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Journal Articles

Electrochemical Additive Manufacturing-Based Design of a Heat Sink for Single-Phase Natural Convection Immersion Cooling Application

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Jacob Lamotte-Dawaghreh, Joseph Herring, Sai Abhideep Pundla, Rohit Suthar, Vivek Nair, Pratik Bansode, Gautam Gupta, Dereje Agonafer, Joseph Madril, Tim Ouradnik, Michael Matthews, Ian Winfield
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041113.
Paper No: EP-24-1048
https://doi.org/10.1115/1.4065987
Published Online: August 9, 2024
View Articletitled, Electrochemical Additive Manufacturing-Based Design of a Heat Sink for Single-Phase Natural Convection Immersion Cooling Application
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Topics: Computational fluid dynamics, Cooling, Design, Heat sinks, Natural convection, Temperature, Triply periodic minimal surfaces, Manufacturing, Porosity
Journal Articles

Thermal Analysis and Optimization of Light-Emitting Diodes Filament Lamp

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Jie Liu, Jinglong Zou, Sheng Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2021, 143(1): 011003.
Paper No: EP-19-1078
https://doi.org/10.1115/1.4046762
Published Online: June 4, 2020
View Articletitled, Thermal Analysis and Optimization of Light-Emitting Diodes Filament Lamp
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Topics: Energy dissipation, Heat, Light-emitting diodes, Optimization, Phosphors, Temperature, Junctions, Natural convection, Thermal analysis, Fins
Journal Articles

Experimental Performance of a Completely Passive Thermosyphon Cooling System Rejecting Heat by Natural Convection Using the Working Fluids R1234ze, R1234yf, and R134a

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Filippo Cataldo, John Richard Thome
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2018, 140(2): 021002.
Paper No: EP-17-1125
https://doi.org/10.1115/1.4039706
Published Online: May 9, 2018
View Articletitled, Experimental Performance of a Completely Passive Thermosyphon Cooling System Rejecting Heat by Natural Convection Using the Working Fluids R1234ze, R1234yf, and R134a
Open the PDF for Experimental Performance of a Completely Passive Thermosyphon Cooling System Rejecting Heat by Natural Convection Using the Working Fluids R1234ze, R1234yf, and R134a in another window
Topics: Flow (Dynamics), Fluids, Heat, Refrigerants, Condensers (steam plant), Stress, Cooling systems, Temperature, Design, Natural convection
Journal Articles

Embarked Quad Flat Nonlead 16, 32, and 64 Electronic Devices Subjected to Free Convection: Influence of the Adhesive Paste on the Junction Temperature

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Abderrahmane Baïri, Bruno Chanetz, J. A. Millán-García
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2017, 139(4): 041009.
Paper No: EP-16-1124
https://doi.org/10.1115/1.4038113
Published Online: October 25, 2017
View Articletitled, Embarked Quad Flat Nonlead 16, 32, and 64 Electronic Devices Subjected to Free Convection: Influence of the Adhesive Paste on the Junction Temperature
Open the PDF for Embarked Quad Flat Nonlead 16, 32, and 64 Electronic Devices Subjected to Free Convection: Influence of the Adhesive Paste on the Junction Temperature in another window
Topics: Adhesives, Junctions, Natural convection, Reliability, Temperature, Thermal conductivity, Packaging
Journal Articles

A Method for Thermal Performance Characterization of Ultrathin Vapor Chambers Cooled by Natural Convection

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Gaurav Patankar, Simone Mancin, Justin A. Weibel, Suresh V. Garimella, Mark A. MacDonald
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 010903.
Paper No: EP-15-1083
https://doi.org/10.1115/1.4032345
Published Online: March 10, 2016
View Articletitled, A Method for Thermal Performance Characterization of Ultrathin Vapor Chambers Cooled by Natural Convection
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Topics: Calibration, Condensers (steam plant), Copper, Flat heat pipes, Heat, Heat losses, Natural convection, Temperature, Thermal resistance, Vapors
Journal Articles

Natural Convection Immersion Cooling With Enhanced Optical Performance of Light-Emitting Diode Systems

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Enes Tamdogan, Mehmet Arik
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2015, 137(4): 041006.
Paper No: EP-14-1089
https://doi.org/10.1115/1.4031480
Published Online: October 15, 2015
View Articletitled, Natural Convection Immersion Cooling With Enhanced Optical Performance of Light-Emitting Diode Systems
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Topics: Cooling, Heat transfer, Light-emitting diodes, Natural convection, Silicones, Heat conduction, Convection, Fluids, Domes (Structural elements), Coolants
Journal Articles

Advanced Natural Convection Cooling Designs for Light-Emitting Diode Bulb Systems

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James Petroski
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2014, 136(4): 041005.
Paper No: EP-13-1106
https://doi.org/10.1115/1.4028331
Published Online: September 19, 2014
View Articletitled, Advanced Natural Convection Cooling Designs for Light-Emitting Diode Bulb Systems
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Topics: Cooling, Design, Heat sinks, Natural convection, Light-emitting diodes
Journal Articles

Performance of Hybrid Fin Heat Sinks for Thermal Control of Light Emitting Diode Lighting Modules

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Kyoung Joon Kim
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2014, 136(1): 011002.
Paper No: EP-13-1047
https://doi.org/10.1115/1.4025673
Published Online: November 22, 2013
View Articletitled, Performance of Hybrid Fin Heat Sinks for Thermal Control of Light Emitting Diode Lighting Modules
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Topics: Forced convection, Heat sinks, Light-emitting diodes, Natural convection, Temperature, Heat
Journal Articles

Thermal Assessment of Naturally Cooled Electronic Enclosures With Rectangular Fins

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A. Tamayol, F. McGregor, M. Bahrami
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2012, 134(3): 034501.
https://doi.org/10.1115/1.4007077
Published Online: July 24, 2012
View Articletitled, Thermal Assessment of Naturally Cooled Electronic Enclosures With Rectangular Fins
Open the PDF for Thermal Assessment of Naturally Cooled Electronic Enclosures With Rectangular Fins in another window
Topics: Fins, Heat transfer, Natural convection, Radiation (Physics), Temperature
Journal Articles

Bio-inspired Passive Skin Cooling for Handheld Microelectronics Devices

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Zhi Huang, Xinsheng Zhang, Ming Zhou, Xiaoding Xu, Xianzheng Zhang, Xuejiao Hu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2012, 134(1): 014501.
https://doi.org/10.1115/1.4005908
Published Online: March 19, 2012
View Articletitled, Bio-inspired Passive Skin Cooling for Handheld Microelectronics Devices
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Topics: Biomimetics, Cooling, Energy dissipation, Heat, Microelectronic devices, Skin, Temperature, Natural convection
Journal Articles

Development of Delphi-Type Compact Thermal Models for Opto-Electronic Packages

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Arun Prakash Raghupathy, John Janssen, Attila Aranyosi, Urmila Ghia, Karman Ghia, William Maltz
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2011, 133(1): 011003.
https://doi.org/10.1115/1.4003217
Published Online: March 3, 2011
View Articletitled, Development of Delphi-Type Compact Thermal Models for Opto-Electronic Packages
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Topics: Boundary-value problems, Errors, Flow (Dynamics), Heat, Junctions, Natural convection, Temperature, Computational fluid dynamics, Optimization, Forced convection
Journal Articles

CFD-Assisted Optimization of Chimneylike Flows to Cool an Electronic Device

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Varghese Panthalookaran
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2010, 132(3): 031007.
https://doi.org/10.1115/1.4002009
Published Online: September 9, 2010
View Articletitled, CFD-Assisted Optimization of Chimneylike Flows to Cool an Electronic Device
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Topics: Computational fluid dynamics, Cooling, Energy dissipation, Flow (Dynamics), Heat, Temperature, Natural convection, MOSFET transistors, Separation (Technology), Optimization
Journal Articles

Digital Moiré Subtraction Interferometry (DMS) for Electronics Cooling Applications in Enclosures

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David Newport, Colin Forno, Maurice Whelan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2010, 132(3): 031001.
https://doi.org/10.1115/1.4002161
Published Online: September 8, 2010
View Articletitled, Digital Moiré Subtraction Interferometry (DMS) for Electronics Cooling Applications in Enclosures
Open the PDF for Digital Moiré Subtraction Interferometry (DMS) for Electronics Cooling Applications in Enclosures in another window
Topics: Cylinders, Interferometers, Interferometry, Temperature, Flow (Dynamics), Cooling, Thermal conductivity, Natural convection, Computer cooling
Journal Articles

Chimney Effect on Natural Convection Cooling of a Transistor Mounted on a Cooling Fin

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G. De Mey, M. Wójcik, J. Pilarski, M. Lasota, J. Banaszczyk, B. Vermeersch, A. Napieralski, M. De Paepe
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2009, 131(1): 014501.
https://doi.org/10.1115/1.3068307
Published Online: February 12, 2009
View Articletitled, Chimney Effect on Natural Convection Cooling of a Transistor Mounted on a Cooling Fin
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Topics: Cooling, Natural convection, Thermal resistance, Transistors, Junctions
Journal Articles

Enhancement of Cooling Characteristics for Electronic Cooling by Modifying Substrate Under Natural Convection

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Yung-Shin Tseng, Tzu-Chen Hung, Bau-Shei Pei
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2008, 130(1): 011006.
https://doi.org/10.1115/1.2837524
Published Online: January 31, 2008
View Articletitled, Enhancement of Cooling Characteristics for Electronic Cooling by Modifying Substrate Under Natural Convection
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Topics: Computational fluid dynamics, Cooling, Heat transfer, Natural convection, Temperature, Flow (Dynamics), Thermal resistance, Computer cooling, Simulation
Journal Articles

Thermal Behavior of Nominally Flat Silicon-Based Heat Spreaders

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Ta-Wei Lin, Ming-Chang Wu, Cheng-Hsien Peng, Po-Li Chen, Ying-Huei Hung
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 370–379.
https://doi.org/10.1115/1.2351902
Published Online: December 24, 2005
View Articletitled, Thermal Behavior of Nominally Flat Silicon-Based Heat Spreaders
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Topics: Flat heat pipes, Silicon, Surface roughness, Thermal resistance, Natural convection, Heat transfer, Heat
Journal Articles

Modeling of Natural Convection in Electronic Enclosures

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Peter M. Teertstra, M. Michael Yovanovich, J. Richard Culham
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2006, 128(2): 157–165.
https://doi.org/10.1115/1.2188953
Published Online: September 28, 2005
View Articletitled, Modeling of Natural Convection in Electronic Enclosures
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Topics: Boundary layers, Computational fluid dynamics, Convection, Engineering simulation, Heat conduction, Natural convection, Shapes, Simulation, Flow (Dynamics), Model validation
Journal Articles

Meso Scale Pulsating Jets for Electronics Cooling

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Jivtesh Garg, Mehmet Arik, Stanton Weaver, Todd Wetzel, Seyed Saddoughi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 503–511.
https://doi.org/10.1115/1.2065727
Published Online: April 20, 2005
View Articletitled, Meso Scale Pulsating Jets for Electronics Cooling
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Topics: Heat, Heat flux, Heat transfer, Heat transfer coefficients, Jets, Natural convection, Temperature, Temperature measurement, Thermal management, Cooling
Journal Articles

Evaluation of Thermal Enhancements to Flip-Chip-Plastic Ball Grid Array Packages

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K. Ramakrishna, Fellow ASME,, T.-Y. Tom Lee, Mem. ASME,
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 449–456.
https://doi.org/10.1115/1.1827260
Published Online: January 24, 2005
View Articletitled, Evaluation of Thermal Enhancements to Flip-Chip-Plastic Ball Grid Array Packages
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Topics: Flat heat pipes, Forced convection, Mixed convection, Natural convection, Printed circuit boards, Thermal conductivity, Thermal resistance, Heat transfer, Copper, Junctions
Journal Articles

Chimney Effect on Natural Air Cooling of Electronic Equipment Under Inclination

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Yoji Kitamura, Masaru Ishizuka
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 423–428.
https://doi.org/10.1115/1.1827256
Published Online: January 24, 2005
View Articletitled, Chimney Effect on Natural Air Cooling of Electronic Equipment Under Inclination
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Topics: Cooling, Electronic equipment, Temperature, Natural convection, Flow (Dynamics), Computer simulation