Search Results | J. Electron. Packag. | ASME Digital Collection

1-20 of 40

Sort by

Sort Order Select

Journal Articles

Fracture Behavior and Reliability of Low-Silver Lead-Free Solder Joints

Ved Prakash Sharma, Naresh Varma Datla

J. Electron. Packag. December 2022, 144(4): 041016.

Paper No: EP-21-1159

DOI: https://doi.org/10.1115/1.4054096

Published Online: March 31, 2022

View Article

Topics: Fracture (Materials), Fracture (Process), Intermetallic compounds, Solder joints, Solders, Tin, Reliability, Fractography, Lead-free solders, Failure

Journal Articles

Influence of Laser Soldering Temperatures on Through-Hole Component

Saifulmajdy A. Zahiri, Aizat Abas, M. F. M. Sharif, Fakhrozi Che Ani

J. Electron. Packag. December 2022, 144(4): 041006.

Paper No: EP-21-1075

DOI: https://doi.org/10.1115/1.4052175

Published Online: November 22, 2021

View Article

Topics: Flow (Dynamics), Lasers, Soldering, Solders, Temperature, Lead-free solders, Finite volume methods, Pressure

Journal Articles

State of the Art of Lead-Free Solder Joint Reliability

John H. Lau

J. Electron. Packag. June 2021, 143(2): 020803.

Paper No: EP-20-1059

DOI: https://doi.org/10.1115/1.4048037

Published Online: September 3, 2020

View Article

Topics: Alloys, Creep, Failure, Reliability, Solder joints, Solders, Temperature, Viscoplasticity, Lead-free solders, Stress

Journal Articles

Reliability Analysis of Lead-Free Solders in Electronic Packaging Using a Novel Surrogate Model and Kriging Concept

Hamoon Azizsoltani, Achintya Haldar

J. Electron. Packag. December 2018, 140(4): 041003.

Paper No: EP-17-1047

DOI: https://doi.org/10.1115/1.4040924

Published Online: August 20, 2018

View Article

Topics: Failure, Finite element analysis, Modeling, Reliability, Solders, Thermomechanics, Lead-free solders, Electronic packaging, Uncertainty, Stress

Journal Articles

Relationship Between the Intermetallic Compounds Growth and the Microcracking Behavior of Lead-Free Solder Joints

Tong An, Fei Qin

J. Electron. Packag. March 2016, 138(1): 011002.

Paper No: EP-15-1079

DOI: https://doi.org/10.1115/1.4032349

Published Online: March 10, 2016

View Article

Topics: Failure mechanisms, Solder joints, Solders, Surface roughness, Lead-free solders, Intermetallic compounds, Tensile strength, Microcracks, Tin

Journal Articles

Individual Phase Mechanical Properties at Different Temperatures of Sn–Ag–Cu Lead-Free Solders Incorporating Special Pileup Effects Using Nanoindentation

Muhammad Sadiq, Jean-Sebastien Lecomte, Mohammed Cherkaoui

J. Electron. Packag. September 2015, 137(3): 031005.

Paper No: EP-13-1135

DOI: https://doi.org/10.1115/1.4029836

Published Online: September 1, 2015

View Article

Topics: Alloys, Mechanical properties, Nanoindentation, Temperature, Tin, Young's modulus, Lead-free solders

Journal Articles

Damage Evolution in Lead Free Solder Joints in Isothermal Fatigue

Awni Qasaimeh, Sa’d Hamasha, Younis Jaradat, Peter Borgesen

J. Electron. Packag. June 2015, 137(2): 021012.

Paper No: EP-14-1077

DOI: https://doi.org/10.1115/1.4029441

Published Online: June 1, 2015

View Article

Topics: Cycles, Damage, Displacement, Fatigue, Fracture (Materials), Lead-free solders, Solders, Stiffness, Stress, Temperature

Journal Articles

Stress–Strain Behavior of SAC305 at High Strain Rates

Pradeep Lall, Sandeep Shantaram, Jeff Suhling, David Locker

J. Electron. Packag. March 2015, 137(1): 011010.

Paper No: EP-14-1001

DOI: https://doi.org/10.1115/1.4028641

Published Online: March 1, 2015

View Article

Topics: Deformation, Displacement, Failure, Finite element analysis, Finite element model, Lead-free solders, Manufacturing, Solders, Stress, Trusses (Building)

Journal Articles

Special Section on InterPACK 2013

Satish Chaparala, Ashish Gupta, Nils Hoivik, Y. C. Lee

J. Electron. Packag. December 2014, 136(4): 040201.

Paper No: EP-14-1070

DOI: https://doi.org/10.1115/1.4028390

Published Online: September 19, 2014

View Article

Topics: Copper, Design, Electronic packaging, Engineering mechanics, Manufacturing, Packaging, Reliability, Sensors, Silicon, Thermal management

Journal Articles

UCPD Model for Pb-Free Solder

Michael K. Neilsen, Paul T. Vianco

J. Electron. Packag. December 2014, 136(4): 041006.

Paper No: EP-13-1101

DOI: https://doi.org/10.1115/1.4026851

Published Online: September 19, 2014

View Article

Topics: Cycles, Damage, Fracture (Materials), Lead-free solders, Solder joints, Solders, Failure, Fatigue, Simulation

Journal Articles

Failure Analysis of Halogen-Free Printed Circuit Board Assembly Under Board-Level Drop Test

Hung-Jen Chang, Chau-Jie Zhan, Tao-Chih Chang, Jung-Hua Chou

J. Electron. Packag. March 2012, 134(1): 011011.

DOI: https://doi.org/10.1115/1.4005956

Published Online: March 19, 2012

View Article

Topics: Failure, Failure analysis, Fracture (Materials), Intermetallic compounds, Lead-free solders, Printed circuit board assemblies, Solder joints, Solders, Stress, Tin

Journal Articles

Issues on Viscoplastic Characterization of Lead-Free Solder for Drop Test Simulations

Etienne L. Bonnaud

J. Electron. Packag. December 2011, 133(4): 041013.

DOI: https://doi.org/10.1115/1.4005451

Published Online: December 19, 2011

View Article

Topics: Engineering simulation, Failure, Hardening, Lead-free solders, Simulation, Solder joints, Solders, Stress, Finite element analysis

Journal Articles

Influence of Intermetallic Characteristics on the Solder Joint Strength of Halogen-Free Printed Circuit Board Assembly

Hung-Jen Chang, Jung-Hua Chou, Tao-Chih Chang, Chau-Jie Zhan, Min-Hsiung Hon, Chi-Shiung Hsi

J. Electron. Packag. June 2011, 133(2): 021004.

DOI: https://doi.org/10.1115/1.4003989

Published Online: June 23, 2011

View Article

Topics: Alloys, Ball-Grid-Array packaging, Intermetallic compounds, Lead-free solders, Solder joints, Solders, Tin, Fracture (Materials), Finishes, Printed circuit board assemblies

Journal Articles

Investigation of Effect of Creep Strain on Low-Cycle Fatigue of Lead-Free Solder by Cyclic Loading Using Stepped Ramp Waves

Ken-ichi Ohguchi, Katsuhiko Sasaki

J. Electron. Packag. December 2010, 132(4): 041010.

DOI: https://doi.org/10.1115/1.4002911

Published Online: December 3, 2010

View Article

Topics: Creep, Lead-free solders, Fatigue life, Compression, Fatigue testing, Waves, Stress

Journal Articles

Time-Independent and Time-Dependent Inelastic Strain Analysis of Lead-Free Solder by Cyclic Loading Test Using Stepped Ramp Waves

Ken-ichi Ohguchi, Katsuhiko Sasaki

J. Electron. Packag. December 2010, 132(4): 041003.

DOI: https://doi.org/10.1115/1.4002897

Published Online: November 23, 2010

View Article

Topics: Creep, Deformation, Lead-free solders, Stress, Waves, Solders, Alloys

Journal Articles

Reliability Modeling of Lead-Free Solder Joints in Wafer-Level Chip Scale Packages

Jie-Hua Zhao, Vikas Gupta, Alok Lohia, Darvin Edwards

J. Electron. Packag. March 2010, 132(1): 011005.

DOI: https://doi.org/10.1115/1.4000754

Published Online: March 4, 2010

View Article

Topics: Constitutive equations, Creep, Density, Fatigue, Finite element methods, Hardening, Lead-free solders, Modeling, Reliability, Semiconductor wafers

Journal Articles

Tensile Behaviors of Lead-Containing and Lead-Free Solders at High Strain Rates

Fei Qin, Tong An, Na Chen, Jie Bai

J. Electron. Packag. September 2009, 131(3): 031001.

DOI: https://doi.org/10.1115/1.3144151

Published Online: June 16, 2009

View Article

Topics: Fractography, Lead-free solders, Solders, Tensile strength, Reliability, Electronic products, Solder joints, Stress-strain curves

Journal Articles

Laser Soldering of Fine Pitch QFP Devices Using Lead-Free Solders

Zongjie Han, Songbai Xue, Jianxin Wang, Xin Zhang, Shenglin Yu, Liang Zhang

J. Electron. Packag. June 2009, 131(2): 021004.

DOI: https://doi.org/10.1115/1.3103932

Published Online: April 1, 2009

View Article

Topics: Lasers, Lead-free solders, Mechanical properties, Soldering, Solders, Tin, Reflow soldering

Journal Articles

Evaluation of Time-Independent and Time-Dependent Strains of Lead-Free Solder by Stepped Ramp Loading Test

Ken-ichi Ohguchi, Katsuhiko Sasaki, Setsuo Aso

J. Electron. Packag. June 2009, 131(2): 021003.

DOI: https://doi.org/10.1115/1.3103951

Published Online: March 27, 2009

View Article

Topics: Creep, Lead-free solders, Stress, Stress-strain relations, Deformation, Waves, Solders, Simulation, Constitutive equations, Alloys

Journal Articles

A General Methodology to Predict Fatigue Life in Lead-Free Solder Alloy Interconnects

David M. Pierce, Sheri D. Sheppard, Paul T. Vianco

J. Electron. Packag. March 2009, 131(1): 011008.

DOI: https://doi.org/10.1115/1.3068313

Published Online: February 13, 2009

View Article

Topics: Alloys, Cycles, Dynamic light scattering, Fatigue, Fatigue life, Finite element analysis, Fracture (Materials), Lead-free solders, Simulation, Solders

Journal citation

NARROW

Fracture Behavior and Reliability of Low-Silver Lead-Free Solder Joints

Influence of Laser Soldering Temperatures on Through-Hole Component

State of the Art of Lead-Free Solder Joint Reliability

Reliability Analysis of Lead-Free Solders in Electronic Packaging Using a Novel Surrogate Model and Kriging Concept

Relationship Between the Intermetallic Compounds Growth and the Microcracking Behavior of Lead-Free Solder Joints

Individual Phase Mechanical Properties at Different Temperatures of Sn–Ag–Cu Lead-Free Solders Incorporating Special Pileup Effects Using Nanoindentation

Damage Evolution in Lead Free Solder Joints in Isothermal Fatigue

Stress–Strain Behavior of SAC305 at High Strain Rates

Special Section on InterPACK 2013

UCPD Model for Pb-Free Solder

Failure Analysis of Halogen-Free Printed Circuit Board Assembly Under Board-Level Drop Test

Issues on Viscoplastic Characterization of Lead-Free Solder for Drop Test Simulations

Influence of Intermetallic Characteristics on the Solder Joint Strength of Halogen-Free Printed Circuit Board Assembly

Investigation of Effect of Creep Strain on Low-Cycle Fatigue of Lead-Free Solder by Cyclic Loading Using Stepped Ramp Waves

Time-Independent and Time-Dependent Inelastic Strain Analysis of Lead-Free Solder by Cyclic Loading Test Using Stepped Ramp Waves

Reliability Modeling of Lead-Free Solder Joints in Wafer-Level Chip Scale Packages

Tensile Behaviors of Lead-Containing and Lead-Free Solders at High Strain Rates

Laser Soldering of Fine Pitch QFP Devices Using Lead-Free Solders

Evaluation of Time-Independent and Time-Dependent Strains of Lead-Free Solder by Stepped Ramp Loading Test

A General Methodology to Predict Fatigue Life in Lead-Free Solder Alloy Interconnects

Journals

Conference Proceedings

eBooks

Resources

Opportunities

Journals

Conference Proceedings

eBooks

Resources

Opportunities

This Feature Is Available To Subscribers Only