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Journal Articles

A Contribution to Printed Circuit Boards' Miniaturization by the Vertical Embedding of Passive Components

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Peter Lukacs, Tibor Rovensky, Alexandr Otahal
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2024, 146(1): 011004.
Paper No: EP-23-1005
https://doi.org/10.1115/1.4062470
Published Online: May 18, 2023
View Articletitled, A Contribution to Printed Circuit Boards' Miniaturization by the Vertical Embedding of Passive Components
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Topics: Cross section (Physics), Lead-free solders, Printed circuit boards, Solder joints, Soldering, Solders, Surface mount devices, Capacitors, Dislocations, Reliability
Journal Articles

Process-Factor Optimization of Small-Area Sintered Interconnects for Power Electronics Applications

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Khalid Alzoubi, Alexander Hensel, Felix Häußler, Bettina Ottinger, Marcel Sippel, Jörg Franke
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031008.
Paper No: EP-22-1082
https://doi.org/10.1115/1.4056992
Published Online: March 8, 2023
View Articletitled, Process-Factor Optimization of Small-Area Sintered Interconnects for Power Electronics Applications
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Topics: Electronics, Experimental design, Intermetallic compounds, Optimization, Pressure, Shear strength, Silver, Sintering, Temperature, Failure
Journal Articles

Effect of Different Solder Volumes on the Laser Soldering Process: Numerical and Experimental Investigation

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Zuraihana Bachok, Mohamad Aizat Abas, Muhammad Zaim Hanif Nazarudin, Saifulmajdy A. Zahiri, Mohamad Fikri Mohd Sharif, Fakhrozi Che Ani
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041018.
Paper No: EP-21-1157
https://doi.org/10.1115/1.4054132
Published Online: April 22, 2022
View Articletitled, Effect of Different Solder Volumes on the Laser Soldering Process: Numerical and Experimental Investigation
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Topics: Lasers, Soldering, Solders
Journal Articles

Influence of Laser Soldering Temperatures on Through-Hole Component

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Saifulmajdy A. Zahiri, Aizat Abas, M. F. M. Sharif, Fakhrozi Che Ani
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041006.
Paper No: EP-21-1075
https://doi.org/10.1115/1.4052175
Published Online: November 22, 2021
View Articletitled, Influence of Laser Soldering Temperatures on Through-Hole Component
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Topics: Flow (Dynamics), Lasers, Soldering, Solders, Temperature, Lead-free solders, Finite volume methods, Pressure
Journal Articles

Reliability Analysis of Solder Joints on Rigid-Flexible Printed Circuit Board for MEMS Pressure Sensors Under Combined Temperature Cycle and Vibration Loads With Continuously Monitored Electrical Signals

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Xiaoping Wang, Jun Yang, Xiaogang Liu, Panpan Zheng, Qinglin Song, Bin Song, Sheng Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2022, 144(1): 011005.
Paper No: EP-20-1097
https://doi.org/10.1115/1.4049813
Published Online: August 6, 2021
View Articletitled, Reliability Analysis of Solder Joints on Rigid-Flexible Printed Circuit Board for MEMS Pressure Sensors Under Combined Temperature Cycle and Vibration Loads With Continuously Monitored Electrical Signals
Open the PDF for Reliability Analysis of Solder Joints on Rigid-Flexible Printed Circuit Board for MEMS Pressure Sensors Under Combined Temperature Cycle and Vibration Loads With Continuously Monitored Electrical Signals in another window
Topics: Cycles, Microelectromechanical systems, Modeling, Pressure sensors, Signals, Stress, Temperature, Vibration, Solder joints, Soldering
Journal Articles

Numerical Modeling of the Wave Soldering Process and Experimental Validation

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Violeta Carvalho, Bruno Arcipreste, Delfim Soares, Luís Ribas, Nelson Rodrigues, Senhorinha F. C. F. Teixeira, José Carlos Teixeira
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2022, 144(1): 011011.
Paper No: EP-21-1002
https://doi.org/10.1115/1.4050981
Published Online: August 6, 2021
View Articletitled, Numerical Modeling of the Wave Soldering Process and Experimental Validation
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Topics: Computer simulation, Soldering, Solders, Wave soldering, Waves, Strain measurement, Fluids
Journal Articles

Study on the Die-Attach Voids Distribution With X-Ray and Image Processing Techniques

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Aleksander Sesek, Olga Chambers, Janez Trontelj
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2019, 141(2): 021005.
Paper No: EP-18-1040
https://doi.org/10.1115/1.4042804
Published Online: March 4, 2019
View Articletitled, Study on the Die-Attach Voids Distribution With X-Ray and Image Processing Techniques
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Topics: Image processing, Image segmentation, X-rays, Shapes, Soldering, Edge detection
Journal Articles

Reactive Joining of Thermally and Mechanically Sensitive Materials

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Bastian Rheingans, Roman Furrer, Jürg Neuenschwander, Irina Spies, Axel Schumacher, Stephan Knappmann, Lars P. H. Jeurgens, Jolanta Janczak-Rusch
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041006.
Paper No: EP-18-1016
https://doi.org/10.1115/1.4040978
Published Online: September 10, 2018
View Articletitled, Reactive Joining of Thermally and Mechanically Sensitive Materials
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Topics: Borosilicate glasses, Joining, Solders, Soldering, Tin, Aluminum, Heat, Temperature, Glass, Thermal shock
Journal Articles

Interfacial Compounds Characteristic and Its Reliability Effects on SAC305 Microjoints in Flip Chip Assemblies

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Ye Tian, Ning Ren, Xiaoxia Jian, Tie Geng, Yiping Wu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031007.
Paper No: EP-18-1009
https://doi.org/10.1115/1.4040298
Published Online: June 11, 2018
View Articletitled, Interfacial Compounds Characteristic and Its Reliability Effects on SAC305 Microjoints in Flip Chip Assemblies
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Topics: Flip-chip assemblies, Reliability, Soldering, Tin, Solders, Finite element analysis, Fracture (Materials), Intermetallic compounds
Journal Articles

Structural Size Effect on Mechanical Behavior of Intermetallic Material in Solder Joints: Experimental Investigation

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Leila Ladani, Ousama Abdelhadi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2015, 137(1): 014501.
Paper No: EP-13-1116
https://doi.org/10.1115/1.4027992
Published Online: October 6, 2014
View Articletitled, Structural Size Effect on Mechanical Behavior of Intermetallic Material in Solder Joints: Experimental Investigation
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Topics: Intermetallic compounds, Mechanical properties, Nanoindentation, Solder joints, Tin, Mechanical behavior, Size effect, Elastic moduli, Yield strength, Stress
Journal Articles

Effect of Joint Size on Microstructure and Growth Kinetics of Intermetallic Compounds in Solid-Liquid Interdiffusion Sn3.5Ag/Cu-Substrate Solder Joints

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Ousama M. Abdelhadi, Leila Ladani
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2013, 135(2): 021004.
Paper No: EP-12-1069
https://doi.org/10.1115/1.4023846
Published Online: March 28, 2013
View Articletitled, Effect of Joint Size on Microstructure and Growth Kinetics of Intermetallic Compounds in Solid-Liquid Interdiffusion Sn3.5Ag/Cu-Substrate Solder Joints
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Topics: Solder joints, Soldering, Solders, Temperature, Tin, Intermetallic compounds
Journal Articles

40 μm Silver Flip-Chip Interconnect Technology With Solid-State Bonding

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Chu-Hsuan Sha, Chin C. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031012.
https://doi.org/10.1115/1.4004660
Published Online: September 30, 2011
View Articletitled, 40 μm Silver Flip-Chip Interconnect Technology With Solid-State Bonding
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Topics: Bonding, Flip-chip, Silicon chips, Silver, Soldering, Thermal expansion, Pressure, Copper
Journal Articles

Laser Soldering of Fine Pitch QFP Devices Using Lead-Free Solders

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Zongjie Han, Songbai Xue, Jianxin Wang, Xin Zhang, Shenglin Yu, Liang Zhang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021004.
https://doi.org/10.1115/1.3103932
Published Online: April 1, 2009
View Articletitled, Laser Soldering of Fine Pitch QFP Devices Using Lead-Free Solders
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Topics: Lasers, Lead-free solders, Mechanical properties, Soldering, Solders, Tin, Reflow soldering
Journal Articles

Design for Reliability Applied to Packaging of a MOEMS Switch

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Abiodun A. Fasoro, Manoj Mittal, Dan O. Popa, Dereje A. Agonafer, Harry E. Stephanou
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2008, 130(4): 041003.
https://doi.org/10.1115/1.2993142
Published Online: November 17, 2008
View Articletitled, Design for Reliability Applied to Packaging of a MOEMS Switch
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Topics: Design, Fibers, Microelectromechanical systems, Microoptoelectromechanical systems, Packaging, Reliability, Sealing (Process), Switches, Shear (Mechanics), Solders
Journal Articles

Numerical and Experimental Analysis of Solder Joint Self-Alignment in Fiber Attachment Soldering

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Wei Zhang, Chunqing Wang, Yanhong Tian
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2008, 130(1): 011009.
https://doi.org/10.1115/1.2837518
Published Online: February 12, 2008
View Articletitled, Numerical and Experimental Analysis of Solder Joint Self-Alignment in Fiber Attachment Soldering
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Topics: Fibers, Solder joints, Soldering, Solders, Surface tension, Geometry, Shapes, Equilibrium (Physics), Yaw
Journal Articles

Environment-Friendly Electronics: Lead-Free Technology

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ANTHONY J. RAFANELLI
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. December 2005, 127(4): 537–538.
https://doi.org/10.1115/1.2070093
Published Online: December 1, 2005
View Articletitled, Environment-Friendly Electronics: Lead-Free Technology
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Topics: Alloys, Electronics, Lead-free solders, Solders, Electronic packaging, Soldering, Tin, Low cycle fatigue
Journal Articles

Hygrothermal Cracking Analysis of Plastic IC Package

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Ji Hyuck Yang, Kang Yong Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 164–171.
https://doi.org/10.1115/1.1870016
Published Online: June 8, 2004
View Articletitled, Hygrothermal Cracking Analysis of Plastic IC Package
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Topics: Delamination, Fracture (Materials), Fracture (Process), Fracture mechanics, High temperature, Reflow soldering, Vapor pressure, Viscoelasticity, Low temperature, Design
Journal Articles

CAPP for Electronics Manufacturing Case Study: Fine Pitch SMT Laser Soldering

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Ismail Fidan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2004, 126(1): 173–176.
https://doi.org/10.1115/1.1646422
Published Online: April 30, 2004
View Articletitled, CAPP for Electronics Manufacturing Case Study: Fine Pitch SMT Laser Soldering
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Topics: Electronics, Lasers, Manufacturing, Printed circuit board assemblies, Reliability, Soldering, Solders, Computer-aided engineering, Production planning, Solder joints
Journal Articles

Open Defects in PBGA Assembly Solder Joints

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S. H. Fan, Y. C. Chan, J. K. L. Lai
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2003, 125(1): 157–161.
https://doi.org/10.1115/1.1536951
Published Online: March 14, 2003
View Articletitled, Open Defects in PBGA Assembly Solder Joints
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Topics: Manufacturing, Solder joints, Solders, Soldering, Inspection, Thermal stability, Wetting, Printing
Journal Articles

Solders and Soldering

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Howard H. Manko,, Author, Anthony J. Rafanelli,, Reviewer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. September 2002, 124(3): 314.
https://doi.org/10.1115/1.1503063
Published Online: July 26, 2002
View Articletitled, Solders and Soldering
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Topics: Soldering, Solders, Alloys, Materials properties