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Journal Articles

Reliability of State-of-Health of the Flexible Li-Ion Batteries Under Various Flexing Conditions and Calendar Aging

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Pradeep Lall, Hyesoo Jang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011108.
Paper No: EP-22-1030
https://doi.org/10.1115/1.4056412
Published Online: December 23, 2022
View Article titled, Reliability of State-of-Health of the Flexible Li-Ion Batteries Under Various Flexing Conditions and Calendar Aging
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Topics: Batteries, Cycles, Lithium-ion batteries, Machine learning, Regression models, Reliability, Stress
Journal Articles

Effect of U-Flex-to-Install and Dynamic U-Flexing on Li-Ion Battery State of Health Degradation Subjected to Varying Fold Orientations, Folding Speeds, Depths of Charge, C-Rates, and Temperatures

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Pradeep Lall, Ved Soni, Scott Miller
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021112.
Paper No: EP-21-1058
https://doi.org/10.1115/1.4052750
Published Online: January 4, 2022
View Article titled, Effect of U-Flex-to-Install and Dynamic U-Flexing on Li-Ion Battery State of Health Degradation Subjected to Varying Fold Orientations, Folding Speeds, Depths of Charge, C-Rates, and Temperatures
Open the PDF for Effect of U-Flex-to-Install and Dynamic U-Flexing on Li-Ion Battery State of Health Degradation Subjected to Varying Fold Orientations, Folding Speeds, Depths of Charge, C-Rates, and Temperatures in another window
Topics: Batteries, Cycles, Lithium-ion batteries, Temperature, Regression models, Operating temperature, Reliability
Journal Articles

Acceleration Factor Modeling of Flexible Electronic Substrates From Actual Human Body Measurements

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Pradeep Lall, Tony Thomas, Vikas Yadav, Jinesh Narangaparambil, Wei Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041113.
Paper No: EP-20-1037
https://doi.org/10.1115/1.4047579
Published Online: July 10, 2020
View Article titled, Acceleration Factor Modeling of Flexible Electronic Substrates From Actual Human Body Measurements
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Topics: Cycles, Failure, Flexible electronics, Modeling, Reliability, Electronics, Regression models, Failure analysis
Journal Articles

Norris–Landzberg Acceleration Factors and Goldmann Constants for SAC305 Lead-Free Electronics

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Pradeep Lall, Aniket Shirgaokar, Dinesh Arunachalam
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2012, 134(3): 031008.
https://doi.org/10.1115/1.4006863
Published Online: July 19, 2012
View Article titled, Norris–Landzberg Acceleration Factors and Goldmann Constants for SAC305 Lead-Free Electronics
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Topics: Cycles, Eigenvalues, Electronics, Failure, Model development, Reliability, Solders, Temperature, Thermal expansion, Thermomechanics
Journal Articles

Warpage Analysis of Underfilled Wafers

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Hai Ding, I. Charles Ume, Cheng Zhang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 265–270.
https://doi.org/10.1115/1.1707036
Published Online: July 8, 2004
View Article titled, Warpage Analysis of Underfilled Wafers
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Topics: Finite element analysis, Semiconductor wafers, Shades and shadows, Warping, Young's modulus, Design, Regression analysis, Regression models
Journal Articles

Maximizing Solder Joint Reliability Through Optimal Shape Design

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A. M. Deshpande, G. Subbarayan, R. L. Mahajan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1997, 119(3): 149–155.
https://doi.org/10.1115/1.2792227
Published Online: September 1, 1997
View Article titled, Maximizing Solder Joint Reliability Through Optimal Shape Design
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Topics: Reliability, Shape optimization, Solder joints, Optimization, Approximation, Design, Electronic packages, Fatigue life, Artificial neural networks, Ball-Grid-Array packaging
Journal Articles

A Fractional-Factorial Numerical Technique for Stress Analysis of Glass-To-Metal Lead Seals

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Barry Mathieu, Abhijit Dasgupta
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1994, 116(2): 98–104.
https://doi.org/10.1115/1.2905512
Published Online: June 1, 1994
View Article titled, A Fractional-Factorial Numerical Technique for Stress Analysis of Glass-To-Metal Lead Seals
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Topics: Glass, Metals, Stress analysis (Engineering), Stress, Design, Experimental design, Fracture (Materials), Fracture (Process), Geometry, Simulation