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Journal Articles

Correlation Study on Voiding in Underfill of Large Quantity Ball Grid Array Chip Using Machine Learning

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Calvin Ling, Muhammad Taufik Azahari, Mohamad Aizat Abas, Fei Chong Ng
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2025, 147(1): 011001.
Paper No: EP-22-1076
https://doi.org/10.1115/1.4065077
Published Online: April 5, 2024
View Articletitled, Correlation Study on Voiding in Underfill of Large Quantity Ball Grid Array Chip Using Machine Learning
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Topics: Ball-Grid-Array packaging, Computer simulation, Machine learning, Pressure, Solders, Valves, Epoxy adhesives, Epoxy resins, Simulation, Temperature
Journal Articles

Design, Development, and Characterization of a Flow Control Device for Dynamic Cooling of Liquid-Cooled Servers

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Pardeep Shahi, Apruv Pravin Deshmukh, Hardik Yashwant Hurnekar, Satyam Saini, Pratik Bansode, Rajesh Kasukurthy, Dereje Agonafer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041008.
Paper No: EP-21-1115
https://doi.org/10.1115/1.4052324
Published Online: November 22, 2021
View Articletitled, Design, Development, and Characterization of a Flow Control Device for Dynamic Cooling of Liquid-Cooled Servers
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Topics: Computational fluid dynamics, Cooling, Design, Flow (Dynamics), Flow control, Valves, Pressure drop
Journal Articles

Experimental Study and Mitigation of Pressure Drop Oscillation Using Active Control

Free
Qi Jin, John T. Wen, Shankar Narayanan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041102.
Paper No: EP-21-1081
https://doi.org/10.1115/1.4051942
Published Online: August 20, 2021
View Articletitled, Experimental Study and Mitigation of Pressure Drop Oscillation Using Active Control
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Topics: Compressors, Design, Flow (Dynamics), Heat, Oscillations, Pressure drop, Secondary cells, Stability, Stress, Valves
Journal Articles

Design and Control of the IBM Power 775 Supercomputer Water Conditioning Unit

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Michael J. Ellsworth, Jr., Randy J. Zoodsma, Frank Cascio, Eileen Behrendt
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2014, 136(4): 041009.
Paper No: EP-13-1124
https://doi.org/10.1115/1.4028119
Published Online: September 19, 2014
View Articletitled, Design and Control of the IBM Power 775 Supercomputer Water Conditioning Unit
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Topics: Design, Flow (Dynamics), Pumps, Reservoirs, Sensors, Temperature, Water, Valves, Algorithms, Electronics
Journal Articles

Impact of TXV and Compressor in the Stability of a High-End Computer Refrigeration System

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Yasin Makwana, Dereje Agonafer, Fellow ASME, Dan Manole
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 554–559.
https://doi.org/10.1115/1.1827272
Published Online: January 24, 2005
View Articletitled, Impact of TXV and Compressor in the Stability of a High-End Computer Refrigeration System
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Topics: Compressors, Refrigeration, Temperature, Stress, Computers, Stability, Vapors, Valves