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Journal Articles

Three Decades of Thermal Management Research at DARPA

Available to Purchase
Accepted Manuscript
Yogendra Joshi, Aaron Smith, Richard Eden, Sumit De
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag.
Paper No: EP-24-1094
https://doi.org/10.1115/1.4068882
Published Online: June 9, 2025
View Articletitled, Three Decades of Thermal Management Research at DARPA
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Topics: Thermal management, Cooling, Diamonds, Microelectromechanical systems, Casting, Cryogenics, Electronics, Energy dissipation, Gallium nitride, Generative adversarial networks
Journal Articles

Embedded Cooling for Wide Bandgap Power Amplifiers: A Review

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A. Bar-Cohen, J. J. Maurer, D. H. Altman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. December 2019, 141(4): 040803.
Paper No: EP-18-1067
https://doi.org/10.1115/1.4043404
Published Online: July 30, 2019
View Articletitled, Embedded Cooling for Wide Bandgap Power Amplifiers: A Review
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Topics: Cooling, Diamonds, Gallium nitride, Microfluidics, Transistors, Thermal conductivity, Temperature, Junctions, Heat, Thermal management
Journal Articles

Modeling and Analysis for Thermal Management in Gallium Nitride HEMTs Using Microfluidic Cooling

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Gunjan Agarwal, Thomas Kazior, Thomas Kenny, Dana Weinstein
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2017, 139(1): 011001.
Paper No: EP-16-1073
https://doi.org/10.1115/1.4035064
Published Online: November 10, 2016
View Articletitled, Modeling and Analysis for Thermal Management in Gallium Nitride HEMTs Using Microfluidic Cooling
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Topics: Cooling, Flow (Dynamics), Fluids, Gallium nitride, Microchannels, Microfluidics, Silicon, Temperature, Heat, Geometry
Journal Articles

Modular Microfluidic Filters Based on Transparent Membranes

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E. Archibong, H. Tuazon, H. Wang, J. Winskas, A. L. Pyayt
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2016, 138(4): 041002.
Paper No: EP-16-1049
https://doi.org/10.1115/1.4034369
Published Online: August 19, 2016
View Articletitled, Modular Microfluidic Filters Based on Transparent Membranes
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Topics: Filters, Filtration, Membranes, Microfluidics, Particulate matter, Transparency, Manufacturing, Microparticles
Journal Articles

Three-Dimensional Integrated Circuit With Embedded Microfluidic Cooling: Technology, Thermal Performance, and Electrical Implications

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Xuchen Zhang, Xuefei Han, Thomas E. Sarvey, Craig E. Green, Peter A. Kottke, Andrei G. Fedorov, Yogendra Joshi, Muhannad S. Bakir
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 010910.
Paper No: EP-15-1107
https://doi.org/10.1115/1.4032496
Published Online: March 10, 2016
View Articletitled, Three-Dimensional Integrated Circuit With Embedded Microfluidic Cooling: Technology, Thermal Performance, and Electrical Implications
Open the PDF for Three-Dimensional Integrated Circuit With Embedded Microfluidic Cooling: Technology, Thermal Performance, and Electrical Implications in another window
Topics: Cooling, Design, Fins, Flow (Dynamics), Heat flux, Heat sinks, Heat transfer coefficients, Microfluidics, Temperature, Testing
Journal Articles

Thermal Modeling of Microfluidic Channels for Cooling High Power Resistors on Multilayer Organic Liquid Crystal Polymer Substrate

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Outmane Lemtiri Chlieh, Wasif T. Khan, John Papapolymerou
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2015, 137(3): 031009.
Paper No: EP-14-1104
https://doi.org/10.1115/1.4030643
Published Online: September 1, 2015
View Articletitled, Thermal Modeling of Microfluidic Channels for Cooling High Power Resistors on Multilayer Organic Liquid Crystal Polymer Substrate
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Topics: Cooling, Flow (Dynamics), Heat, Manufacturing, Microchannels, Microfluidics, Resistors, Temperature, Thermal resistance, Water
Journal Articles

Compact Model-Based Microfluidic Controller for Energy Efficient Thermal Management Using Single Tier and Three-Dimensional Stacked Pin-Fin Enhanced Microgap

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Xuefei Han, Yogendra K. Joshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2015, 137(1): 011008.
Paper No: EP-13-1083
https://doi.org/10.1115/1.4028574
Published Online: October 15, 2014
View Articletitled, Compact Model-Based Microfluidic Controller for Energy Efficient Thermal Management Using Single Tier and Three-Dimensional Stacked Pin-Fin Enhanced Microgap
Open the PDF for Compact Model-Based Microfluidic Controller for Energy Efficient Thermal Management Using Single Tier and Three-Dimensional Stacked Pin-Fin Enhanced Microgap in another window
Topics: Computational fluid dynamics, Control equipment, Flow (Dynamics), Fluids, Heat, Modeling, Temperature, Thermal management, Microfluidics
Journal Articles

An Experimental and Numerical Study of a Liquid Mixing Device for Microsystems

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Kazuyoshi Fushinobu, Masashi Nakata
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 141–146.
https://doi.org/10.1115/1.1869511
Published Online: August 9, 2004
View Articletitled, An Experimental and Numerical Study of a Liquid Mixing Device for Microsystems
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Topics: Electroosmosis, Flow (Dynamics), Manufacturing, Microchannels, Microelectromechanical systems, Microfluidics