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Journal Articles

Chip Level Thermal Performance Measurements in Two-Phase Immersion Cooling

Jimil M. Shah, Thomas Crandall, Phillip E. Tuma
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2023, 145(4): 041101.
Paper No: EP-22-1089
DOI: https://doi.org/10.1115/1.4062403
Published Online: May 15, 2023
View Article titled, Chip Level Thermal Performance Measurements in Two-Phase Immersion Cooling
Click here to open pdf in another window PDF for Chip Level Thermal Performance Measurements in Two-Phase Immersion Cooling
Topics: Boilers, Boiling, Bose-Einstein condensates, Cooling, Fluids, Junctions, Slug flows, Temperature, Thermal resistance, Vehicles
Journal Articles

Model Establishment of Chip Air Cooling Process and Its Proportional Integral Differential Tuning

Accepted Manuscript
Linmeng Xu, Wanying Zhao, Junhui Li
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag.
Paper No: EP-22-1063
DOI: https://doi.org/10.1115/1.4062530
Published Online: May 15, 2023
View Article titled, Model Establishment of Chip Air Cooling Process and Its Proportional Integral Differential Tuning
Click here to open pdf in another window PDF for Model Establishment of Chip Air Cooling Process and Its Proportional Integral Differential Tuning
Topics: Cooling, Simulation, Computer software, Convection, Cooling systems, Energy conservation, Finite element analysis, Finite element methods, Hardware, Heat
Journal Articles

Multi-level Embedded 3d Manifold Microchannel Heat Sink of Aln Direct Bonded Copper for the High-power Electronic Module

Accepted Manuscript
Yujui Lin, Tiwei Wei, Wyatt Jason Moy, Hao Chen, Man Prakash Gupta, Michael Degner, Mehdi Asheghi, Alan Mantooth, Kenneth Goodson
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag.
Paper No: EP-22-1093
DOI: https://doi.org/10.1115/1.4062384
Published Online: April 21, 2023
View Article titled, Multi-level Embedded 3d Manifold Microchannel Heat Sink of Aln Direct Bonded Copper for the High-power Electronic Module
Click here to open pdf in another window PDF for Multi-level Embedded 3d Manifold Microchannel Heat Sink of Aln Direct Bonded Copper for the High-power Electronic Module
Topics: Copper, Heat sinks, Manifolds, Microchannels, Bonding, Computer simulation, Heat, Lasers, Power density, Pressure drop
Journal Articles

Module-Level Thermal Interface Material Degradation in HALT

Joshua Tompkins, Alicia Medina Garcia, David Huitink, Haitao Liao
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011106.
Paper No: EP-22-1021
DOI: https://doi.org/10.1115/1.4056030
Published Online: November 23, 2022
View Article titled, Module-Level Thermal Interface Material Degradation in HALT
Click here to open pdf in another window PDF for Module-Level Thermal Interface Material Degradation in HALT
Topics: Cycles, Life testing, Stress, Temperature, Testing, Thermal resistance, Vibration, Electronics, Reliability, Heating
Includes: Supplementary data
Journal Articles

Experimental Investigation of Boiling Heat Transfer in a Liquid Chamber With Partially Soluble Nanofluids

Noriyuki Unno, Kazuhisa Yuki, Risako Kibushi, Atsuyuki Mitani
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011104.
Paper No: EP-22-1019
DOI: https://doi.org/10.1115/1.4055841
Published Online: October 22, 2022
View Article titled, Experimental Investigation of Boiling Heat Transfer in a Liquid Chamber With Partially Soluble Nanofluids
Click here to open pdf in another window PDF for Experimental Investigation of Boiling Heat Transfer in a Liquid Chamber With Partially Soluble Nanofluids
Topics: Boiling, Critical heat flux, Heat flux, Heat transfer, Nanofluids, Water, Thermal resistance, Aluminum, Wall temperature, Temperature
Journal Articles

Performance Analysis of Corrosion Resistant Electroless Nickel-Plated Impinging Computer Numerical Control Manufactured Liquid Cooling Cold Plate

Vahideh Radmard, Ahmad R. Gharaibeh, Mohammad I. Tradat, Cong. H. Hoang, Yaman Yaseen Manaserh, Kourosh Nemati, Scott N. Schiffres, Bahgat G. Sammakia
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021001.
Paper No: EP-22-1003
DOI: https://doi.org/10.1115/1.4054972
Published Online: August 8, 2022
View Article titled, Performance Analysis of Corrosion Resistant Electroless Nickel-Plated Impinging Computer Numerical Control Manufactured Liquid Cooling Cold Plate
Click here to open pdf in another window PDF for Performance Analysis of Corrosion Resistant Electroless Nickel-Plated Impinging Computer Numerical Control Manufactured Liquid Cooling Cold Plate
Topics: Computers, Cooling, Copper, Corrosion, Nickel plating, Plates (structures), Pressure drop, Temperature, Thermal resistance, Flow (Dynamics)
Journal Articles

Using a Multi-Inlet/Outlet Manifold to Improve Heat Transfer and Flow Distribution of a Pin Fin Heat Sink

Ahmad R. Gharaibeh, Yaman M. Manaserh, Mohammad I. Tradat, Firas W. AlShatnawi, Scott N. Schiffres, Bahgat G. Sammakia
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031017.
Paper No: EP-21-1164
DOI: https://doi.org/10.1115/1.4054461
Published Online: May 19, 2022
View Article titled, Using a Multi-Inlet/Outlet Manifold to Improve Heat Transfer and Flow Distribution of a Pin Fin Heat Sink
Click here to open pdf in another window PDF for Using a Multi-Inlet/Outlet Manifold to Improve Heat Transfer and Flow Distribution of a Pin Fin Heat Sink
Topics: Flow (Dynamics), Heat sinks, Manifolds, Pressure drop, Thermal resistance, Design, Computer simulation, Fluids, Temperature, Heat transfer
Journal Articles

Ultra-Compact Microscale Heat Exchanger for Advanced Thermal Management in Data Centers

Raffaele L. Amalfi, Todd Salamon, Filippo Cataldo, Jackson B. Marcinichen, John R. Thome
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021110.
Paper No: EP-21-1048
DOI: https://doi.org/10.1115/1.4052767
Published Online: November 22, 2021
View Article titled, Ultra-Compact Microscale Heat Exchanger for Advanced Thermal Management in Data Centers
Click here to open pdf in another window PDF for Ultra-Compact Microscale Heat Exchanger for Advanced Thermal Management in Data Centers
Topics: Condensers (steam plant), Cooling, Flow (Dynamics), Heat, Heat exchangers, Refrigerants, Stress, Temperature, Pressure drop, Test facilities
Journal Articles

System and Component Level Risk Assessment for SiC MOSFET Based Inverter for Traction Application at High Coolant Temperatures and Off-Road Mission Profile

Bakhtiyar Mohammad Nafis, Mohammad Mahmud, Zhongjing Wang, Yuheng Wu, David Huitink, Yue Zhao
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021107.
Paper No: EP-21-1056
DOI: https://doi.org/10.1115/1.4052408
Published Online: October 6, 2021
View Article titled, System and Component Level Risk Assessment for SiC MOSFET Based Inverter for Traction Application at High Coolant Temperatures and Off-Road Mission Profile
Click here to open pdf in another window PDF for System and Component Level Risk Assessment for SiC MOSFET Based Inverter for Traction Application at High Coolant Temperatures and Off-Road Mission Profile
Topics: Capacitance, Coolants, Gates (Closures), MOSFET transistors, Reliability, Temperature, Traction, Roads, Thermal resistance
Journal Articles

High-Performance Planar Thermal Diode With Wickless Components

George Damoulakis, Mohamad Jafari Gukeh, Theodore P. Koukoravas, Constantine M. Megaridis
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031004.
Paper No: EP-21-1020
DOI: https://doi.org/10.1115/1.4051467
Published Online: September 15, 2021
View Article titled, High-Performance Planar Thermal Diode With Wickless Components
Click here to open pdf in another window PDF for High-Performance Planar Thermal Diode With Wickless Components
Topics: Heat, Vapors, Temperature, Thermal resistance, Heat transfer, Condensation, Copper
Journal Articles

Experimental Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics

Omidreza Ghaffari, Wei Tong, Yaser Nabavi Larimi, Chady al Sayed, Alireza Ganjali, Jean-François Morissette, Francis Grenier, Simon Jasmin, Luc Fréchette, Julien Sylvestre
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041103.
Paper No: EP-21-1083
DOI: https://doi.org/10.1115/1.4051943
Published Online: August 27, 2021
View Article titled, Experimental Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics
Click here to open pdf in another window PDF for Experimental Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics
Topics: Boiling, Cooling, Dielectric liquids, Heat, Temperature, Copper, Flat heat pipes, Pool boiling, Critical heat flux, Subcooling
Journal Articles

Electric-Drive Vehicle Power Electronics Thermal Management: Current Status, Challenges, and Future Directions

Gilberto Moreno, Sreekant Narumanchi, Xuhui Feng, Paul Anschel, Steve Myers, Phil Keller
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2022, 144(1): 011004.
Paper No: EP-20-1093
DOI: https://doi.org/10.1115/1.4049815
Published Online: August 6, 2021
View Article titled, Electric-Drive Vehicle Power Electronics Thermal Management: Current Status, Challenges, and Future Directions
Click here to open pdf in another window PDF for Electric-Drive Vehicle Power Electronics Thermal Management: Current Status, Challenges, and Future Directions
Topics: Cooling, Electronics, Fluids, Heat exchangers, Heat transfer, Thermal management, Thermal resistance, Vehicles, Heat, Temperature
Journal Articles

A Review on Transient Thermal Management of Electronic Devices

John Mathew, Shankar Krishnan
Journal: Journal of Electronic Packaging
Article Type: Review Articles
J. Electron. Packag. March 2022, 144(1): 010801.
Paper No: EP-20-1113
DOI: https://doi.org/10.1115/1.4050002
Published Online: August 6, 2021
View Article titled, A Review on Transient Thermal Management of Electronic Devices
Click here to open pdf in another window PDF for A Review on Transient Thermal Management of Electronic Devices
Topics: Cooling, Heat, Heat pipes, Phase change materials, Temperature, Thermal management, Transients (Dynamics), Vapors, Boiling, Steady state
Journal Articles

Experimental Characterization of Two-Phase Cold Plates Intended for High-Density Data Center Servers Using a Dielectric Fluid

Bharath Ramakrishnan, Cong Hiep Hoang, Sadegh Khalili, Yaser Hadad, Srikanth Rangarajan, Arvind Pattamatta, Bahgat Sammakia
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2021, 143(2): 020904.
Paper No: EP-20-1119
DOI: https://doi.org/10.1115/1.4049928
Published Online: March 5, 2021
View Article titled, Experimental Characterization of Two-Phase Cold Plates Intended for High-Density Data Center Servers Using a Dielectric Fluid
Click here to open pdf in another window PDF for Experimental Characterization of Two-Phase Cold Plates Intended for High-Density Data Center Servers Using a Dielectric Fluid
Topics: Boiling, Coolants, Cooling, Data centers, Density, Flow (Dynamics), Fluids, Heat flux, Heat transfer coefficients, Plates (structures)
Journal Articles

Experimental Characterization of Two-Phase Cooling of Power Electronics in Thermosiphon and Forced Convection Modes

Fabio Battaglia, Farah Singer, David C. Deisenroth, Michael M. Ohadi
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2021, 143(3): 031006.
Paper No: EP-19-1118
DOI: https://doi.org/10.1115/1.4049564
Published Online: February 19, 2021
View Article titled, Experimental Characterization of Two-Phase Cooling of Power Electronics in Thermosiphon and Forced Convection Modes
Click here to open pdf in another window PDF for Experimental Characterization of Two-Phase Cooling of Power Electronics in Thermosiphon and Forced Convection Modes
Topics: Cooling, Flow (Dynamics), Heat, Heat flux, Microchannels, Pumps, Refrigerants, Temperature, Electronics, Flux (Metallurgy)
Journal Articles

Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-3D Manifold Coolers (EMMCs): Part 1—Experimental Study of Single-Phase Cooling Performance With R-245fa

Ki Wook Jung, Eunho Cho, Hyoungsoon Lee, Chirag Kharangate, Feng Zhou, Mehdi Asheghi, Ercan M. Dede, Kenneth E. Goodson
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031117.
Paper No: EP-20-1030
DOI: https://doi.org/10.1115/1.4047846
Published Online: August 17, 2020
View Article titled, Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-3D Manifold Coolers (EMMCs): Part 1—Experimental Study of Single-Phase Cooling Performance With R-245fa
Click here to open pdf in another window PDF for Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-3D Manifold Coolers (EMMCs): Part 1—Experimental Study of Single-Phase Cooling Performance With R-245fa
Topics: Flow (Dynamics), Fluids, Heat, Heat flux, Manifolds, Microchannels, Pressure drop, Temperature, Uncertainty, Cooling
Journal Articles

System-Level Thermal Management and Reliability of Automotive Electronics: Goals and Opportunities Using Phase-Change Materials

Bakhtiyar Mohammad Nafis, Ange-Christian Iradukunda, David Huitink
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041108.
Paper No: EP-20-1019
DOI: https://doi.org/10.1115/1.4047497
Published Online: June 26, 2020
View Article titled, System-Level Thermal Management and Reliability of Automotive Electronics: Goals and Opportunities Using Phase-Change Materials
Click here to open pdf in another window PDF for System-Level Thermal Management and Reliability of Automotive Electronics: Goals and Opportunities Using Phase-Change Materials
Topics: Cooling, Electronics, Heat, Phase change materials, Reliability, Temperature, Thermal management, Heat sinks, Design, Convection
Journal Articles

Design, Analysis, Comparison, and Experimental Validation of Insulated Metal Substrates for High-Power Wide-Bandgap Power Modules

Emre Gurpinar, Burak Ozpineci, Shajjad Chowdhury
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041107.
Paper No: EP-19-1131
DOI: https://doi.org/10.1115/1.4047409
Published Online: June 26, 2020
View Article titled, Design, Analysis, Comparison, and Experimental Validation of Insulated Metal Substrates for High-Power Wide-Bandgap Power Modules
Click here to open pdf in another window PDF for Design, Analysis, Comparison, and Experimental Validation of Insulated Metal Substrates for High-Power Wide-Bandgap Power Modules
Topics: Design, Energy gap, Heat, Junctions, Metals, MOSFET transistors, Steady state, Temperature, Thermal analysis, Transients (Dynamics)
Journal Articles

Demonstration of a Compliant Microspring Array as a Thermal Interface Material for Pluggable Optoelectronic Transceiver Modules

Jin Cui, Liang Pan, Justin A. Weibel
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031114.
Paper No: EP-19-1110
DOI: https://doi.org/10.1115/1.4047356
Published Online: June 8, 2020
View Article titled, Demonstration of a Compliant Microspring Array as a Thermal Interface Material for Pluggable Optoelectronic Transceiver Modules
Click here to open pdf in another window PDF for Demonstration of a Compliant Microspring Array as a Thermal Interface Material for Pluggable Optoelectronic Transceiver Modules
Topics: Heat sinks, Polymers, Surface roughness, Pressure, Thermal conductivity, Thermal resistance
Journal Articles

Thermomechanical Degradation of Thermal Interface Materials: Accelerated Test Development and Reliability Analysis

Hayden Carlton, Dustin Pense, David Huitink
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031112.
Paper No: EP-19-1122
DOI: https://doi.org/10.1115/1.4047099
Published Online: May 21, 2020
View Article titled, Thermomechanical Degradation of Thermal Interface Materials: Accelerated Test Development and Reliability Analysis
Click here to open pdf in another window PDF for Thermomechanical Degradation of Thermal Interface Materials: Accelerated Test Development and Reliability Analysis
Topics: Temperature, Testing, Thermal resistance, Thermomechanics, Failure, Pumps, Steady state