1-20 of 42
Lead-free solders
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Special Issue on InterPACK2022

Free
Jin Yang, Sukwon Choi, Benjamin Leever, Cheng Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. December 2023, 145(4): 040301.
Paper No: EP-23-1077
https://doi.org/10.1115/1.4063893
Published Online: November 1, 2023
View Articletitled, Special Issue on InterPACK2022
Open the PDF for Special Issue on InterPACK2022 in another window
Topics: Aerosols, Artificial intelligence, Cloud computing, Cooling, Cycles, Density, Electric vehicles, Electronic packaging, Electronics, Energy conversion
Journal Articles

A Contribution to Printed Circuit Boards' Miniaturization by the Vertical Embedding of Passive Components

Available to Purchase
Peter Lukacs, Tibor Rovensky, Alexandr Otahal
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2024, 146(1): 011004.
Paper No: EP-23-1005
https://doi.org/10.1115/1.4062470
Published Online: May 18, 2023
View Articletitled, A Contribution to Printed Circuit Boards' Miniaturization by the Vertical Embedding of Passive Components
Open the PDF for A Contribution to Printed Circuit Boards' Miniaturization by the Vertical Embedding of Passive Components in another window
Topics: Cross section (Physics), Lead-free solders, Printed circuit boards, Solder joints, Soldering, Solders, Surface mount devices, Capacitors, Dislocations, Reliability
Journal Articles

Fracture Behavior and Reliability of Low-Silver Lead-Free Solder Joints

Available to Purchase
Ved Prakash Sharma, Naresh Varma Datla
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041016.
Paper No: EP-21-1159
https://doi.org/10.1115/1.4054096
Published Online: March 31, 2022
View Articletitled, Fracture Behavior and Reliability of Low-Silver Lead-Free Solder Joints
Open the PDF for Fracture Behavior and Reliability of Low-Silver Lead-Free Solder Joints in another window
Topics: Fracture (Materials), Fracture (Process), Intermetallic compounds, Solder joints, Solders, Tin, Reliability, Fractography, Lead-free solders, Failure
Journal Articles

Influence of Laser Soldering Temperatures on Through-Hole Component

Available to Purchase
Saifulmajdy A. Zahiri, Aizat Abas, M. F. M. Sharif, Fakhrozi Che Ani
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041006.
Paper No: EP-21-1075
https://doi.org/10.1115/1.4052175
Published Online: November 22, 2021
View Articletitled, Influence of Laser Soldering Temperatures on Through-Hole Component
Open the PDF for Influence of Laser Soldering Temperatures on Through-Hole Component in another window
Topics: Flow (Dynamics), Lasers, Soldering, Solders, Temperature, Lead-free solders, Finite volume methods, Pressure
Journal Articles

State of the Art of Lead-Free Solder Joint Reliability

Available to Purchase
John H. Lau
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. June 2021, 143(2): 020803.
Paper No: EP-20-1059
https://doi.org/10.1115/1.4048037
Published Online: September 3, 2020
View Articletitled, State of the Art of Lead-Free Solder Joint Reliability
Open the PDF for State of the Art of Lead-Free Solder Joint Reliability in another window
Topics: Alloys, Creep, Failure, Reliability, Solder joints, Solders, Temperature, Viscoplasticity, Lead-free solders, Stress
Journal Articles

Reliability Analysis of Lead-Free Solders in Electronic Packaging Using a Novel Surrogate Model and Kriging Concept

Available to Purchase
Hamoon Azizsoltani, Achintya Haldar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041003.
Paper No: EP-17-1047
https://doi.org/10.1115/1.4040924
Published Online: August 20, 2018
View Articletitled, Reliability Analysis of Lead-Free Solders in Electronic Packaging Using a Novel Surrogate Model and Kriging Concept
Open the PDF for Reliability Analysis of Lead-Free Solders in Electronic Packaging Using a Novel Surrogate Model and Kriging Concept in another window
Topics: Failure, Finite element analysis, Modeling, Reliability, Solders, Thermomechanics, Lead-free solders, Electronic packaging, Uncertainty, Stress
Journal Articles

Relationship Between the Intermetallic Compounds Growth and the Microcracking Behavior of Lead-Free Solder Joints

Available to Purchase
Tong An, Fei Qin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 011002.
Paper No: EP-15-1079
https://doi.org/10.1115/1.4032349
Published Online: March 10, 2016
View Articletitled, Relationship Between the Intermetallic Compounds Growth and the Microcracking Behavior of Lead-Free Solder Joints
Open the PDF for Relationship Between the Intermetallic Compounds Growth and the Microcracking Behavior of Lead-Free Solder Joints in another window
Topics: Failure mechanisms, Solder joints, Solders, Surface roughness, Lead-free solders, Intermetallic compounds, Tensile strength, Microcracks, Tin
Journal Articles

Individual Phase Mechanical Properties at Different Temperatures of Sn–Ag–Cu Lead-Free Solders Incorporating Special Pileup Effects Using Nanoindentation

Available to Purchase
Muhammad Sadiq, Jean-Sebastien Lecomte, Mohammed Cherkaoui
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2015, 137(3): 031005.
Paper No: EP-13-1135
https://doi.org/10.1115/1.4029836
Published Online: September 1, 2015
View Articletitled, Individual Phase Mechanical Properties at Different Temperatures of Sn–Ag–Cu Lead-Free Solders Incorporating Special Pileup Effects Using Nanoindentation
Open the PDF for Individual Phase Mechanical Properties at Different Temperatures of Sn–Ag–Cu Lead-Free Solders Incorporating Special Pileup Effects Using Nanoindentation in another window
Topics: Alloys, Mechanical properties, Nanoindentation, Temperature, Tin, Young's modulus, Lead-free solders
Journal Articles

Damage Evolution in Lead Free Solder Joints in Isothermal Fatigue

Available to Purchase
Awni Qasaimeh, Sa’d Hamasha, Younis Jaradat, Peter Borgesen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2015, 137(2): 021012.
Paper No: EP-14-1077
https://doi.org/10.1115/1.4029441
Published Online: June 1, 2015
View Articletitled, Damage Evolution in Lead Free Solder Joints in Isothermal Fatigue
Open the PDF for Damage Evolution in Lead Free Solder Joints in Isothermal Fatigue in another window
Topics: Cycles, Damage, Displacement, Fatigue, Fracture (Materials), Lead-free solders, Solders, Stiffness, Stress, Temperature
Journal Articles

Stress–Strain Behavior of SAC305 at High Strain Rates

Available to Purchase
Pradeep Lall, Sandeep Shantaram, Jeff Suhling, David Locker
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2015, 137(1): 011010.
Paper No: EP-14-1001
https://doi.org/10.1115/1.4028641
Published Online: March 1, 2015
View Articletitled, Stress–Strain Behavior of SAC305 at High Strain Rates
Open the PDF for Stress–Strain Behavior of SAC305 at High Strain Rates in another window
Topics: Deformation, Displacement, Failure, Finite element analysis, Finite element model, Lead-free solders, Manufacturing, Solders, Stress, Trusses (Building)
Journal Articles

Special Section on InterPACK 2013

Free
Satish Chaparala, Ashish Gupta, Nils Hoivik, Y. C. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Editorial
J. Electron. Packag. December 2014, 136(4): 040201.
Paper No: EP-14-1070
https://doi.org/10.1115/1.4028390
Published Online: September 19, 2014
View Articletitled, Special Section on InterPACK 2013
Open the PDF for Special Section on InterPACK 2013 in another window
Topics: Copper, Design, Electronic packaging, Engineering mechanics, Manufacturing, Packaging, Reliability, Sensors, Silicon, Thermal management
Journal Articles

UCPD Model for Pb-Free Solder

Available to Purchase
Michael K. Neilsen, Paul T. Vianco
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2014, 136(4): 041006.
Paper No: EP-13-1101
https://doi.org/10.1115/1.4026851
Published Online: September 19, 2014
View Articletitled, UCPD Model for Pb-Free Solder
Open the PDF for UCPD Model for Pb-Free Solder in another window
Topics: Cycles, Damage, Fracture (Materials), Lead-free solders, Solder joints, Solders, Failure, Fatigue, Simulation
Journal Articles

Failure Analysis of Halogen-Free Printed Circuit Board Assembly Under Board-Level Drop Test

Available to Purchase
Hung-Jen Chang, Chau-Jie Zhan, Tao-Chih Chang, Jung-Hua Chou
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2012, 134(1): 011011.
https://doi.org/10.1115/1.4005956
Published Online: March 19, 2012
View Articletitled, Failure Analysis of Halogen-Free Printed Circuit Board Assembly Under Board-Level Drop Test
Open the PDF for Failure Analysis of Halogen-Free Printed Circuit Board Assembly Under Board-Level Drop Test in another window
Topics: Failure, Failure analysis, Fracture (Materials), Intermetallic compounds, Lead-free solders, Printed circuit board assemblies, Solder joints, Solders, Stress, Tin
Journal Articles

Issues on Viscoplastic Characterization of Lead-Free Solder for Drop Test Simulations

Available to Purchase
Etienne L. Bonnaud
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041013.
https://doi.org/10.1115/1.4005451
Published Online: December 19, 2011
View Articletitled, Issues on Viscoplastic Characterization of Lead-Free Solder for Drop Test Simulations
Open the PDF for Issues on Viscoplastic Characterization of Lead-Free Solder for Drop Test Simulations in another window
Topics: Engineering simulation, Failure, Hardening, Lead-free solders, Simulation, Solder joints, Solders, Stress, Finite element analysis
Journal Articles

Influence of Intermetallic Characteristics on the Solder Joint Strength of Halogen-Free Printed Circuit Board Assembly

Available to Purchase
Hung-Jen Chang, Jung-Hua Chou, Tao-Chih Chang, Chau-Jie Zhan, Min-Hsiung Hon, Chi-Shiung Hsi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021004.
https://doi.org/10.1115/1.4003989
Published Online: June 23, 2011
View Articletitled, Influence of Intermetallic Characteristics on the Solder Joint Strength of Halogen-Free Printed Circuit Board Assembly
Open the PDF for Influence of Intermetallic Characteristics on the Solder Joint Strength of Halogen-Free Printed Circuit Board Assembly in another window
Topics: Alloys, Ball-Grid-Array packaging, Intermetallic compounds, Lead-free solders, Solder joints, Solders, Tin, Fracture (Materials), Finishes, Printed circuit board assemblies
Journal Articles

Investigation of Effect of Creep Strain on Low-Cycle Fatigue of Lead-Free Solder by Cyclic Loading Using Stepped Ramp Waves

Available to Purchase
Ken-ichi Ohguchi, Katsuhiko Sasaki
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041010.
https://doi.org/10.1115/1.4002911
Published Online: December 3, 2010
View Articletitled, Investigation of Effect of Creep Strain on Low-Cycle Fatigue of Lead-Free Solder by Cyclic Loading Using Stepped Ramp Waves
Open the PDF for Investigation of Effect of Creep Strain on Low-Cycle Fatigue of Lead-Free Solder by Cyclic Loading Using Stepped Ramp Waves in another window
Topics: Creep, Lead-free solders, Fatigue life, Compression, Fatigue testing, Waves, Stress
Journal Articles

Time-Independent and Time-Dependent Inelastic Strain Analysis of Lead-Free Solder by Cyclic Loading Test Using Stepped Ramp Waves

Available to Purchase
Ken-ichi Ohguchi, Katsuhiko Sasaki
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041003.
https://doi.org/10.1115/1.4002897
Published Online: November 23, 2010
View Articletitled, Time-Independent and Time-Dependent Inelastic Strain Analysis of Lead-Free Solder by Cyclic Loading Test Using Stepped Ramp Waves
Open the PDF for Time-Independent and Time-Dependent Inelastic Strain Analysis of Lead-Free Solder by Cyclic Loading Test Using Stepped Ramp Waves in another window
Topics: Creep, Deformation, Lead-free solders, Stress, Waves, Solders, Alloys
Journal Articles

Reliability Modeling of Lead-Free Solder Joints in Wafer-Level Chip Scale Packages

Available to Purchase
Jie-Hua Zhao, Vikas Gupta, Alok Lohia, Darvin Edwards
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2010, 132(1): 011005.
https://doi.org/10.1115/1.4000754
Published Online: March 4, 2010
View Articletitled, Reliability Modeling of Lead-Free Solder Joints in Wafer-Level Chip Scale Packages
Open the PDF for Reliability Modeling of Lead-Free Solder Joints in Wafer-Level Chip Scale Packages in another window
Topics: Constitutive equations, Creep, Density, Fatigue, Finite element methods, Hardening, Lead-free solders, Modeling, Reliability, Semiconductor wafers
Journal Articles

Tensile Behaviors of Lead-Containing and Lead-Free Solders at High Strain Rates

Available to Purchase
Fei Qin, Tong An, Na Chen, Jie Bai
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031001.
https://doi.org/10.1115/1.3144151
Published Online: June 16, 2009
View Articletitled, Tensile Behaviors of Lead-Containing and Lead-Free Solders at High Strain Rates
Open the PDF for Tensile Behaviors of Lead-Containing and Lead-Free Solders at High Strain Rates in another window
Topics: Fractography, Lead-free solders, Solders, Tensile strength, Reliability, Electronic products, Solder joints, Stress-strain curves
Journal Articles

Laser Soldering of Fine Pitch QFP Devices Using Lead-Free Solders

Available to Purchase
Zongjie Han, Songbai Xue, Jianxin Wang, Xin Zhang, Shenglin Yu, Liang Zhang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021004.
https://doi.org/10.1115/1.3103932
Published Online: April 1, 2009
View Articletitled, Laser Soldering of Fine Pitch QFP Devices Using Lead-Free Solders
Open the PDF for Laser Soldering of Fine Pitch QFP Devices Using Lead-Free Solders in another window
Topics: Lasers, Lead-free solders, Mechanical properties, Soldering, Solders, Tin, Reflow soldering