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Journal Articles

A Contribution to Printed Circuit Boards' Miniaturization by the Vertical Embedding of Passive Components

Peter Lukacs, Tibor Rovensky, Alexandr Otahal
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2024, 146(1): 011004.
Paper No: EP-23-1005
https://doi.org/10.1115/1.4062470
Published Online: May 18, 2023
View Article titled, A Contribution to Printed Circuit Boards' Miniaturization by the Vertical Embedding of Passive Components
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Topics: Cross section (Physics), Lead-free solders, Printed circuit boards, Solder joints, Soldering, Solders, Surface mount devices, Capacitors, Dislocations, Reliability
Journal Articles

Electrical Reliability of Flexible Silicon Package Integrated on Polymer Substrate During Repeated Bending Deformations

Tae-Wook Kim, Jae-Min Kim, Hyeon-Ji Yun, Jong-Sung Lee, Jae-Hak Lee, Jun-Yeob Song, Young-Chang Joo, Won-Jun Lee, Byoung-Joon Kim
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041017.
Paper No: EP-21-1014
https://doi.org/10.1115/1.4054183
Published Online: April 22, 2022
View Article titled, Electrical Reliability of Flexible Silicon Package Integrated on Polymer Substrate During Repeated Bending Deformations
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Topics: Deformation, Electrical resistance, Fatigue, Metals, Molding, Polymers, Reliability, Silicon, Simulation, Stress
Includes: Supplementary data
Journal Articles

Fabrication and Reliability Assessment of Cu Pillar Microbumps With Printed Polymer Cores

Xing Qiu, Jeffery C. C. Lo, Yuanjie Cheng, S. W. Ricky Lee, Yong Jhe Tseng, Peter Chiu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2021, 143(3): 031010.
Paper No: EP-20-1102
https://doi.org/10.1115/1.4049129
Published Online: January 19, 2021
View Article titled, Fabrication and Reliability Assessment of Cu Pillar Microbumps With Printed Polymer Cores
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Topics: Columns (Structural), Manufacturing, Polymers, Reliability, Temperature, Silicon chips, Bonding
Journal Articles

Demonstration of a Compliant Microspring Array as a Thermal Interface Material for Pluggable Optoelectronic Transceiver Modules

Jin Cui, Liang Pan, Justin A. Weibel
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031114.
Paper No: EP-19-1110
https://doi.org/10.1115/1.4047356
Published Online: June 8, 2020
View Article titled, Demonstration of a Compliant Microspring Array as a Thermal Interface Material for Pluggable Optoelectronic Transceiver Modules
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Topics: Heat sinks, Polymers, Surface roughness, Pressure, Thermal conductivity, Thermal resistance
Journal Articles

Mechanical Characterization of Embedded Serpentine Conductors in Wearable Electronics

Chong Ye, Charles I. Ume, Suresh K. Sitaraman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2020, 142(2): 021007.
Paper No: EP-19-1085
https://doi.org/10.1115/1.4046163
Published Online: March 9, 2020
View Article titled, Mechanical Characterization of Embedded Serpentine Conductors in Wearable Electronics
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Topics: Carbon, Electronics, Finite element analysis, Polymers, Strips, Simulation, Textiles, Mechanical properties
Journal Articles

Assessment of Elastic–Plastic and Electrical Properties of Printed Silver-Based Interconnects for Flexible Electronics

Hsien-Chie Cheng, Ruei-You Hong, Wen-Hwa Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041007.
Paper No: EP-18-1041
https://doi.org/10.1115/1.4041014
Published Online: September 10, 2018
View Article titled, Assessment of Elastic–Plastic and Electrical Properties of Printed Silver-Based Interconnects for Flexible Electronics
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Topics: Dimensional analysis, Electrical properties, Finite element analysis, Flexible electronics, Inks, Modeling, Plasticity, Silver, Simulation, Stress
Journal Articles

Ball Grid Array Interconnection Properties of Solderable Polymer–Solder Composites With Low-Melting-Point Alloy Fillers

Byung-Seung Yim, Young-Eui Shin, Jong-Min Kim
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2017, 139(4): 041007.
Paper No: EP-17-1007
https://doi.org/10.1115/1.4038028
Published Online: October 13, 2017
View Article titled, Ball Grid Array Interconnection Properties of Solderable Polymer–Solder Composites With Low-Melting-Point Alloy Fillers
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Topics: Ball-Grid-Array packaging, Composite materials, Fillers (Materials), Solders, Wetting, Polymers, Melting, Statistical process control, Flow (Dynamics)
Journal Articles

Display Light Guide Swelling Due to Moisture Absorption

A. K. Cousins, G. H. Thiel, E. Wolak, G. Limaye, S. Tiku
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2017, 139(4): 041006.
Paper No: EP-17-1070
https://doi.org/10.1115/1.4037971
Published Online: October 5, 2017
View Article titled, Display Light Guide Swelling Due to Moisture Absorption
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Topics: Absorption, Diffusion (Physics), Water, Water absorption, Polymers
Journal Articles

Moisture Ingress, Behavior, and Prediction Inside Semiconductor Packaging: A Review

Bongtae Han, Dae-Suk Kim
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. March 2017, 139(1): 010802.
Paper No: EP-16-1107
https://doi.org/10.1115/1.4035598
Published Online: January 16, 2017
View Article titled, Moisture Ingress, Behavior, and Prediction Inside Semiconductor Packaging: A Review
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Topics: Diffusion (Physics), Polymers, Temperature, Cavities, Semiconductors (Materials), Packaging, Water, Vapor pressure
Journal Articles

Decomposable and Template Polymers: Fundamentals and Applications

Erdal Uzunlar, Jared Schwartz, Oluwadamilola Phillips, Paul A. Kohl
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. June 2016, 138(2): 020802.
Paper No: EP-16-1018
https://doi.org/10.1115/1.4033000
Published Online: April 19, 2016
View Article titled, Decomposable and Template Polymers: Fundamentals and Applications
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Topics: Polymers, Temperature, Ceilings
Journal Articles

Quantum Dots-Converted Light-Emitting Diodes Packaging for Lighting and Display: Status and Perspectives

Bin Xie, Run Hu, Xiaobing Luo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. June 2016, 138(2): 020803.
Paper No: EP-16-1020
https://doi.org/10.1115/1.4033143
Published Online: April 19, 2016
View Article titled, Quantum Dots-Converted Light-Emitting Diodes Packaging for Lighting and Display: Status and Perspectives
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Topics: Light-emitting diodes, Packaging, Polymers
Journal Articles

Impact Isolation Through the Use of Compliant Interconnects for Microelectronic Packages

Wei Chen, Anirudh Bhat, Suresh K. Sitaraman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2015, 137(4): 041005.
Paper No: EP-14-1064
https://doi.org/10.1115/1.4031680
Published Online: October 12, 2015
View Article titled, Impact Isolation Through the Use of Compliant Interconnects for Microelectronic Packages
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Topics: Displacement, Manufacturing, Polymers, Simulation, Testing, Accelerometers, Engineering simulation, Strain gages, Finite element analysis, Engineering prototypes
Journal Articles

Size-Compatible, Polymer-Based Air-Gap Formation Processes, and Polymer Residue Analysis for Wafer-Level MEMS Packaging Applications

Erdal Uzunlar, Paul A. Kohl
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2015, 137(4): 041001.
Paper No: EP-14-1114
https://doi.org/10.1115/1.4030952
Published Online: July 23, 2015
View Article titled, Size-Compatible, Polymer-Based Air-Gap Formation Processes, and Polymer Residue Analysis for Wafer-Level MEMS Packaging Applications
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Topics: MEMS packaging, Microelectromechanical systems, Polymers, Temperature, Semiconductor wafers, Reactive-ion etching, Nuclear magnetic resonance, Hardening (Curing)
Journal Articles

Advances in the Fabrication Processes and Applications of Wafer Level Packaging

Peisheng Liu, Jinlan Wang, Liangyu Tong, Yujuan Tao
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technology Review
J. Electron. Packag. June 2014, 136(2): 024002.
Paper No: EP-14-1006
https://doi.org/10.1115/1.4027397
Published Online: April 29, 2014
View Article titled, Advances in the Fabrication Processes and Applications of Wafer Level Packaging
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Topics: Manufacturing, Packaging, Reliability, Semiconductor wafers, Microelectromechanical systems, Solders, Solder joints, Copper, Polymers
Journal Articles

Hygrothermal Behavior of Advanced Polymers Above Water Boiling Temperatures

Changsoo Jang, Bongtae Han
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2014, 136(1): 011013.
Paper No: EP-13-1091
https://doi.org/10.1115/1.4026626
Published Online: February 18, 2014
View Article titled, Hygrothermal Behavior of Advanced Polymers Above Water Boiling Temperatures
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Topics: Boiling, Polymers, Temperature, Water, Weight (Mass), Glass transition, Absorption
Journal Articles

Advanced Methodologies for Developing Improved Potted Smart Munitions for High-G Applications

Nien-Hua Chao, John A. Dispenza, Mario DeAngelis
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2013, 135(3): 031002.
Paper No: EP-12-1077
https://doi.org/10.1115/1.4024301
Published Online: June 4, 2013
View Article titled, Advanced Methodologies for Developing Improved Potted Smart Munitions for High-G Applications
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Topics: Polymers, Density, Munitions, Temperature
Journal Articles

Direct-Write Stretchable Sensors Using Single-Walled Carbon Nanotube/Polymer Matrix

Morteza Vatani, Yanfeng Lu, Kye-Shin Lee, Ho-Chan Kim, Jae-Won Choi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2013, 135(1): 011009.
Paper No: EP-12-1041
https://doi.org/10.1115/1.4023293
Published Online: February 26, 2013
View Article titled, Direct-Write Stretchable Sensors Using Single-Walled Carbon Nanotube/Polymer Matrix
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Topics: Sensors, Single-walled carbon nanotubes, Polymers, Wire, Electronics
Journal Articles

Embedded Three-Dimensional Hybrid Integrated Circuit Integration System-in-Package With Through-Silicon Vias for Opto-Electronic Interconnects in Organic Substrates/Printed Circuit Boards

John H. Lau, M. S. Zhang, S. W. Ricky Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031010.
https://doi.org/10.1115/1.4004861
Published Online: September 26, 2011
View Article titled, Embedded Three-Dimensional Hybrid Integrated Circuit Integration System-in-Package With Through-Silicon Vias for Opto-Electronic Interconnects in Organic Substrates/Printed Circuit Boards
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Topics: Design, Polymers, System-in-package, Waveguides, Simulation, Printed circuit boards, Optical interconnections, Integrated circuits, Engineering simulation, Heat
Journal Articles

Oxidized Graphite Nanoplatelets as an Improved Filler for Thermally Conducting Epoxy-Matrix Composites

Xiaobo Sun, Aiping Yu, Palanisamy Ramesh, Elena Bekyarova, Mikhail E. Itkis, Robert C. Haddon
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Carbon Nanotubes
J. Electron. Packag. June 2011, 133(2): 020905.
https://doi.org/10.1115/1.4003988
Published Online: June 7, 2011
View Article titled, Oxidized Graphite Nanoplatelets as an Improved Filler for Thermally Conducting Epoxy-Matrix Composites
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Topics: Carbon nanotubes, Composite materials, Epoxy adhesives, Epoxy resins, Fillers (Materials), Graphite, Oxidation, Particle size, Polymers, Thermal conductivity
Journal Articles

Hygro-Thermo-Mechanical Reliability Assessment of a Thermal Interface Material for a Ball Grid Array Package Assembly

Xi Liu, Jiantao Zheng, Suresh K. Sitaraman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2010, 132(2): 021004.
https://doi.org/10.1115/1.4001746
Published Online: June 11, 2010
View Article titled, Hygro-Thermo-Mechanical Reliability Assessment of a Thermal Interface Material for a Ball Grid Array Package Assembly
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Topics: Finite element analysis, Manufacturing, Model validation, Reliability, Temperature, Warping, Laminates, Weight (Mass), Lasers, Thermomechanics