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Journal Articles

Phase Change Material Behavior in Finite Thickness Slabs Under a Step Response Heat

Free
Michael Deckard, Darin J. Sharar, Michael Fish, Patrick J. Shamberger
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011201.
Paper No: EP-21-1153
https://doi.org/10.1115/1.4054651
Published Online: July 7, 2022
View Article titled, Phase Change Material Behavior in Finite Thickness Slabs Under a Step Response Heat
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Topics: Heat, Phase change materials, Steady state, Temperature, Transients (Dynamics), Melting, Copper, Heat sinks, Tradeoffs, Simulation
Journal Articles

Machine Learning-Based Predictions of Benefits of High Thermal Conductivity Encapsulation Materials for Power Electronics Packaging

Free
Palash V. Acharya, Manojkumar Lokanathan, Abdelhamid Ouroua, Robert Hebner, Shannon Strank, Vaibhav Bahadur
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041109.
Paper No: EP-21-1087
https://doi.org/10.1115/1.4052814
Published Online: November 5, 2021
View Article titled, Machine Learning-Based Predictions of Benefits of High Thermal Conductivity Encapsulation Materials for Power Electronics Packaging
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Topics: Algorithms, Artificial neural networks, Bridges (Structures), Cooling, Heat sinks, Junctions, Machine learning, Machinery, Simulation, Steady state
Includes: Supplementary data
Journal Articles

Peak Temperature Mitigation of a Multimicrochannel Evaporator Under Transient Heat Loads

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Caleb Anderson, Joshua Richey, Michael Fish, Todd Bandhauer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041104.
Paper No: EP-21-1102
https://doi.org/10.1115/1.4052360
Published Online: September 24, 2021
View Article titled, Peak Temperature Mitigation of a Multimicrochannel Evaporator Under Transient Heat Loads
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Topics: Boiling, Heat, Stress, Temperature, Transients (Dynamics), Steady state, Heat flux, Vapors
Journal Articles

A Review on Transient Thermal Management of Electronic Devices

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John Mathew, Shankar Krishnan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. March 2022, 144(1): 010801.
Paper No: EP-20-1113
https://doi.org/10.1115/1.4050002
Published Online: August 6, 2021
View Article titled, A Review on Transient Thermal Management of Electronic Devices
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Topics: Cooling, Heat, Heat pipes, Phase change materials, Temperature, Thermal management, Transients (Dynamics), Vapors, Boiling, Steady state
Journal Articles

Compact Transient Thermal Model of Microfluidically Cooled Three-Dimensional Stacked Chips With Pin-Fin Enhanced Microgap

Free
Yuanchen Hu, Md Obaidul Hossen, Zhimin Wan, Muhannad S. Bakir, Yogendra Joshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2021, 143(3): 031007.
Paper No: EP-20-1045
https://doi.org/10.1115/1.4049814
Published Online: February 19, 2021
View Article titled, Compact Transient Thermal Model of Microfluidically Cooled Three-Dimensional Stacked Chips With Pin-Fin Enhanced Microgap
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Topics: Computational fluid dynamics, Cooling, Integrated circuits, Leakage, Simulation, Temperature, Transients (Dynamics), Fins, Steady state, Heat
Journal Articles

The Doping Dependence of the Thermal Conductivity of Bulk Gallium Nitride Substrates

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Yiwen Song, James Spencer Lundh, Weijie Wang, Jacob H. Leach, Devon Eichfeld, Anusha Krishnan, Carlos Perez, Dong Ji, Trent Borman, Kevin Ferri, Jon-Paul Maria, Srabanti Chowdhury, Jae-Hyun Ryou, Brian M. Foley, Sukwon Choi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041112.
Paper No: EP-20-1014
https://doi.org/10.1115/1.4047578
Published Online: July 10, 2020
View Article titled, The Doping Dependence of the Thermal Conductivity of Bulk Gallium Nitride Substrates
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Topics: Gallium nitride, Thermal conductivity, Phonons, Raman spectroscopy, Steady state, Thermoreflectance
Journal Articles

Design, Analysis, Comparison, and Experimental Validation of Insulated Metal Substrates for High-Power Wide-Bandgap Power Modules

Free
Emre Gurpinar, Burak Ozpineci, Shajjad Chowdhury
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041107.
Paper No: EP-19-1131
https://doi.org/10.1115/1.4047409
Published Online: June 26, 2020
View Article titled, Design, Analysis, Comparison, and Experimental Validation of Insulated Metal Substrates for High-Power Wide-Bandgap Power Modules
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Topics: Design, Energy gap, Heat, Junctions, Metals, MOSFET transistors, Steady state, Temperature, Thermal analysis, Transients (Dynamics)
Journal Articles

Device-Level Multidimensional Thermal Dynamics With Implications for Current and Future Wide Bandgap Electronics

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James Spencer Lundh, Yiwen Song, Bikramjit Chatterjee, Albert G. Baca, Robert J. Kaplar, Andrew M. Armstrong, Andrew A. Allerman, Brianna A. Klein, Dustin Kendig, Hyungtak Kim, Sukwon Choi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031113.
Paper No: EP-20-1012
https://doi.org/10.1115/1.4047100
Published Online: May 21, 2020
View Article titled, Device-Level Multidimensional Thermal Dynamics With Implications for Current and Future Wide Bandgap Electronics
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Topics: Dynamics (Mechanics), Electronics, Energy gap, Gallium nitride, Heating, Imaging, Steady state, Temperature, Temperature measurement, Thermal characterization
Journal Articles

Thermomechanical Degradation of Thermal Interface Materials: Accelerated Test Development and Reliability Analysis

Free
Hayden Carlton, Dustin Pense, David Huitink
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031112.
Paper No: EP-19-1122
https://doi.org/10.1115/1.4047099
Published Online: May 21, 2020
View Article titled, Thermomechanical Degradation of Thermal Interface Materials: Accelerated Test Development and Reliability Analysis
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Topics: Temperature, Testing, Thermal resistance, Thermomechanics, Failure, Pumps, Steady state
Journal Articles

Hybrid Nanocomposite Thermal Interface Materials: The Thermal Conductivity and the Packing Density

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Tingting Zhang, Bahgat G. Sammakia, Zhihao Yang, Howard Wang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031006.
Paper No: EP-17-1110
https://doi.org/10.1115/1.4040204
Published Online: June 11, 2018
View Article titled, Hybrid Nanocomposite Thermal Interface Materials: The Thermal Conductivity and the Packing Density
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Topics: Composite materials, Copper, Density, Nanocomposites, Packing (Shipments), Packings (Cushioning), Particulate matter, Thermal conductivity, Fillers (Materials), Silver
Journal Articles

Characterization and Benchmarking of the Low Intertier Thermal Resistance of Three-Dimensional Hybrid Cu/Dielectric Wafer-to-Wafer Bonding

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Herman Oprins, Vladimir Cherman, Tomas Webers, Abdellah Salahouelhadj, Soon-Wook Kim, Lan Peng, Geert Van der Plas, Eric Beyne
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2017, 139(1): 011008.
Paper No: EP-16-1096
https://doi.org/10.1115/1.4035597
Published Online: January 10, 2017
View Article titled, Characterization and Benchmarking of the Low Intertier Thermal Resistance of Three-Dimensional Hybrid Cu/Dielectric Wafer-to-Wafer Bonding
Open the PDF for Characterization and Benchmarking of the Low Intertier Thermal Resistance of Three-Dimensional Hybrid Cu/Dielectric Wafer-to-Wafer Bonding in another window
Topics: Bonding, Semiconductor wafers, Thermal resistance, Transients (Dynamics), Temperature, Steady state
Journal Articles

Maximum Resolution of a Probe-Based, Steady-State Thermal Interface Material Characterization Instrument

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Ronald J. Warzoha, Andrew N. Smith, Maurice Harris
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2017, 139(1): 011004.
Paper No: EP-16-1075
https://doi.org/10.1115/1.4035178
Published Online: December 29, 2016
View Article titled, Maximum Resolution of a Probe-Based, Steady-State Thermal Interface Material Characterization Instrument
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Topics: Heat, Instrumentation, Probes, Resolution (Optics), Steady state, Uncertainty, Heat flux, Measurement uncertainty, Fillers (Materials), Temperature measurement
Journal Articles

Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials

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Dongliang Zhao, Xin Qian, Xiaokun Gu, Saad Ayub Jajja, Ronggui Yang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. December 2016, 138(4): 040802.
Paper No: EP-16-1067
https://doi.org/10.1115/1.4034605
Published Online: October 6, 2016
View Article titled, Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials
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Topics: Temperature, Thermal conductivity, Thin films, Transients (Dynamics), Heat, Steady state, Sensors, Bulk solids, Thermoreflectance, Lasers
Journal Articles

Nanothermal Interface Materials: Technology Review and Recent Results

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Avram Bar-Cohen, Kaiser Matin, Sreekant Narumanchi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. December 2015, 137(4): 040803.
Paper No: EP-15-1063
https://doi.org/10.1115/1.4031602
Published Online: October 9, 2015
View Article titled, Nanothermal Interface Materials: Technology Review and Recent Results
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Topics: Copper, Cycles, Electrical resistivity, Solders, Teams, Temperature, Testing, Thermal resistance, Bonding, Accelerated life testing
Journal Articles

Double-Sided Transferred Carbon Nanotube Arrays for Improved Thermal Interface Materials

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Andrew J. McNamara, Yogendra Joshi, Zhuomin Zhang, Kyoung-sik Moon, Ziyin Lin, Yagang Yao, Ching-Ping Wong, Wei Lin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2015, 137(3): 031014.
Paper No: EP-14-1043
https://doi.org/10.1115/1.4030802
Published Online: September 1, 2015
View Article titled, Double-Sided Transferred Carbon Nanotube Arrays for Improved Thermal Interface Materials
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Topics: Carbon nanotubes, Steady state, Temperature, Thermal resistance, Solders, Thermal conductivity
Journal Articles

Steady State and Transient Experimentally Validated Analysis of Hybrid Data Centers

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Tianyi Gao, Bahgat Sammakia, Emad Samadiani, Roger Schmidt
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2015, 137(2): 021007.
Paper No: EP-14-1041
https://doi.org/10.1115/1.4029163
Published Online: June 1, 2015
View Article titled, Steady State and Transient Experimentally Validated Analysis of Hybrid Data Centers
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Topics: Cooling, Data centers, Doors, Failure, Heat exchangers, Steady state, Temperature, Water, Cooling systems, Air flow
Journal Articles

Thermal Management of Time-Varying High Heat Flux Electronic Devices

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T. David, D. Mendler, A. Mosyak, A. Bar-Cohen, G. Hetsroni
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2014, 136(2): 021003.
Paper No: EP-13-1064
https://doi.org/10.1115/1.4027325
Published Online: April 29, 2014
View Article titled, Thermal Management of Time-Varying High Heat Flux Electronic Devices
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Topics: Flow (Dynamics), Heat flux, Heat sinks, Microchannels, Temperature, Fluids, Steady state, Vapors, Wall temperature, Boiling
Journal Articles

Two-Phase Flow Control of Electronics Cooling With Pseudo-CPUs in Parallel Flow Circuits: Dynamic Modeling and Experimental Evaluation

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Nicolas Lamaison, Jackson Braz Marcinichen, John Richard Thome
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2013, 135(3): 030908.
Paper No: EP-12-1088
https://doi.org/10.1115/1.4024590
Published Online: July 24, 2013
View Article titled, Two-Phase Flow Control of Electronics Cooling With Pseudo-CPUs in Parallel Flow Circuits: Dynamic Modeling and Experimental Evaluation
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Topics: Cooling, Flow (Dynamics), Heat, Simulation, Transients (Dynamics), Vapors, Two-phase flow, Temperature, Pipes, Steady state
Journal Articles

3D Compact Model of Packaged Thermoelectric Coolers

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Owen Sullivan, Borislav Alexandrov, Saibal Mukhopadhyay, Satish Kumar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2013, 135(3): 031006.
Paper No: EP-13-1006
https://doi.org/10.1115/1.4024653
Published Online: June 24, 2013
View Article titled, 3D Compact Model of Packaged Thermoelectric Coolers
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Topics: Thermoelectric coolers, Cooling, Electronic packages, Steady state, Flat heat pipes
Journal Articles

Thermally Actuated Microswitches: Computation of Power Requirements for Alternate Heating Configurations

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Elham Maghsoudi, Michael James Martin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2013, 135(2): 021011.
Paper No: EP-12-1075
https://doi.org/10.1115/1.4024012
Published Online: April 12, 2013
View Article titled, Thermally Actuated Microswitches: Computation of Power Requirements for Alternate Heating Configurations
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Topics: Heat, Heating, Switches, Displacement, Simulation, Steady state, Bridges (Structures), Boundary-value problems