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Journal Articles

Thermal Performance of a Light Emitting Diode Light Engine for a Multipurpose Automotive Exterior Lighting System With Competing Board Technologies

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Umut Zeynep Uras, Mehmet Arık, Enes Tamdoğan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2017, 139(2): 020907.
Paper No: EP-16-1139
https://doi.org/10.1115/1.4036403
Published Online: June 12, 2017
View Article titled, Thermal Performance of a Light Emitting Diode Light Engine for a Multipurpose Automotive Exterior Lighting System With Competing Board Technologies
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Topics: Engines, Light-emitting diodes, Temperature, Lumber, Flat heat pipes, Electronics, Thermal conductivity, Temperature distribution, Vapors
Journal Articles

Optimal Shock Pulse in a Drop Test Simulation of Standardized Board for Uniform Shock Response

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Sharan Kallolimath, Jiang Jenny Zhou
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2016, 138(4): 041001.
Paper No: EP-14-1082
https://doi.org/10.1115/1.4034187
Published Online: August 10, 2016
View Article titled, Optimal Shock Pulse in a Drop Test Simulation of Standardized Board for Uniform Shock Response
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Topics: Electrons, Finite element analysis, Lumber, Shock (Mechanics), Simulation, Stress, Solder joints, Modeling, Symmetry (Physics), Boundary-value problems
Journal Articles

Effect of Design Parameters on Drop Test Performance of Wafer Level Chip Scale Packages

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P. Tumne, V. Venkatadri, S. Kudtarkar, M. Delaus, D. Santos, R. Havens, K. Srihari
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Photo Gallery
J. Electron. Packag. June 2012, 134(2): 020905.
https://doi.org/10.1115/1.4005906
Published Online: June 11, 2012
View Article titled, Effect of Design Parameters on Drop Test Performance of Wafer Level Chip Scale Packages
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Topics: Alloys, Design, Failure, Failure mechanisms, Intermetallic compounds, Reliability, Semiconductor wafers, Solders, Separation (Technology), Shock (Mechanics)
Journal Articles

Optimization of Parallel, Horizontal, and Laminar Forced Air-Cooled Heat Generating Boards

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M. O. Özdemir, H. Yüncü
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031006.
https://doi.org/10.1115/1.4004097
Published Online: September 14, 2011
View Article titled, Optimization of Parallel, Horizontal, and Laminar Forced Air-Cooled Heat Generating Boards
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Topics: Flow (Dynamics), Forced convection, Heat, Heat transfer, Lumber, Optimization, Pressure, Pressure drop, Temperature, Laminar flow
Journal Articles

Measurement of Transient Dynamic Response of Circuit Boards of a Handheld Device During Drop Using 3D Digital Image Correlation

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S. B. Park, Chirag Shah, Jae B. Kwak, Changsoo Jang, Soonwan Chung, James M. Pitarresi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2008, 130(4): 044502.
https://doi.org/10.1115/1.3000097
Published Online: November 17, 2008
View Article titled, Measurement of Transient Dynamic Response of Circuit Boards of a Handheld Device During Drop Using 3D Digital Image Correlation
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Topics: Accelerometers, Deformation, Dynamic response, Printed circuit boards, Strain gages, Transients (Dynamics), Lumber, Displacement
Journal Articles

Smeared-Property Models for Shock-Impact Reliability of Area-Array Packages

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Pradeep Lall, Dhananjay Panchagade, Yueli Liu, Wayne Johnson, Jeff Suhling
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 373–381.
https://doi.org/10.1115/1.2804085
Published Online: March 25, 2007
View Article titled, Smeared-Property Models for Shock-Impact Reliability of Area-Array Packages
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Topics: Ball-Grid-Array packaging, Displacement, Errors, Finite element model, Reliability, Shells, Shock (Mechanics), Transients (Dynamics), Dynamics (Mechanics), Modeling
Journal Articles

Reliability of BGA and CSP on Metal-Backed Printed Circuit Boards in Harsh Environments

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Pradeep Lall, Nokibul Islam, John Evans, Jeff Suhling
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 382–390.
https://doi.org/10.1115/1.2804086
Published Online: March 7, 2007
View Article titled, Reliability of BGA and CSP on Metal-Backed Printed Circuit Boards in Harsh Environments
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Topics: Ball-Grid-Array packaging, Crack propagation, Cycles, Fracture (Materials), Lumber, Metals, Reliability, Resistors, Solder joints, Printed circuit boards
Journal Articles

Multiscale Mechanics in Microelectronics: A Paradigm in Miniaturization

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M. G. D. Geers, V. Kouznetsova, W. A. M. Brekelmans
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 255–261.
https://doi.org/10.1115/1.1939007
Published Online: June 24, 2004
View Article titled, Multiscale Mechanics in Microelectronics: A Paradigm in Miniaturization
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Topics: Continuum mechanics, Deformation, Dislocations, Lumber, Microelectronic devices, Plasticity, Strain gradient, Boundary-value problems, Metals, Stress
Journal Articles

Thermoelastic Properties of Plain Weave Composites for Multilayer Circuit Board Applications

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N. R. Sottos, J. M. Ockers, M. Swindeman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1999, 121(1): 37–43.
https://doi.org/10.1115/1.2792659
Published Online: March 1, 1999
View Article titled, Thermoelastic Properties of Plain Weave Composites for Multilayer Circuit Board Applications
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Topics: Composite materials, Printed circuit boards, Thermoelasticity, Textiles, Geometry, Lumber, Elastic moduli, Epoxy adhesives, Epoxy resins, Fibers
Journal Articles

Natural Convection Cooling of Multiple Heat Sources in Parallel Open-Top Cavities Filled With a Fluorinert Liquid

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M. Behnia, A. A. Dehghan, H. Mishima, W. Nakayama
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1998, 120(1): 73–81.
https://doi.org/10.1115/1.2792289
Published Online: March 1, 1998
View Article titled, Natural Convection Cooling of Multiple Heat Sources in Parallel Open-Top Cavities Filled With a Fluorinert Liquid
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Topics: Cavities, Cooling, Heat, Natural convection, Heat transfer, Ceramics, Flow (Dynamics), Electrical wires, Electronic equipment, Heat conduction
Journal Articles

Moisture Migration and Cracking in Plastic Quad Flat Packages (PQFPs)

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S. A. Taylor, K. Chen, R. Mahajan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1997, 119(2): 85–88.
https://doi.org/10.1115/1.2792224
Published Online: June 1, 1997
View Article titled, Moisture Migration and Cracking in Plastic Quad Flat Packages (PQFPs)
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Topics: Acoustics, Computers, Cracking (Materials), Equilibrium (Physics), Fracture (Process), Heat, Heating, High temperature, Lumber, Microscopy
Journal Articles

An Ultra-High Power Two-Phase Jet-Impingement Avionic Clamshell Module

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Murray E. Johns, Issam Mudawar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1996, 118(4): 264–270.
https://doi.org/10.1115/1.2792162
Published Online: December 1, 1996
View Article titled, An Ultra-High Power Two-Phase Jet-Impingement Avionic Clamshell Module
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Topics: Accounting, Boiling, Cooling, Critical heat flux, Databases, Errors, Flow (Dynamics), Fluids, Heat, Heat transfer
Journal Articles

Shock and Vibration of Solder Bumped Flip Chip on Organic Coated Copper Boards

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John Lau, Eric Schneider, Tom Baker
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. June 1996, 118(2): 101–104.
https://doi.org/10.1115/1.2792127
Published Online: June 1, 1996
View Article titled, Shock and Vibration of Solder Bumped Flip Chip on Organic Coated Copper Boards
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Topics: Copper, Flip-chip, Flip-chip devices, Lumber, Shock (Mechanics), Solders, Vibration, Vibration tests, Epoxy adhesives, Epoxy resins
Journal Articles

Stress Analysis of Printed Circuit Boards With Highly Populated Solder Joints and Components: A Micromechanics Approach

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K. X. Hu, Y. Huang, C. P. Yeh, K. W. Wyatt
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1996, 118(2): 87–93.
https://doi.org/10.1115/1.2792137
Published Online: June 1, 1996
View Article titled, Stress Analysis of Printed Circuit Boards With Highly Populated Solder Joints and Components: A Micromechanics Approach
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Topics: Micromechanics (Engineering), Printed circuit boards, Solder joints, Stress analysis (Engineering), Lumber, Accounting, Composite materials, Energy budget (Physics), Finite element analysis, Stress concentration
Journal Articles

A Solution Methodology for the Multiple Batch Surface Mount PCB Placement Sequence Problem

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Yu-Wen Huang, K. Srihari, Jim Adriance, George Westby
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1994, 116(4): 282–289.
https://doi.org/10.1115/1.2905699
Published Online: December 1, 1994
View Article titled, A Solution Methodology for the Multiple Batch Surface Mount PCB Placement Sequence Problem
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Topics: Surface mount packaging, Engineering prototypes, Lumber, Machinery, Manufacturing, Nozzles, Printed circuit boards, Surface mount components, Tooling
Journal Articles

Experimental Analysis of Thermal Cycling Fatigue of Four-Layered FR4 Printed Wiring Boards

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Tsung-Yu Pan, Ronald R. Cooper, Howard D. Blair, Thomas J. Whalen, John M. Nicholson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1994, 116(2): 76–82.
https://doi.org/10.1115/1.2905508
Published Online: June 1, 1994
View Article titled, Experimental Analysis of Thermal Cycling Fatigue of Four-Layered FR4 Printed Wiring Boards
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Topics: Experimental analysis, Fatigue, Printed circuit boards, Cycles, Design, Electrical resistance, Fracture (Materials), Chain, Cracking (Materials), Electronic packages
Journal Articles

A New Model for Accelerated Thermal Cycle Testing With Application to TAB Leads and PCB PTHs

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R. G. Bayer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1994, 116(1): 16–22.
https://doi.org/10.1115/1.2905487
Published Online: March 1, 1994
View Article titled, A New Model for Accelerated Thermal Cycle Testing With Application to TAB Leads and PCB PTHs
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Topics: Cycles, Fatigue, Lumber, Testing
Journal Articles

Two-Level Nonlinear Mixed Discrete-Continuous Optimization-Based Design: An Application to Printed Circuit Board Assemblies

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S. Praharaj, S. Azarm
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1992, 114(4): 425–435.
https://doi.org/10.1115/1.2905476
Published Online: December 1, 1992
View Article titled, Two-Level Nonlinear Mixed Discrete-Continuous Optimization-Based Design: An Application to Printed Circuit Board Assemblies
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Topics: Design, Optimization, Printed circuit board assemblies, Algorithms, Flow (Dynamics), Lumber, Manufacturing, Printed circuit boards, Reliability
Journal Articles

Solder Creep-Fatigue Interactions With Flexible Leaded Parts

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R. G. Ross, Jr., L. C. Wen, G. R. Mon, E. Jetter
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1992, 114(2): 185–192.
https://doi.org/10.1115/1.2906416
Published Online: June 1, 1992
View Article titled, Solder Creep-Fatigue Interactions With Flexible Leaded Parts
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Topics: Creep, Fatigue, Solders, Computer software, Cycles, Stress, Temperature, Accounting, Algorithms, Deflection
Journal Articles

Experimental Modal Analysis and Dynamic Response Prediction of PC Boards With Surface Mount Electronic Components

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Tin-Lup Wong, Karl K. Stevens, Gang Wang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1991, 113(3): 244–249.
https://doi.org/10.1115/1.2905402
Published Online: September 1, 1991
View Article titled, Experimental Modal Analysis and Dynamic Response Prediction of PC Boards With Surface Mount Electronic Components
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Topics: Dynamic models, Dynamic response, Electronic components, Lumber, Modal analysis, Mode shapes, Structural dynamics, Surface mount components, Surface mount packaging, Testing