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Journal Articles

A Kriging Surrogate Model for Ball Grid Array Electronic Packaging With Stochastic Material and Geometrical Parameters

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Liu Chu, Jiajia Shi, Eduardo Souza de Cursi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2025, 147(1): 011003.
Paper No: EP-23-1089
https://doi.org/10.1115/1.4065079
Published Online: May 20, 2024
View Articletitled, A Kriging Surrogate Model for Ball Grid Array Electronic Packaging With Stochastic Material and Geometrical Parameters
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Topics: Ball-Grid-Array packaging, Electronic packaging, Finite element model, Resonance, Vibration, Solders
Journal Articles

A Time Frequency Domain Based Approach for Ball Grid Array Solder Joint Fatigue Analysis Using Global Local Modeling Technique

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Sushil Doranga, Dongji Xie, Jeffrey Lee, Andy Zhang, Xue Shi, Valeriy Khaldarov
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031007.
Paper No: EP-22-1070
https://doi.org/10.1115/1.4056886
Published Online: March 7, 2023
View Articletitled, A Time Frequency Domain Based Approach for Ball Grid Array Solder Joint Fatigue Analysis Using Global Local Modeling Technique
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Topics: Excitation, Fatigue life, Fatigue testing, Finite element analysis, Finite element model, Modeling, Resonance, Simulation, Solder joints, Stress
Journal Articles

Accelerated Vibration Reliability Testing of Electronic Assemblies Using Sine Dwell With Resonance Tracking

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Quang T. Su, Mohammad A. Gharaibeh, Aaron J. Stewart, James M. Pitarresi, Martin K. Anselm
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041004.
Paper No: EP-17-1062
https://doi.org/10.1115/1.4040923
Published Online: August 20, 2018
View Articletitled, Accelerated Vibration Reliability Testing of Electronic Assemblies Using Sine Dwell With Resonance Tracking
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Topics: Deflection, Failure, Failure analysis, Finite element analysis, Finite element model, Manufacturing, Reliability, Resonance, Solder joints, Solders
Journal Articles

Influence of Secondary Impact on Printed Wiring Assemblies—Part II: Competing Failure Modes in Surface Mount Components

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Jingshi Meng, Abhijit Dasgupta
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2017, 139(3): 031001.
Paper No: EP-15-1102
https://doi.org/10.1115/1.4036187
Published Online: June 14, 2017
View Articletitled, Influence of Secondary Impact on Printed Wiring Assemblies—Part II: Competing Failure Modes in Surface Mount Components
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Topics: Failure, Failure mechanisms, Microelectromechanical systems, Printed circuit boards, Stress, Resonance, Clearances (Engineering), Vibration, Finite element analysis, Electrical wires
Journal Articles

Three-Dimensional Printed Dielectric Substrates for Radio Frequency Applications

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Vana Snigdha Tummala, Ahsan Mian, Nowrin H. Chamok, Dhruva Poduval, Mohammod Ali, Jallisa Clifford, Prasun Majumdar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2017, 139(2): 020904.
Paper No: EP-16-1137
https://doi.org/10.1115/1.4036384
Published Online: June 12, 2017
View Articletitled, Three-Dimensional Printed Dielectric Substrates for Radio Frequency Applications
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Topics: Additive manufacturing, Density, Dimensions, X-rays, Resonance, Microscopy, Manufacturing, Porosity, Design
Journal Articles

Optimization of Microwave Packaging Structure for Directly Modulated Laser Modules Using Three-Dimensional Electromagnetic Model

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Wei Han, Marc Rensing, Peter O’Brien, Frank H. Peters
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2011, 133(4): 044502.
https://doi.org/10.1115/1.4005292
Published Online: December 9, 2011
View Articletitled, Optimization of Microwave Packaging Structure for Directly Modulated Laser Modules Using Three-Dimensional Electromagnetic Model
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Topics: Lasers, Manufacturing, Microwaves, Optimization, Packaging, Reflection, Resonance, Strip transmission lines, Simulation results, Simulation
Journal Articles

Nonlinear Dynamics Analysis of a Laminated Printed Wiring Board

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Xiaoling He, Robert E. Fulton, Fellow ASME Professor
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2002, 124(2): 77–84.
https://doi.org/10.1115/1.1457454
Published Online: May 2, 2002
View Articletitled, Nonlinear Dynamics Analysis of a Laminated Printed Wiring Board
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Topics: Deflection, Laminates, Printed circuit boards, Stress, Nonlinear dynamics, Stress analysis (Engineering), Deformation, Equations of motion, Resonance
Journal Articles

Predicted Fundamental Vibration Frequency of a Heavy Electronic Component Mounted on a Printed Circuit Board

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Ephraim Suhir, Fellow ASME
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2000, 122(1): 3–5.
https://doi.org/10.1115/1.483134
Published Online: August 31, 1999
View Articletitled, Predicted Fundamental Vibration Frequency of a Heavy Electronic Component Mounted on a Printed Circuit Board
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Topics: Electronic components, Oscillating frequencies, Oscillations, Printed circuit boards, Vibration, Stiffness, Resonance, Fatigue, Free vibrations
Journal Articles

Analytical Derivation of the Self-Alignment Motion of Flip Chip Soldered Components

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N. van Veen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1999, 121(2): 116–121.
https://doi.org/10.1115/1.2792665
Published Online: June 1, 1999
View Articletitled, Analytical Derivation of the Self-Alignment Motion of Flip Chip Soldered Components
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Topics: Damping, Flip-chip, Flip-chip devices, Potential energy, Resonance, Solders
Journal Articles

Random Change of Vibration Modes in Thermosonic Bonding

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S.-Y. Kang, K. Chuang, Y. C. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1998, 120(3): 253–258.
https://doi.org/10.1115/1.2792630
Published Online: September 1, 1998
View Articletitled, Random Change of Vibration Modes in Thermosonic Bonding
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Topics: Bonding, Vibration, Friction, End effectors, Excitation, Flip-chip assemblies, Generators, Modal analysis, Process control, Resonance