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Lead-free solders
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. December 2023, 145(4): 040301.
Paper No: EP-23-1077
Published Online: November 1, 2023
Journal Articles
A Contribution to Printed Circuit Boards' Miniaturization by the Vertical Embedding of Passive Components
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2024, 146(1): 011004.
Paper No: EP-23-1005
Published Online: May 18, 2023
Journal Articles
Fracture Behavior and Reliability of Low-Silver Lead-Free Solder Joints
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041016.
Paper No: EP-21-1159
Published Online: March 31, 2022
Journal Articles
Influence of Laser Soldering Temperatures on Through-Hole Component
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041006.
Paper No: EP-21-1075
Published Online: November 22, 2021
Journal Articles
State of the Art of Lead-Free Solder Joint Reliability
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. June 2021, 143(2): 020803.
Paper No: EP-20-1059
Published Online: September 3, 2020
Journal Articles
Reliability Analysis of Lead-Free Solders in Electronic Packaging Using a Novel Surrogate Model and Kriging Concept
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041003.
Paper No: EP-17-1047
Published Online: August 20, 2018
Journal Articles
Relationship Between the Intermetallic Compounds Growth and the Microcracking Behavior of Lead-Free Solder Joints
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 011002.
Paper No: EP-15-1079
Published Online: March 10, 2016
Journal Articles
Individual Phase Mechanical Properties at Different Temperatures of Sn–Ag–Cu Lead-Free Solders Incorporating Special Pileup Effects Using Nanoindentation
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2015, 137(3): 031005.
Paper No: EP-13-1135
Published Online: September 1, 2015
Journal Articles
Damage Evolution in Lead Free Solder Joints in Isothermal Fatigue
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2015, 137(2): 021012.
Paper No: EP-14-1077
Published Online: June 1, 2015
Journal Articles
Stress–Strain Behavior of SAC305 at High Strain Rates
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2015, 137(1): 011010.
Paper No: EP-14-1001
Published Online: March 1, 2015
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Editorial
J. Electron. Packag. December 2014, 136(4): 040201.
Paper No: EP-14-1070
Published Online: September 19, 2014
Journal Articles
UCPD Model for Pb-Free Solder
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2014, 136(4): 041006.
Paper No: EP-13-1101
Published Online: September 19, 2014
Journal Articles
Failure Analysis of Halogen-Free Printed Circuit Board Assembly Under Board-Level Drop Test
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2012, 134(1): 011011.
Published Online: March 19, 2012
Journal Articles
Issues on Viscoplastic Characterization of Lead-Free Solder for Drop Test Simulations
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041013.
Published Online: December 19, 2011
Journal Articles
Influence of Intermetallic Characteristics on the Solder Joint Strength of Halogen-Free Printed Circuit Board Assembly
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021004.
Published Online: June 23, 2011
Journal Articles
Investigation of Effect of Creep Strain on Low-Cycle Fatigue of Lead-Free Solder by Cyclic Loading Using Stepped Ramp Waves
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041010.
Published Online: December 3, 2010
Journal Articles
Time-Independent and Time-Dependent Inelastic Strain Analysis of Lead-Free Solder by Cyclic Loading Test Using Stepped Ramp Waves
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041003.
Published Online: November 23, 2010
Journal Articles
Reliability Modeling of Lead-Free Solder Joints in Wafer-Level Chip Scale Packages
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2010, 132(1): 011005.
Published Online: March 4, 2010
Journal Articles
Tensile Behaviors of Lead-Containing and Lead-Free Solders at High Strain Rates
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031001.
Published Online: June 16, 2009
Journal Articles
Laser Soldering of Fine Pitch QFP Devices Using Lead-Free Solders
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021004.
Published Online: April 1, 2009
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