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Journal Articles

Modified Body Force Model for Air Flow Through Perforated Floor Tiles in Data Centers

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Vaibhav K. Arghode, Yogendra Joshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2016, 138(3): 031002.
Paper No: EP-15-1116
https://doi.org/10.1115/1.4033464
Published Online: May 16, 2016
View Articletitled, Modified Body Force Model for Air Flow Through Perforated Floor Tiles in Data Centers
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Topics: Momentum, Tiles, Air flow, Pressure, Flow (Dynamics), Data centers
Journal Articles

Room Level Modeling of Air Flow in a Contained Data Center Aisle

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Vaibhav K. Arghode, Yogendra Joshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2014, 136(1): 011011.
Paper No: EP-13-1087
https://doi.org/10.1115/1.4026540
Published Online: February 14, 2014
View Articletitled, Room Level Modeling of Air Flow in a Contained Data Center Aisle
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Topics: Air entrainment, Air flow, Containment, Data centers, Flow (Dynamics), Modeling, Temperature, Tiles, Momentum, Resolution (Optics)
Journal Articles

Thermobuoyancy Treatment for Electronic Packaging Using an Improved Advection Scheme

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Masoud Darbandi, Assistant Professor,, Gerry E. Schneider, Professor,
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2003, 125(2): 244–250.
https://doi.org/10.1115/1.1569508
Published Online: June 10, 2003
View Articletitled, Thermobuoyancy Treatment for Electronic Packaging Using an Improved Advection Scheme
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Topics: Approximation, Buoyancy, Cavities, Electronic packaging, Flow (Dynamics), Fluid dynamics, Heat transfer, Modeling, Natural convection, Rayleigh number
Journal Articles

Transient Response of Microchannel Heat Sinks in a Silicon Wafer

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J. R. Rujano, M. M. Rahman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1997, 119(4): 239–246.
https://doi.org/10.1115/1.2792243
Published Online: December 1, 1997
View Articletitled, Transient Response of Microchannel Heat Sinks in a Silicon Wafer
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Topics: Heat sinks, Microchannels, Semiconductor wafers, Transients (Dynamics), Fluids, Heat transfer, Reynolds number, Temperature, Forced convection, Heat
Journal Articles

Calculation of Forced-Air Cooling of Electronic Modules With a Two-Fluid Model of Turbulence

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O. J. Ilegbusi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1996, 118(4): 250–257.
https://doi.org/10.1115/1.2792160
Published Online: December 1, 1996
View Articletitled, Calculation of Forced-Air Cooling of Electronic Modules With a Two-Fluid Model of Turbulence
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Topics: Cooling, Fluids, Turbulence, Flow (Dynamics), Density, Diffusion (Physics), Electronic systems, Energy dissipation, Heat, Heat transfer
Journal Articles

Natural Convection in Shallow, Horizontal Air Layers Encountered in Electronic Cooling

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Elias Papanicolaou, Sridhar Gopalakrishna
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1995, 117(4): 307–316.
https://doi.org/10.1115/1.2792110
Published Online: December 1, 1995
View Articletitled, Natural Convection in Shallow, Horizontal Air Layers Encountered in Electronic Cooling
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Topics: Computer cooling, Natural convection, Convection, Heat transfer, Cooling, Dimensions, Energy conservation, Heat conduction, Heat flux, Heating
Journal Articles

Comparison of Two-Phase Electronic Cooling Using Free Jets and Sprays

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Kurt A. Estes, Issam Mudawar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1995, 117(4): 323–332.
https://doi.org/10.1115/1.2792112
Published Online: December 1, 1995
View Articletitled, Comparison of Two-Phase Electronic Cooling Using Free Jets and Sprays
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Topics: Computer cooling, Jets, Sprays, Cooling, Critical heat flux, Subcooling, Flow (Dynamics), Liquid films, Boiling, Coolants
Journal Articles

Jet-Flow Scavenging of a Curing Oven—Part II: Numerical Simulation

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K. J. Zwick, P. S. Ayyaswamy, I. M. Cohen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1995, 117(3): 220–224.
https://doi.org/10.1115/1.2792095
Published Online: September 1, 1995
View Articletitled, Jet-Flow Scavenging of a Curing Oven—Part II: Numerical Simulation
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Topics: Computer simulation, Hardening (Curing), Jets, Ovens, Pressure, Vapors, Design, Contamination, Flow visualization, Heat
Journal Articles

The Thermal Capacity Effect Upon Transient Natural Convection in a Rectangular Cavity

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A. Khalillolahi, B. Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1990, 112(4): 357–366.
https://doi.org/10.1115/1.2904390
Published Online: December 1, 1990
View Articletitled, The Thermal Capacity Effect Upon Transient Natural Convection in a Rectangular Cavity
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Topics: Cavities, Heat capacity, Natural convection, Specific heat, Transients (Dynamics), Flow (Dynamics), Heat conduction, Buoyancy, Convection, Fluids