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Journal Articles

Assembly Reliability and Molding Material Comparison of Miniature Integrated High Power Module With Insulated Metal Substrate

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Chang-Chun Lee, Kuo-Shu Kao, Chi-Wei Wang, Tai-Jyun Yu, Tai-Kuang Lee, Po-Kai Chiu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021101.
Paper No: EP-21-1047
https://doi.org/10.1115/1.4052072
Published Online: September 13, 2021
View Articletitled, Assembly Reliability and Molding Material Comparison of Miniature Integrated High Power Module With Insulated Metal Substrate
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Topics: Manufacturing, Metals, Molding materials, Reliability, Silicones, Solders, Epoxy resins, Finite element analysis, Mechanical behavior
Journal Articles

Effect of Cu Foam and Ag-Coated Layer on the Microstructure and Mechanical Behavior of Nano-Ag Sintered Joint

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Yang Liu, Zhao Li, Min Zhou, Xianghua Zeng, Fenglian Sun
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2021, 143(3): 031002.
Paper No: EP-20-1047
https://doi.org/10.1115/1.4049128
Published Online: January 19, 2021
View Articletitled, Effect of Cu Foam and Ag-Coated Layer on the Microstructure and Mechanical Behavior of Nano-Ag Sintered Joint
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Topics: Bonding, Coating processes, Coatings, Composite materials, Mechanical behavior, Shear (Mechanics), Shear strength, Sintering, Fracture (Materials), Deformation
Journal Articles

Structural Size Effect on Mechanical Behavior of Intermetallic Material in Solder Joints: Experimental Investigation

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Leila Ladani, Ousama Abdelhadi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2015, 137(1): 014501.
Paper No: EP-13-1116
https://doi.org/10.1115/1.4027992
Published Online: October 6, 2014
View Articletitled, Structural Size Effect on Mechanical Behavior of Intermetallic Material in Solder Joints: Experimental Investigation
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Topics: Intermetallic compounds, Mechanical properties, Nanoindentation, Solder joints, Tin, Mechanical behavior, Size effect, Elastic moduli, Yield strength, Stress
Journal Articles

Modeling Simplification for Thermal Mechanical Analysis of High Density Chip-to-Substrate Connections

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Ping Nicole An, Paul A. Kohl
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041004.
https://doi.org/10.1115/1.4005289
Published Online: December 9, 2011
View Articletitled, Modeling Simplification for Thermal Mechanical Analysis of High Density Chip-to-Substrate Connections
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Topics: Boundary-value problems, Columns (Structural), Copper, Deformation, Density, Displacement, Errors, Finite element analysis, Finite element model, Modeling
Journal Articles

Multiscale Mechanics in Microelectronics: A Paradigm in Miniaturization

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M. G. D. Geers, V. Kouznetsova, W. A. M. Brekelmans
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 255–261.
https://doi.org/10.1115/1.1939007
Published Online: June 24, 2004
View Articletitled, Multiscale Mechanics in Microelectronics: A Paradigm in Miniaturization
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Topics: Continuum mechanics, Deformation, Dislocations, Lumber, Microelectronic devices, Plasticity, Strain gradient, Boundary-value problems, Metals, Stress
Journal Articles

Process Modeling and Thermal/Mechanical Behavior of ACA/ACF Type Flip-Chip Packages

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K. N. Chiang, Associate Professor, C. W. Chang, Graduate Student, C. T. Lin, Graduate Student
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section On Therminic
J. Electron. Packag. December 2001, 123(4): 331–337.
https://doi.org/10.1115/1.1389847
Published Online: May 10, 2001
View Articletitled, Process Modeling and Thermal/Mechanical Behavior of ACA/ACF Type Flip-Chip Packages
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Topics: Adhesives, Finite element analysis, Flip-chip devices, Manufacturing, Modeling, Particulate matter, Pressure, Springs, Mechanical behavior, Flip-chip packages
Journal Articles

Modeling of the Mechanical Behavior of Materials in “High-Tech” Systems: Attributes and Review

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E. Suhir
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Editorial Paper
J. Electron. Packag. December 1999, 121(4): 213–221.
https://doi.org/10.1115/1.2793843
Published Online: December 1, 1999
View Articletitled, Modeling of the Mechanical Behavior of Materials in “High-Tech” Systems: Attributes and Review
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Topics: Mechanical behavior, Modeling, Mathematics, Microelectronic devices, Optical fiber, Photonics
Journal Articles

Thermal Deformation Analysis of Various Electronic Packaging Products by Moire´ and Microscopic Moire´ Interferometry

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B. Han, Y. Guo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1995, 117(3): 185–191.
https://doi.org/10.1115/1.2792090
Published Online: September 1, 1995
View Articletitled, Thermal Deformation Analysis of Various Electronic Packaging Products by Moire´ and Microscopic Moire´ Interferometry
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Topics: Electronic packaging, Interferometry, Thermal deformation, Deformation, Packaging, Design, Displacement measurement, Mechanical behavior, Optimization, Product development
Journal Articles

How Compliant Should a Die-Attachment be to Protect the Chip From Substrate Bowing?

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E. Suhir
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 1995, 117(1): 88–92.
https://doi.org/10.1115/1.2792073
Published Online: March 1, 1995
View Articletitled, How Compliant Should a Die-Attachment be to Protect the Chip From Substrate Bowing?
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Topics: Adhesives, Bending (Stress), Diluents, Elastic constants, Epoxy adhesives, Manufacturing, Mechanical behavior, Rails, Silicones, Stiffness
Journal Articles

Some Effects of Water Immersion on the Mechanical Behavior of a Polyimide Film

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B. D. Harper, J. M. Rao
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1994, 116(4): 317–319.
https://doi.org/10.1115/1.2905704
Published Online: December 1, 1994
View Articletitled, Some Effects of Water Immersion on the Mechanical Behavior of a Polyimide Film
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Topics: Mechanical behavior, Water, Creep, Polymers, Stiffness, Stress, Temperature
Journal Articles

Elasto-Plastic Large Deflection Analysis of a Copper Film

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J. H. Lau
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1992, 114(2): 221–225.
https://doi.org/10.1115/1.2906421
Published Online: June 1, 1992
View Articletitled, Elasto-Plastic Large Deflection Analysis of a Copper Film
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Topics: Copper, Deflection, Ductility, Pressure, Stress, Finite element methods, Mechanical behavior
Journal Articles

Measurement of Mechanical Behavior of High Lead Lead-Tin Solder Joints Subjected to Thermal Cycling

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Yi-Hsin Pao, Scott Badgley, Ratan Govila, Linda Baumgartner, Richard Allor, Ron Cooper
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1992, 114(2): 135–144.
https://doi.org/10.1115/1.2906410
Published Online: June 1, 1992
View Articletitled, Measurement of Mechanical Behavior of High Lead Lead-Tin Solder Joints Subjected to Thermal Cycling
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Topics: Mechanical behavior, Solder joints, Fracture (Process), Solders, Stress, Creep, Fatigue, Shear stress, Adhesives, Alloys
Journal Articles

Understanding the Cyclic Mechanical Behavior of Lead/Tin Solder

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J. K. Tien, B. C. Hendrix, A. I. Attarwala
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1991, 113(2): 115–120.
https://doi.org/10.1115/1.2905376
Published Online: June 1, 1991
View Articletitled, Understanding the Cyclic Mechanical Behavior of Lead/Tin Solder
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Topics: Mechanical behavior, Solders, Creep, Stress, Temperature, Damage, Deformation, Storage, Testing
Journal Articles

Stiffness and Fatigue Study for Surface Mounted Module/Lead/Card Systems

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P. A. Engel, D. V. Caletka, M. R. Palmer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1991, 113(2): 129–137.
https://doi.org/10.1115/1.2905378
Published Online: June 1, 1991
View Articletitled, Stiffness and Fatigue Study for Surface Mounted Module/Lead/Card Systems
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Topics: Fatigue, Stiffness, Circuits, Stress, Bending (Stress), Computation, Die cutting, Failure, Fatigue strength, Fatigue testing
Journal Articles

Mechanical Behavior of Flip-Chip Encapsulants

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E. Suhir, J. M. Segelken
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1990, 112(4): 327–332.
https://doi.org/10.1115/1.2904385
Published Online: December 1, 1990
View Articletitled, Mechanical Behavior of Flip-Chip Encapsulants
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Topics: Flip-chip, Mechanical behavior, Stress, Design, Epoxy adhesives, Epoxy resins, Silicones, Failure, Mechanical properties, Preferences
Journal Articles

Double-Sided “Velcro-Type” Input/Output Contactor Interface Design: Mechanical Behavior of Elastic Contactors

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E. Suhir
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 1990, 112(4): 383–386.
https://doi.org/10.1115/1.2904393
Published Online: December 1, 1990
View Articletitled, Double-Sided “Velcro-Type” Input/Output Contactor Interface Design: Mechanical Behavior of Elastic Contactors
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Topics: Design, Mechanical behavior, Density, Electronic packaging, Metals
Journal Articles

Mechanical Evaluation of the “Euler” Test Probe

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E. Suhir, W. E. Benedetto
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 1990, 112(1): 75–77.
https://doi.org/10.1115/1.2904344
Published Online: March 1, 1990
View Articletitled, Mechanical Evaluation of the “Euler” Test Probe
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Topics: Probes, Wire, Stress, Buckling, Deflection, Design, Mechanical behavior
Journal Articles

Thermal Stress Analysis of SMT PQFP Packages and Interconnections

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J. H. Lau
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1989, 111(1): 2–8.
https://doi.org/10.1115/1.3226505
Published Online: March 1, 1989
View Articletitled, Thermal Stress Analysis of SMT PQFP Packages and Interconnections
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Topics: Thermal stresses, Manufacturing, Solder joints, Stress, Design, Finite element methods, Mechanical behavior, Reliability, Surface mount assemblies