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Journal Articles

Performance Analysis of a Brazed Plate Heat Exchanger During Condensation of R1233zd(E)

Available to Purchase
R. Khalid, M. McMullen, R. L. Amalfi, A. Ortega, A. P. Wemhoff
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2025, 147(2): 021005.
Paper No: EP-24-1060
https://doi.org/10.1115/1.4067377
Published Online: December 31, 2024
View Articletitled, Performance Analysis of a Brazed Plate Heat Exchanger During Condensation of R1233zd(E)
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Topics: Condensation, Condensers (steam plant), Flow (Dynamics), Fluids, Friction, Heat exchangers, Pressure, Refrigerants, Temperature, Heat transfer
Journal Articles

Reliability Assessment and Multiphysics Simulation of Additively Printed Wearable Humidity Sensor With Supercapacitive Material for Astronaut in Extreme Condition

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Pradeep Lall, Hyesoo Jang, Curtis Hill
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041114.
Paper No: EP-24-1002
https://doi.org/10.1115/1.4065940
Published Online: August 17, 2024
View Articletitled, Reliability Assessment and Multiphysics Simulation of Additively Printed Wearable Humidity Sensor With Supercapacitive Material for Astronaut in Extreme Condition
Open the PDF for Reliability Assessment and Multiphysics Simulation of Additively Printed Wearable Humidity Sensor With Supercapacitive Material for Astronaut in Extreme Condition in another window
Topics: Capacitance, Sensors, Temperature, Water, Simulation, Reliability, Printing
Journal Articles

Process Recipe and Functional Circuitry Performance on Aerosol Jet Printed Water-Based Silver Ink

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Pradeep Lall, Sabina Bimali, Scott Miller
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041116.
Paper No: EP-24-1029
https://doi.org/10.1115/1.4066041
Published Online: August 17, 2024
View Articletitled, Process Recipe and Functional Circuitry Performance on Aerosol Jet Printed Water-Based Silver Ink
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Topics: Circuits, Design, Inks, Printing, Shear (Mechanics), Silver, Sintering, Aerosols, Stress, Water
Journal Articles

Characterization of a Rack-Level Thermosyphon-Based Cooling System

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R. Khalid, S. G. Schon, R. L. Amalfi, A. Ortega, A. P. Wemhoff
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2024, 146(3): 031007.
Paper No: EP-23-1068
https://doi.org/10.1115/1.4064524
Published Online: March 11, 2024
View Articletitled, Characterization of a Rack-Level Thermosyphon-Based Cooling System
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Topics: Condensers (steam plant), Cooling, Cooling systems, Data centers, Fluids, Heat, Heat recovery, Refrigerants, Stress, Temperature
Journal Articles

Experimental Investigation of Boiling Heat Transfer in a Liquid Chamber With Partially Soluble Nanofluids

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Noriyuki Unno, Kazuhisa Yuki, Risako Kibushi, Atsuyuki Mitani
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011104.
Paper No: EP-22-1019
https://doi.org/10.1115/1.4055841
Published Online: October 22, 2022
View Articletitled, Experimental Investigation of Boiling Heat Transfer in a Liquid Chamber With Partially Soluble Nanofluids
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Topics: Boiling, Critical heat flux, Heat flux, Heat transfer, Nanofluids, Water, Thermal resistance, Aluminum, Wall temperature, Temperature
Journal Articles

Parametric Effects on Pool Boiling Heat Transfer and Critical Heat Flux: A Critical Review

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Tolga Emir, Hamza Ourabi, Mete Budakli, Mehmet Arik
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. December 2022, 144(4): 040801.
Paper No: EP-21-1129
https://doi.org/10.1115/1.4054184
Published Online: April 28, 2022
View Articletitled, Parametric Effects on Pool Boiling Heat Transfer and Critical Heat Flux: A Critical Review
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Topics: Boiling, Bubbles, Critical heat flux, Heat transfer, Pool boiling, Pressure, Nucleation (Physics), Fluids, Water, Heat
Journal Articles

Ultra-Compact Microscale Heat Exchanger for Advanced Thermal Management in Data Centers

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Raffaele L. Amalfi, Todd Salamon, Filippo Cataldo, Jackson B. Marcinichen, John R. Thome
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021110.
Paper No: EP-21-1048
https://doi.org/10.1115/1.4052767
Published Online: November 22, 2021
View Articletitled, Ultra-Compact Microscale Heat Exchanger for Advanced Thermal Management in Data Centers
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Topics: Condensers (steam plant), Cooling, Flow (Dynamics), Heat, Heat exchangers, Refrigerants, Stress, Temperature, Pressure drop, Test facilities
Journal Articles

A Smart Temperature-Regulating Garment for Portable, High-Efficiency and Comfortable Cooling

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Weicheng Shu, Xinfeng Zhang, Xuan Yang, Xiaobing Luo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031010.
Paper No: EP-21-1079
https://doi.org/10.1115/1.4051754
Published Online: September 15, 2021
View Articletitled, A Smart Temperature-Regulating Garment for Portable, High-Efficiency and Comfortable Cooling
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Topics: Cooling, Temperature, Temperature control, Water, Water temperature, Weight (Mass)
Includes: Supplementary data
Journal Articles

An Overview of Thermal and Mechanical Design, Control, and Testing of the World's Most Powerful and Fastest Supercomputer

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Anil Yuksel, Vic Mahaney, Chris Marroquin, Shurong Tian, Mark Hoffmeyer, Mark Schultz, Todd Takken
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2021, 143(1): 011005.
Paper No: EP-19-1099
https://doi.org/10.1115/1.4046847
Published Online: June 4, 2020
View Articletitled, An Overview of Thermal and Mechanical Design, Control, and Testing of the World's Most Powerful and Fastest Supercomputer
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Topics: Design, Graphics processing units, Manufacturing, Water, Flow (Dynamics), Testing, Cooling
Journal Articles

A New Correlation for Subcooled Flow Boiling Heat Transfer in a Vertical Narrow Microchannel

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Zengchao Chen, Wei Li, Junye Li, Kan Zhou, Zhaozan Feng
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2021, 143(1): 014501.
Paper No: EP-19-1083
https://doi.org/10.1115/1.4046755
Published Online: June 4, 2020
View Articletitled, A New Correlation for Subcooled Flow Boiling Heat Transfer in a Vertical Narrow Microchannel
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Topics: Boiling, Flow (Dynamics), Fluids, Heat transfer, Microchannels, Subcooling, Water
Journal Articles

A Novel Activated Carbon Enabled Steam Generation System Under Simulated Solar Light

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Ashreet Mishra, Agwu A. G. Nnanna
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2019, 141(3): 031015.
Paper No: EP-18-1090
https://doi.org/10.1115/1.4044716
Published Online: September 24, 2019
View Articletitled, A Novel Activated Carbon Enabled Steam Generation System Under Simulated Solar Light
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Topics: Activated carbon, Evaporation, Nanofluids, Nanoparticles, Steam, Sunlight, Water, Solar energy
Journal Articles

Thermal Analysis of Cold Plate for Direct Liquid Cooling of High Performance Servers

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Bharath Ramakrishnan, Yaser Hadad, Sami Alkharabsheh, Paul R. Chiarot, Bahgat Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2019, 141(4): 041005.
Paper No: EP-18-1069
https://doi.org/10.1115/1.4044130
Published Online: July 12, 2019
View Articletitled, Thermal Analysis of Cold Plate for Direct Liquid Cooling of High Performance Servers
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Topics: Computer simulation, Coolants, Cooling, Flow (Dynamics), Pressure drop, Temperature, Thermal resistance, Heat, Heat transfer coefficients, Heat transfer
Journal Articles

Characterization of Hybrid Wicking Structures for Flexible Vapor Chambers

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Dylan P. McNally, Ryan Lewis, Y. C. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2019, 141(1): 011005.
Paper No: EP-18-1064
https://doi.org/10.1115/1.4042255
Published Online: February 25, 2019
View Articletitled, Characterization of Hybrid Wicking Structures for Flexible Vapor Chambers
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Topics: Columns (Structural), Flow (Dynamics), Permeability, Pressure, Vapors, Testing, Copper, Water
Journal Articles

Experimental Investigation of Embedded Micropin-Fins for Single-Phase Heat Transfer and Pressure Drop

Open Access
Chirag R. Kharangate, Ki Wook Jung, Sangwoo Jung, Daeyoung Kong, Joseph Schaadt, Madhusudan Iyengar, Chris Malone, Hyoungsoon Lee, Mehdi Asheghi, Kenneth E. Goodson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2018, 140(2): 021001.
Paper No: EP-17-1126
https://doi.org/10.1115/1.4039475
Published Online: May 9, 2018
View Articletitled, Experimental Investigation of Embedded Micropin-Fins for Single-Phase Heat Transfer and Pressure Drop
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Topics: Fins, Flow (Dynamics), Fluids, Friction, Heat transfer, Pressure drop, Reynolds number, Water, Heat, Temperature
Journal Articles

Display Light Guide Swelling Due to Moisture Absorption

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A. K. Cousins, G. H. Thiel, E. Wolak, G. Limaye, S. Tiku
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2017, 139(4): 041006.
Paper No: EP-17-1070
https://doi.org/10.1115/1.4037971
Published Online: October 5, 2017
View Articletitled, Display Light Guide Swelling Due to Moisture Absorption
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Topics: Absorption, Diffusion (Physics), Water, Water absorption, Polymers
Journal Articles

Heat Transfer in Liquid–Liquid Taylor Flow in Miniscale Curved Tubing for Constant Wall Temperature

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Wesam Adrugi, Yuri Muzychka, Kevin Pope
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2017, 139(2): 020909.
Paper No: EP-16-1141
https://doi.org/10.1115/1.4036405
Published Online: June 12, 2017
View Articletitled, Heat Transfer in Liquid–Liquid Taylor Flow in Miniscale Curved Tubing for Constant Wall Temperature
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Topics: Flow (Dynamics), Heat transfer, Tubing, Water, Wall temperature
Journal Articles

Moisture Ingress, Behavior, and Prediction Inside Semiconductor Packaging: A Review

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Bongtae Han, Dae-Suk Kim
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. March 2017, 139(1): 010802.
Paper No: EP-16-1107
https://doi.org/10.1115/1.4035598
Published Online: January 16, 2017
View Articletitled, Moisture Ingress, Behavior, and Prediction Inside Semiconductor Packaging: A Review
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Topics: Diffusion (Physics), Polymers, Temperature, Cavities, Semiconductors (Materials), Packaging, Water, Vapor pressure
Journal Articles

Flexible Thermal Ground Planes Fabricated With Printed Circuit Board Technology

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Li-Anne Liew, Ching-Yi Lin, Ryan Lewis, Susan Song, Qian Li, Ronggui Yang, Y. C. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2017, 139(1): 011003.
Paper No: EP-16-1103
https://doi.org/10.1115/1.4035241
Published Online: December 7, 2016
View Articletitled, Flexible Thermal Ground Planes Fabricated With Printed Circuit Board Technology
Open the PDF for Flexible Thermal Ground Planes Fabricated With Printed Circuit Board Technology in another window
Topics: Copper, Heat, Manufacturing, Printed circuit boards, Vapors, Water, Nylon fabrics, Condensers (steam plant), Thermal resistance
Journal Articles

Flow Boiling in Microgaps for Thermal Management of High Heat Flux Microsystems

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Xuefei Han, Andrei Fedorov, Yogendra Joshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. December 2016, 138(4): 040801.
Paper No: EP-16-1013
https://doi.org/10.1115/1.4034317
Published Online: August 24, 2016
View Articletitled, Flow Boiling in Microgaps for Thermal Management of High Heat Flux Microsystems
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Topics: Boiling, Flow (Dynamics), Heat flux, Water, Temperature, Pressure, Heat transfer coefficients, Heat sinks
Journal Articles

Numerical and Experimental Investigation of Shell-and-Tube Phase-Change Material Thermal Energy Storage Unit

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Thomas H. Sherer, II, Yogendra Joshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2016, 138(3): 031008.
Paper No: EP-16-1014
https://doi.org/10.1115/1.4034101
Published Online: July 28, 2016
View Articletitled, Numerical and Experimental Investigation of Shell-and-Tube Phase-Change Material Thermal Energy Storage Unit
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Topics: Data centers, Flow (Dynamics), Temperature, Water, Computer simulation, Shells, Temperature profiles, Phase change materials, Cooling, Thermal energy storage