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Journal Articles

Impact Resistance of SM Joints Formed With ICA

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C. M. Lawrence Wu, Robert K. Y. Li, N. H. Yeung
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 93–97.
https://doi.org/10.1115/1.1534842
Published Online: March 14, 2003
View Articletitled, Impact Resistance of SM Joints Formed With ICA
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Topics: Adhesives, Copper, Fracture (Materials), Impact testing, Shear (Mechanics), Shear strength, Solders, Silver, Resistors, Alloys
Journal Articles

Impact Resistance of SM Joints Formed With ICA

Available to Purchase
C. M. Lawrence Wu, Robert K. Y. Li, N. H. Yeung
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2002, 124(4): 374–378.
https://doi.org/10.1115/1.1502666
Published Online: December 12, 2002
View Articletitled, Impact Resistance of SM Joints Formed With ICA
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Topics: Adhesives, Copper, Fracture (Materials), Impact testing, Reliability, Shear (Mechanics), Shear strength, Solders, Silver, Resistors
Journal Articles

Viscoelastic Warpage Analysis of Surface Mount Package

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Kiyoshi Miyake, Tsukasa Yoshida, Hyung Gil Baik, Sang Wook Park
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2001, 123(2): 101–104.
https://doi.org/10.1115/1.1339820
Published Online: June 1, 2001
View Articletitled, Viscoelastic Warpage Analysis of Surface Mount Package
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Topics: Warping, Surface mount packaging, Shells
Journal Articles

Thermomechanical Durability Analysis of Flip Chip Solder Interconnects: Part 1—Without Underfill

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K. Darbha, J. H. Okura, A. Dasgupta
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1999, 121(4): 231–236.
https://doi.org/10.1115/1.2793845
Published Online: December 1, 1999
View Articletitled, Thermomechanical Durability Analysis of Flip Chip Solder Interconnects: Part 1—Without Underfill
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Topics: Durability, Flip-chip devices, Solders, Thermomechanics, Flip-chip, Damage, Stress, Stress analysis (Engineering), Finite element model, Modeling
Journal Articles

Thermal Management of Surface Mount Power Magnetic Components

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G. Refai-Ahmed, Mem. ASME,, M. M. Yovanovich, Fellow ASME,
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2000, 122(4): 323–327.
https://doi.org/10.1115/1.1289634
Published Online: November 25, 1999
View Articletitled, Thermal Management of Surface Mount Power Magnetic Components
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Topics: Computer simulation, Heat conduction, Surface mount packaging, Temperature, Thermal management, Thermal resistance, Winding (process), Heat transfer, Wings, Packaging
Journal Articles

Nonlinear Dynamic Analysis of Surface Mount Interconnects: Part II—Applications

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C. Basaran, R. Chandaroy
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1999, 121(1): 12–17.
https://doi.org/10.1115/1.2792654
Published Online: March 1, 1999
View Articletitled, Nonlinear Dynamic Analysis of Surface Mount Interconnects: Part II—Applications
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Topics: Dynamic analysis, Surface mount packaging, Solder joints, Constitutive equations, Cycles, Fatigue, Fatigue life, Finite element analysis, High cycle fatigue, Noise (Sound)
Journal Articles

Nonlinear Dynamic Analysis of Surface Mount Interconnects: Part I—Theory

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C. Basaran, R. Chandaroy
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1999, 121(1): 8–11.
https://doi.org/10.1115/1.2792663
Published Online: March 1, 1999
View Articletitled, Nonlinear Dynamic Analysis of Surface Mount Interconnects: Part I—Theory
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Topics: Dynamic analysis, Surface mount packaging, Solder joints, Failure mechanisms, Constitutive equations, Cycles, Defense industry, Failure, Fatigue, Fatigue life
Journal Articles

Stress Analysis of Surface-Mount Interconnections Due to Vibrational Loading

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K. Darbha, S. Ling, A. Dasgupta
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1997, 119(3): 183–188.
https://doi.org/10.1115/1.2792232
Published Online: September 1, 1997
View Articletitled, Stress Analysis of Surface-Mount Interconnections Due to Vibrational Loading
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Topics: Stress analysis (Engineering), Surface mount packaging, Printed circuit boards, Solder joints, Stress, Vibration, Boundary-value problems, Damage, Deformation, Fatigue
Journal Articles

A Nonlinear Multi-Domain Thermomechanical Stress Analysis Method for Surface-Mount Solder Joints—Part II: Viscoplastic Analysis

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S. Ling, A. Dasgupta
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1997, 119(3): 177–182.
https://doi.org/10.1115/1.2792231
Published Online: September 1, 1997
View Articletitled, A Nonlinear Multi-Domain Thermomechanical Stress Analysis Method for Surface-Mount Solder Joints—Part II: Viscoplastic Analysis
Open the PDF for A Nonlinear Multi-Domain Thermomechanical Stress Analysis Method for Surface-Mount Solder Joints—Part II: Viscoplastic Analysis in another window
Topics: Solder joints, Stress analysis (Engineering), Surface mount packaging, Thermomechanics, Stress, Deformation, Displacement, Potential energy, Printed circuit boards, Materials properties
Journal Articles

Finite Element Modeling of Three-Dimensional Solder Joint Geometry in SMT

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T. S. Lee, T. P. Choi, C. D. Yoo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1997, 119(2): 119–126.
https://doi.org/10.1115/1.2792214
Published Online: June 1, 1997
View Articletitled, Finite Element Modeling of Three-Dimensional Solder Joint Geometry in SMT
Open the PDF for Finite Element Modeling of Three-Dimensional Solder Joint Geometry in SMT in another window
Topics: Finite element analysis, Geometry, Modeling, Solder joints, Bricks, Electronic packaging, Equilibrium (Physics), Shapes, Soldering, Surface mount packaging
Journal Articles

Analysis and Modeling of Lead Coplanarity Distributions

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E. K. Buratynski
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1996, 118(4): 201–205.
https://doi.org/10.1115/1.2792153
Published Online: December 1, 1996
View Articletitled, Analysis and Modeling of Lead Coplanarity Distributions
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Topics: Circuits, Manufacturing, Modeling, Reliability, Soldering, Statistical distributions, Surface mount packaging
Journal Articles

Experimental Investigation of the Formation of Surface Mount Solder Joints

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P. P. Conway, M. R. Kalantary, D. J. Williams
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1996, 118(4): 223–228.
https://doi.org/10.1115/1.2792156
Published Online: December 1, 1996
View Articletitled, Experimental Investigation of the Formation of Surface Mount Solder Joints
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Topics: Solder joints, Surface mount packaging, Solders, Computers, Manufacturing, Microscopy, Process design, Reflow soldering, Temperature, Wetting
Journal Articles

A Nonlinear Multi-Domain Stress Analysis Method for Surface-Mount Solder Joints

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S. Ling, A. Dasgupta
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1996, 118(2): 72–79.
https://doi.org/10.1115/1.2792135
Published Online: June 1, 1996
View Articletitled, A Nonlinear Multi-Domain Stress Analysis Method for Surface-Mount Solder Joints
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Topics: Solder joints, Stress analysis (Engineering), Surface mount packaging, Stress, Fatigue, Creep, Electronic packages, Deformation, Finite element analysis, Modeling
Journal Articles

Determination of Parameters Affecting Solder Paste Tack Strength as Measured in the IPC Tack Test: A Classical Design of Experiments Approach

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Scott Anson, C. Sahay, Linda Head, James Constable
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1996, 118(2): 94–100.
https://doi.org/10.1115/1.2792138
Published Online: June 1, 1996
View Articletitled, Determination of Parameters Affecting Solder Paste Tack Strength as Measured in the IPC Tack Test: A Classical Design of Experiments Approach
Open the PDF for Determination of Parameters Affecting Solder Paste Tack Strength as Measured in the IPC Tack Test: A Classical Design of Experiments Approach in another window
Topics: Experimental design, Solders, Probes, Printed circuit boards, Adhesion, Circuits, Drying, Electronics, Ovens, Pressure
Journal Articles

A New Method to Determine Crack Shape and Size in Solder Joints

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T. Reinikainen, F. W. Wulff, W. Kolbe, T. Ahrens
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1995, 117(4): 266–269.
https://doi.org/10.1115/1.2792103
Published Online: December 1, 1995
View Articletitled, A New Method to Determine Crack Shape and Size in Solder Joints
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Topics: Fracture (Materials), Shapes, Solder joints, Solders, Computer-aided design, Fatigue cracks, Capacitors, Ceramics, Copper, Image processing
Journal Articles

Thermal Deformation Analysis of Various Electronic Packaging Products by Moire´ and Microscopic Moire´ Interferometry

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B. Han, Y. Guo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1995, 117(3): 185–191.
https://doi.org/10.1115/1.2792090
Published Online: September 1, 1995
View Articletitled, Thermal Deformation Analysis of Various Electronic Packaging Products by Moire´ and Microscopic Moire´ Interferometry
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Topics: Electronic packaging, Interferometry, Thermal deformation, Deformation, Packaging, Design, Displacement measurement, Mechanical behavior, Optimization, Product development
Journal Articles

A Solution Methodology for the Multiple Batch Surface Mount PCB Placement Sequence Problem

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Yu-Wen Huang, K. Srihari, Jim Adriance, George Westby
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1994, 116(4): 282–289.
https://doi.org/10.1115/1.2905699
Published Online: December 1, 1994
View Articletitled, A Solution Methodology for the Multiple Batch Surface Mount PCB Placement Sequence Problem
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Topics: Surface mount packaging, Engineering prototypes, Lumber, Machinery, Manufacturing, Nozzles, Printed circuit boards, Surface mount components, Tooling
Journal Articles

A Finite Element Study of Factors Affecting Fatigue Life of Solder Joints

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N. Paydar, Y. Tong, H. U. Akay
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1994, 116(4): 265–273.
https://doi.org/10.1115/1.2905697
Published Online: December 1, 1994
View Articletitled, A Finite Element Study of Factors Affecting Fatigue Life of Solder Joints
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Topics: Fatigue life, Finite element analysis, Solder joints, Cycles, Alloys, Constitutive equations, Creep, Design, Grain size, Manufacturing
Journal Articles

Influence of Surface Mount Lead End Geometry on Fatigue Life

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Vineet K. Gupta, Donald B. Barker
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. June 1994, 116(2): 157–160.
https://doi.org/10.1115/1.2905505
Published Online: June 1, 1994
View Articletitled, Influence of Surface Mount Lead End Geometry on Fatigue Life
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Topics: Fatigue life, Geometry, Surface mount packaging, Shapes, Solder joints, Solders, Dimensions, Fatigue, Fatigue damage, Finite element analysis
Journal Articles

Effects of Solder Joint Voiding and Seating Plane Stability on Surface Mount Lead Standoff

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M. K. Schwiebert
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1994, 116(2): 89–91.
https://doi.org/10.1115/1.2905510
Published Online: June 1, 1994
View Articletitled, Effects of Solder Joint Voiding and Seating Plane Stability on Surface Mount Lead Standoff
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Topics: Solder joints, Stability, Surface mount packaging, Solders, Rocks, Surface mount technology