Guide Swelling Due to Moisture Absorption

A. K. Cousins, G. H. Thiel, E. Wolak, G. Limaye, S. Tiku

J. Electron. Packag. December 2017, 139(4): 041006.

Paper No: EP-17-1070

DOI: https://doi.org/10.1115/1.4037971

Published Online: October 5, 2017

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Topics: Absorption, Diffusion (Physics), Water, Water absorption, Polymers

Journal Articles

Heat Transfer in Liquid–Liquid Taylor Flow in Miniscale Curved Tubing for Constant Wall Temperature

Wesam Adrugi, Yuri Muzychka, Kevin Pope

J. Electron. Packag. June 2017, 139(2): 020909.

Paper No: EP-16-1141

DOI: https://doi.org/10.1115/1.4036405

Published Online: June 12, 2017

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Topics: Flow (Dynamics), Heat transfer, Tubing, Water, Wall temperature

Journal Articles

Moisture Ingress, Behavior, and Prediction Inside Semiconductor Packaging: A Review

Bongtae Han, Dae-Suk Kim

J. Electron. Packag. March 2017, 139(1): 010802.

Paper No: EP-16-1107

DOI: https://doi.org/10.1115/1.4035598

Published Online: January 16, 2017

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Topics: Diffusion (Physics), Polymers, Temperature, Cavities, Semiconductors (Materials), Packaging, Water, Vapor pressure

Journal Articles

Flexible Thermal Ground Planes Fabricated With Printed Circuit Board Technology

Li-Anne Liew, Ching-Yi Lin, Ryan Lewis, Susan Song, Qian Li, Ronggui Yang, Y. C. Lee

J. Electron. Packag. March 2017, 139(1): 011003.

Paper No: EP-16-1103

DOI: https://doi.org/10.1115/1.4035241

Published Online: December 7, 2016

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Topics: Copper, Heat, Manufacturing, Printed circuit boards, Vapors, Water, Nylon fabrics, Condensers (steam plant), Thermal resistance

Journal Articles

Flow Boiling in Microgaps for Thermal Management of High Heat Flux Microsystems

Xuefei Han, Andrei Fedorov, Yogendra Joshi

J. Electron. Packag. December 2016, 138(4): 040801.

Paper No: EP-16-1013

DOI: https://doi.org/10.1115/1.4034317

Published Online: August 24, 2016

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Topics: Boiling, Flow (Dynamics), Heat flux, Water, Temperature, Pressure, Heat transfer coefficients, Heat sinks

Journal Articles

Numerical and Experimental Investigation of Shell-and-Tube Phase-Change Material Thermal Energy Storage Unit

Thomas H. Sherer, II, Yogendra Joshi

J. Electron. Packag. September 2016, 138(3): 031008.

Paper No: EP-16-1014

DOI: https://doi.org/10.1115/1.4034101

Published Online: July 28, 2016

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Topics: Data centers, Flow (Dynamics), Temperature, Water, Computer simulation, Shells, Temperature profiles, Phase change materials, Cooling, Thermal energy storage

Journal Articles

Microfeature Heat Exchanger Using Variable-Density Arrays for Near-Isothermal Cold-Plate Operation

Noris Gallandat, Danielle Hesse, J. Rhett Mayor

J. Electron. Packag. March 2016, 138(1): 010908.

Paper No: EP-15-1096

DOI: https://doi.org/10.1115/1.4032347

Published Online: March 10, 2016

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Topics: Convection, Density, Flow (Dynamics), Heat, Heat exchangers, Heat transfer, Hydrofoil, Pressure drop, Temperature, Water

Journal Articles

Three-Dimensional Integrated Circuit With Embedded Microfluidic Cooling: Technology, Thermal Performance, and Electrical Implications

Xuchen Zhang, Xuefei Han, Thomas E. Sarvey, Craig E. Green, Peter A. Kottke, Andrei G. Fedorov, Yogendra Joshi, Muhannad S. Bakir

J. Electron. Packag. March 2016, 138(1): 010910.

Paper No: EP-15-1107

DOI: https://doi.org/10.1115/1.4032496

Published Online: March 10, 2016

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Topics: Cooling, Design, Fins, Flow (Dynamics), Heat flux, Heat sinks, Heat transfer coefficients, Microfluidics, Temperature, Testing

Journal Articles

A Holistic Evaluation of Data Center Water Cooling Total Cost of Ownership

Dustin W. Demetriou, Vinod Kamath, Howard Mahaney

J. Electron. Packag. March 2016, 138(1): 010912.

Paper No: EP-15-1100

DOI: https://doi.org/10.1115/1.4032494

Published Online: March 10, 2016

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Topics: Cooling, Data centers, Hardware, Water

Journal Articles

Thermal Modeling of Microfluidic Channels for Cooling High Power Resistors on Multilayer Organic Liquid Crystal Polymer Substrate

Outmane Lemtiri Chlieh, Wasif T. Khan, John Papapolymerou

J. Electron. Packag. September 2015, 137(3): 031009.

Paper No: EP-14-1104

DOI: https://doi.org/10.1115/1.4030643

Published Online: September 1, 2015

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Topics: Cooling, Flow (Dynamics), Heat, Manufacturing, Microchannels, Microfluidics, Resistors, Temperature, Thermal resistance, Water

Journal citation

NARROW

Supplemental Material

Experimental Investigation of Boiling Heat Transfer in a Liquid Chamber With Partially Soluble Nanofluids

Parametric Effects on Pool Boiling Heat Transfer and Critical Heat Flux: A Critical Review

Ultra-Compact Microscale Heat Exchanger for Advanced Thermal Management in Data Centers

A Smart Temperature-Regulating Garment for Portable, High-Efficiency and Comfortable Cooling

A New Correlation for Subcooled Flow Boiling Heat Transfer in a Vertical Narrow Microchannel

An Overview of Thermal and Mechanical Design, Control, and Testing of the World's Most Powerful and Fastest Supercomputer

A Novel Activated Carbon Enabled Steam Generation System Under Simulated Solar Light

Thermal Analysis of Cold Plate for Direct Liquid Cooling of High Performance Servers

Characterization of Hybrid Wicking Structures for Flexible Vapor Chambers

Experimental Investigation of Embedded Micropin-Fins for Single-Phase Heat Transfer and Pressure Drop

Display Light Guide Swelling Due to Moisture Absorption

Heat Transfer in Liquid–Liquid Taylor Flow in Miniscale Curved Tubing for Constant Wall Temperature

Moisture Ingress, Behavior, and Prediction Inside Semiconductor Packaging: A Review

Flexible Thermal Ground Planes Fabricated With Printed Circuit Board Technology

Flow Boiling in Microgaps for Thermal Management of High Heat Flux Microsystems

Numerical and Experimental Investigation of Shell-and-Tube Phase-Change Material Thermal Energy Storage Unit

Microfeature Heat Exchanger Using Variable-Density Arrays for Near-Isothermal Cold-Plate Operation

Three-Dimensional Integrated Circuit With Embedded Microfluidic Cooling: Technology, Thermal Performance, and Electrical Implications

A Holistic Evaluation of Data Center Water Cooling Total Cost of Ownership

Thermal Modeling of Microfluidic Channels for Cooling High Power Resistors on Multilayer Organic Liquid Crystal Polymer Substrate

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