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Journal Articles

Evaluation of Phase Transformation on Boron Decorated Sn-1.5Ag-0.7 Cu Joined Cu Pillar for Packaging Connection

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Ching-Yuan Ho, Haw-Teng Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2025, 147(3): 031004.
Paper No: EP-24-1023
https://doi.org/10.1115/1.4068448
Published Online: May 12, 2025
View Articletitled, Evaluation of Phase Transformation on Boron Decorated Sn-1.5Ag-0.7 Cu Joined Cu Pillar for Packaging Connection
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Topics: Boron, Columns (Structural), Grain size, High temperature, Intermetallic compounds, Solders, Tin, Storage, Packaging, Phase transitions
Journal Articles

Special Issue on InterPACK2022

Free
Jin Yang, Sukwon Choi, Benjamin Leever, Cheng Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. December 2023, 145(4): 040301.
Paper No: EP-23-1077
https://doi.org/10.1115/1.4063893
Published Online: November 1, 2023
View Articletitled, Special Issue on InterPACK2022
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Topics: Aerosols, Artificial intelligence, Cloud computing, Cooling, Cycles, Density, Electric vehicles, Electronic packaging, Electronics, Energy conversion
Journal Articles

Solderability and Reliability of Sintered Nano-Ag Bond Pads of Printed Re-Distribution Layer

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J. C. C. Lo, Q. Jiang, X. Qiu, N. Tu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011103.
Paper No: EP-22-1013
https://doi.org/10.1115/1.4055840
Published Online: October 22, 2022
View Articletitled, Solderability and Reliability of Sintered Nano-Ag Bond Pads of Printed Re-Distribution Layer
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Topics: High temperature, Inks, Reliability, Shear (Mechanics), Sintering, Storage, Solders, Additive manufacturing, Solder joints
Journal Articles

Viscoelastic Influence on the Board Level Assessment of Wafer Level Packages Under Drop Impact and Under Thermal Cycling

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Abel Misrak, Rabin Bhandari, Dereje Agonafer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011204.
Paper No: EP-21-1110
https://doi.org/10.1115/1.4054784
Published Online: August 3, 2022
View Articletitled, Viscoelastic Influence on the Board Level Assessment of Wafer Level Packages Under Drop Impact and Under Thermal Cycling
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Topics: Glass transition, Reliability, Semiconductor wafers, Storage, Stress, Temperature, Testing, Viscoelasticity, Solders, Failure
Journal Articles

Special Issue on InterPACK2020

Free
Jin Yang, Sukwon Choi, Jaeho Lee, Saket Karajgikar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. June 2022, 144(2): 020301.
Paper No: EP-21-1158
https://doi.org/10.1115/1.4053122
Published Online: January 4, 2022
View Articletitled, Special Issue on InterPACK2020
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Topics: Additive manufacturing, Cloud computing, Computers, Data centers, Electric vehicles, Electronic packaging, Electronics, Engineering teachers, Microelectronic packaging, Modeling
Journal Articles

Microstructural Evolution of Viscoelastic Properties of Underfills Under Sustained High Temperature Operation

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Pradeep Lall, Madhu Kasturi, Haotian Wu, Jeff Suhling, Edward Davis
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021113.
Paper No: EP-21-1059
https://doi.org/10.1115/1.4052715
Published Online: January 4, 2022
View Articletitled, Microstructural Evolution of Viscoelastic Properties of Underfills Under Sustained High Temperature Operation
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Topics: Flip-chip, Glass transition, High temperature, Mechanical properties, Oxidation, Solders, Storage, Temperature, Viscoelasticity, Optical microscopes
Journal Articles

Effect of Phase Change Material on Dynamic Thermal Management Performance for Power Electronics Packages

Free
Justin Hollis, Darin J. Sharar, Todd Bandhauer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041111.
Paper No: EP-21-1103
https://doi.org/10.1115/1.4052669
Published Online: November 5, 2021
View Articletitled, Effect of Phase Change Material on Dynamic Thermal Management Performance for Power Electronics Packages
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Topics: Copper, Cycles, Junctions, Phase change materials, Temperature, Heat, Composite materials, Transients (Dynamics), Thermal management, Cities
Journal Articles

Special Section on Nanoscale/Microscale Energy Transport, Conversion and Storage in Electronics Packaging

Free
Ronald J. Warzoha
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. June 2021, 143(2): 020301.
Paper No: EP-21-1004
https://doi.org/10.1115/1.4050407
Published Online: March 19, 2021
View Articletitled, Special Section on Nanoscale/Microscale Energy Transport, Conversion and Storage in Electronics Packaging
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Topics: Electronic packaging, Microscale devices, Nanoscale phenomena, Storage
Journal Articles

Special Issue on InterPACK 2019 – Part 1

Free
Sreekant Narumanchi, Sukwon Choi, Saket Karajgikar, Haiding Sun, Guangsheng Zhang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. September 2020, 142(3): 030301.
Paper No: EP-20-1092
https://doi.org/10.1115/1.4048039
Published Online: August 14, 2020
View Articletitled, Special Issue on InterPACK 2019 – Part 1
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Topics: Cloud computing, Electric vehicles, Electronic packaging, Electronics, Energy conversion, Engineering teachers, Feedback, Internet of things, Manufacturing, Mechanical engineers
Journal Articles

Effects of High-Temperature Storage on the Glass Transition Temperature of Epoxy Molding Compound

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Ruifeng Li, Daoguo Yang, Ping Zhang, Fanfan Niu, Miao Cai, G. Q. Zhang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2021, 143(1): 011009.
Paper No: EP-18-1065
https://doi.org/10.1115/1.4047475
Published Online: June 26, 2020
View Articletitled, Effects of High-Temperature Storage on the Glass Transition Temperature of Epoxy Molding Compound
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Topics: Epoxy resins, Glass transition, High temperature, Molding, Storage, Temperature, Epoxy adhesives
Journal Articles

High Strain Rate Mechanical Properties of SAC-Q With Sustained Elevated Temperature Storage at 100 °C

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Pradeep Lall, Vishal Mehta, Jeff Suhling, David Locker
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041104.
Paper No: EP-20-1003
https://doi.org/10.1115/1.4047392
Published Online: June 23, 2020
View Articletitled, High Strain Rate Mechanical Properties of SAC-Q With Sustained Elevated Temperature Storage at 100 °C
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Topics: Elastic moduli, Mechanical properties, Stress, Temperature, Tensile strength, Storage, Solders
Journal Articles

Impact of Aging on Mechanical Properties of Thermally Conductive Gap Fillers

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Abel Misrak, Tushar Chauhan, Pavan Rajmane, Rabin Bhandari, Dereje Agonafer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2020, 142(1): 011011.
Paper No: EP-19-1064
https://doi.org/10.1115/1.4045157
Published Online: November 8, 2019
View Articletitled, Impact of Aging on Mechanical Properties of Thermally Conductive Gap Fillers
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Topics: Fillers (Materials), Fourier transform infrared spectroscopy, Infrared spectroscopy, Mechanical properties, Stress, Temperature, Testing, Thermomechanics, High temperature, Reliability
Journal Articles

Special Issue on InterPACK 2018

Free
Ercan M. Dede, Lauren Boteler, Changqing Chen, Przemyslaw Jakub Gromala, Benjamin Leever, Wei Li
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. September 2019, 141(3): 030301.
Paper No: EP-19-1036
https://doi.org/10.1115/1.4043484
Published Online: May 8, 2019
View Articletitled, Special Issue on InterPACK 2018
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Topics: Electronic packaging, Electronics, Microelectromechanical systems, Design, Internet of things, Condition monitoring, Data centers, Electric vehicles, Energy conversion, Engineering teachers
Journal Articles

Modeling of Thermoplastic Materials for the Process-Simulation of Press-Fit Interconnections on Moulded Interconnected Devices

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Thomas Fellner, Elena Zukowski, Jürgen Wilde, H. Kück, H. Richter, M. Schober, P. Buckmüller
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2012, 134(3): 031002.
https://doi.org/10.1115/1.4006927
Published Online: July 18, 2012
View Articletitled, Modeling of Thermoplastic Materials for the Process-Simulation of Press-Fit Interconnections on Moulded Interconnected Devices
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Topics: Creep, Modeling, Press fits, Reliability, Simulation, Stress, Temperature, Deformation, Friction, Manufacturing
Journal Articles

Flip-Chip Ball Grid Array Lead-Free Solder Joint Under Reliability Test

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Ming-Hwa R. Jen, Lee-Cheng Liu, Jenq-Dah Wu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 446–451.
https://doi.org/10.1115/1.2070090
Published Online: January 13, 2005
View Articletitled, Flip-Chip Ball Grid Array Lead-Free Solder Joint Under Reliability Test
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Topics: Ball-Grid-Array packaging, Flip-chip, High temperature, Lead-free solders, Reliability, Shear (Mechanics), Failure mechanisms, Solders, Shear strength, Adhesion
Journal Articles

A Hybrid Thermal Energy Storage Device, Part 1: Design Methodology

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Ning Zheng, R. A. Wirtz
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 1–7.
https://doi.org/10.1115/1.1646419
Published Online: April 30, 2004
View Articletitled, A Hybrid Thermal Energy Storage Device, Part 1: Design Methodology
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Topics: Design, Engineering prototypes, Heat, Heat sinks, Latent heat, Storage, Temperature, Thermal conductivity, Thermal energy storage, Interfacial thermal resistance
Journal Articles

A Hybrid Thermal Energy Storage Device, Part 2: Thermal Performance Figures of Merit

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Ning Zheng, R. A. Wirtz
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 8–13.
https://doi.org/10.1115/1.1646420
Published Online: April 30, 2004
View Articletitled, A Hybrid Thermal Energy Storage Device, Part 2: Thermal Performance Figures of Merit
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Topics: Design, Heat, Metals, Storage, Thermal energy storage, Temperature
Journal Articles

Mechanical Modeling and Characterization of the Curing Process of Underfill Materials

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L. J. Ernst, C. van ’t Hof, D. G. Yang, M. S. Kiasat, G. Q. Zhang, H. J. L. Bressers, J. F. J. Caers, A. W. J. den Boer, J. Janssen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2002, 124(2): 97–105.
https://doi.org/10.1115/1.1459471
Published Online: May 2, 2002
View Articletitled, Mechanical Modeling and Characterization of the Curing Process of Underfill Materials
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Topics: Hardening (Curing), Relaxation (Physics), Shrinkage (Materials), Stress, Modeling, Flip-chip devices, Polymers, Storage, Deformation
Journal Articles

Numerical Simulation of Impingement Air Cooling From LSI Packages With Large Plate Fins by the Penalty Finite Element Method

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T. Tanaka, H. Matsushima, A. Ueki, T. Atarashi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1997, 119(1): 73–77.
https://doi.org/10.1115/1.2792204
Published Online: March 1, 1997
View Articletitled, Numerical Simulation of Impingement Air Cooling From LSI Packages With Large Plate Fins by the Penalty Finite Element Method
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Topics: Computer simulation, Cooling, Finite element methods, Fins, Gradient methods, Algebra, Computers, Flow (Dynamics), Flow visualization, Industrial research
Journal Articles

Reliability of Postmolded IC Packages

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L. T. Nguyen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1993, 115(4): 346–355.
https://doi.org/10.1115/1.2909343
Published Online: December 1, 1993
View Articletitled, Reliability of Postmolded IC Packages
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Topics: Reliability, Molding, Stress, Adhesion, Water, Corrosion, Metals, Corners (Structural elements), Cracking (Materials), Damage