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Journal Articles

Evaluation of Phase Transformation on Boron Decorated Sn-1.5Ag-0.7 Cu Joined Cu Pillar for Packaging Connection

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Ching-Yuan Ho, Haw-Teng Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2025, 147(3): 031004.
Paper No: EP-24-1023
https://doi.org/10.1115/1.4068448
Published Online: May 12, 2025
View Articletitled, Evaluation of Phase Transformation on Boron Decorated Sn-1.5Ag-0.7 Cu Joined Cu Pillar for Packaging Connection
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Topics: Boron, Columns (Structural), Grain size, High temperature, Intermetallic compounds, Solders, Tin, Storage, Packaging, Phase transitions
Journal Articles

Incorporating Tensile Stress Into Electromigration Life Prediction for Cu/SAC305/Cu Solder Joints

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Whit Vinson, David Huitink
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2025, 147(1): 011007.
Paper No: EP-24-1056
https://doi.org/10.1115/1.4066014
Published Online: August 9, 2024
View Articletitled, Incorporating Tensile Stress Into Electromigration Life Prediction for Cu/SAC305/Cu Solder Joints
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Topics: Current density, Electrodiffusion, Failure, Solder joints, Solders, Stress, Temperature, Tension, Testing, Electrons
Journal Articles

Process-Factor Optimization of Small-Area Sintered Interconnects for Power Electronics Applications

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Khalid Alzoubi, Alexander Hensel, Felix Häußler, Bettina Ottinger, Marcel Sippel, Jörg Franke
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031008.
Paper No: EP-22-1082
https://doi.org/10.1115/1.4056992
Published Online: March 8, 2023
View Articletitled, Process-Factor Optimization of Small-Area Sintered Interconnects for Power Electronics Applications
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Topics: Electronics, Experimental design, Intermetallic compounds, Optimization, Pressure, Shear strength, Silver, Sintering, Temperature, Failure
Journal Articles

Fracture Behavior and Reliability of Low-Silver Lead-Free Solder Joints

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Ved Prakash Sharma, Naresh Varma Datla
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041016.
Paper No: EP-21-1159
https://doi.org/10.1115/1.4054096
Published Online: March 31, 2022
View Articletitled, Fracture Behavior and Reliability of Low-Silver Lead-Free Solder Joints
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Topics: Fracture (Materials), Fracture (Process), Intermetallic compounds, Solder joints, Solders, Tin, Reliability, Fractography, Lead-free solders, Failure
Journal Articles

Optimized Design of Various Ag Decorated Sn-xAg-Cu 0.7 Solder Bump on Cycling Fatigue Reliability for Wafer-Level Chip Scale Packaging

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H. T. Lee, C. Y. Ho, C. C. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041001.
Paper No: EP-21-1043
https://doi.org/10.1115/1.4052075
Published Online: October 6, 2021
View Articletitled, Optimized Design of Various Ag Decorated Sn-xAg-Cu 0.7 Solder Bump on Cycling Fatigue Reliability for Wafer-Level Chip Scale Packaging
Open the PDF for Optimized Design of Various Ag Decorated Sn-xAg-Cu 0.7 Solder Bump on Cycling Fatigue Reliability for Wafer-Level Chip Scale Packaging in another window
Topics: Fatigue, Solders, Tin, Displacement, Fracture (Materials), Intermetallic compounds, Packaging, Reliability, Temperature
Journal Articles

Investigation of Elevated Temperature Mechanical Properties of Intermetallic Compounds in the Cu–Sn System Using Nanoindentation

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Zuozhu Yin, Fenglian Sun, Mengjiao Guo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2020, 142(2): 021004.
Paper No: EP-18-1042
https://doi.org/10.1115/1.4045980
Published Online: February 4, 2020
View Articletitled, Investigation of Elevated Temperature Mechanical Properties of Intermetallic Compounds in the Cu–Sn System Using Nanoindentation
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Topics: Elastic moduli, Intermetallic compounds, Temperature, Tin, Nanoindentation
Journal Articles

Interfacial Compounds Characteristic and Its Reliability Effects on SAC305 Microjoints in Flip Chip Assemblies

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Ye Tian, Ning Ren, Xiaoxia Jian, Tie Geng, Yiping Wu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031007.
Paper No: EP-18-1009
https://doi.org/10.1115/1.4040298
Published Online: June 11, 2018
View Articletitled, Interfacial Compounds Characteristic and Its Reliability Effects on SAC305 Microjoints in Flip Chip Assemblies
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Topics: Flip-chip assemblies, Reliability, Soldering, Tin, Solders, Finite element analysis, Fracture (Materials), Intermetallic compounds
Journal Articles

Effect of Solder Joint Thickness on Intermetallic Compound Growth Rate of Cu/Sn/Cu Solder Joints During Thermal Aging

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Yan Zhu, Fenglian Sun
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2016, 138(4): 041005.
Paper No: EP-16-1069
https://doi.org/10.1115/1.4034819
Published Online: October 10, 2016
View Articletitled, Effect of Solder Joint Thickness on Intermetallic Compound Growth Rate of Cu/Sn/Cu Solder Joints During Thermal Aging
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Topics: Solder joints, Solders, Tin, Diluents, Intermetallic compounds
Journal Articles

Growth Kinetics of Intermetallic Compounds Between Sn and Fe Liquid–Solid Reaction Couples

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Shou-Jen Hsu, Chin C. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2016, 138(4): 041006.
Paper No: EP-16-1095
https://doi.org/10.1115/1.4034842
Published Online: October 10, 2016
View Articletitled, Growth Kinetics of Intermetallic Compounds Between Sn and Fe Liquid–Solid Reaction Couples
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Topics: Annealing, Intermetallic compounds, Solders, Temperature, Tin, Diffusion (Physics), Carbon, Steel
Journal Articles

Relationship Between the Intermetallic Compounds Growth and the Microcracking Behavior of Lead-Free Solder Joints

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Tong An, Fei Qin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 011002.
Paper No: EP-15-1079
https://doi.org/10.1115/1.4032349
Published Online: March 10, 2016
View Articletitled, Relationship Between the Intermetallic Compounds Growth and the Microcracking Behavior of Lead-Free Solder Joints
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Topics: Failure mechanisms, Solder joints, Solders, Surface roughness, Lead-free solders, Intermetallic compounds, Tensile strength, Microcracks, Tin
Journal Articles

Effect of Intermetallic Compounds on the Thermomechanical Fatigue Life of Three-Dimensional Integrated Circuit Package Microsolder Bumps: Finite Element Analysis and Study

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Soud Farhan Choudhury, Leila Ladani
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2015, 137(4): 041003.
Paper No: EP-14-1099
https://doi.org/10.1115/1.4031523
Published Online: September 25, 2015
View Articletitled, Effect of Intermetallic Compounds on the Thermomechanical Fatigue Life of Three-Dimensional Integrated Circuit Package Microsolder Bumps: Finite Element Analysis and Study
Open the PDF for Effect of Intermetallic Compounds on the Thermomechanical Fatigue Life of Three-Dimensional Integrated Circuit Package Microsolder Bumps: Finite Element Analysis and Study in another window
Topics: Cycles, Fatigue life, Finite element analysis, Solders, Stress, Thermomechanics, Geometry, Reliability, Integrated circuits, Intermetallic compounds
Journal Articles

Analysis of Thermal Stress and Its Influence on Carrier Mobility in Three-Dimensional Microelectronic Chip Stack

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R. W. Johnson, Y.-L. Shen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2015, 137(2): 021011.
Paper No: EP-14-1045
https://doi.org/10.1115/1.4029345
Published Online: June 1, 2015
View Articletitled, Analysis of Thermal Stress and Its Influence on Carrier Mobility in Three-Dimensional Microelectronic Chip Stack
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Topics: Electron mobility, Solders, Stress, Thermal stresses, Intermetallic compounds, Deformation
Journal Articles

Structural Size Effect on Mechanical Behavior of Intermetallic Material in Solder Joints: Experimental Investigation

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Leila Ladani, Ousama Abdelhadi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2015, 137(1): 014501.
Paper No: EP-13-1116
https://doi.org/10.1115/1.4027992
Published Online: October 6, 2014
View Articletitled, Structural Size Effect on Mechanical Behavior of Intermetallic Material in Solder Joints: Experimental Investigation
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Topics: Intermetallic compounds, Mechanical properties, Nanoindentation, Solder joints, Tin, Mechanical behavior, Size effect, Elastic moduli, Yield strength, Stress
Journal Articles

Effect of Joint Size on Microstructure and Growth Kinetics of Intermetallic Compounds in Solid-Liquid Interdiffusion Sn3.5Ag/Cu-Substrate Solder Joints

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Ousama M. Abdelhadi, Leila Ladani
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2013, 135(2): 021004.
Paper No: EP-12-1069
https://doi.org/10.1115/1.4023846
Published Online: March 28, 2013
View Articletitled, Effect of Joint Size on Microstructure and Growth Kinetics of Intermetallic Compounds in Solid-Liquid Interdiffusion Sn3.5Ag/Cu-Substrate Solder Joints
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Topics: Solder joints, Soldering, Solders, Temperature, Tin, Intermetallic compounds
Journal Articles

Effect of Design Parameters on Drop Test Performance of Wafer Level Chip Scale Packages

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P. Tumne, V. Venkatadri, S. Kudtarkar, M. Delaus, D. Santos, R. Havens, K. Srihari
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Photo Gallery
J. Electron. Packag. June 2012, 134(2): 020905.
https://doi.org/10.1115/1.4005906
Published Online: June 11, 2012
View Articletitled, Effect of Design Parameters on Drop Test Performance of Wafer Level Chip Scale Packages
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Topics: Alloys, Design, Failure, Failure mechanisms, Intermetallic compounds, Reliability, Semiconductor wafers, Solders, Separation (Technology), Shock (Mechanics)
Journal Articles

Failure Analysis of Halogen-Free Printed Circuit Board Assembly Under Board-Level Drop Test

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Hung-Jen Chang, Chau-Jie Zhan, Tao-Chih Chang, Jung-Hua Chou
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2012, 134(1): 011011.
https://doi.org/10.1115/1.4005956
Published Online: March 19, 2012
View Articletitled, Failure Analysis of Halogen-Free Printed Circuit Board Assembly Under Board-Level Drop Test
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Topics: Failure, Failure analysis, Fracture (Materials), Intermetallic compounds, Lead-free solders, Printed circuit board assemblies, Solder joints, Solders, Stress, Tin
Journal Articles

Cracking of the Intermetallic Compound Layer in Solder Joints Under Drop Impact Loading

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Tong An, Fei Qin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031004.
https://doi.org/10.1115/1.4004870
Published Online: September 14, 2011
View Articletitled, Cracking of the Intermetallic Compound Layer in Solder Joints Under Drop Impact Loading
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Topics: Fracture (Materials), Fracture (Process), Solder joints, Solders, Tin, Intermetallic compounds, Failure mechanisms, Damage
Journal Articles

Influence of Intermetallic Characteristics on the Solder Joint Strength of Halogen-Free Printed Circuit Board Assembly

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Hung-Jen Chang, Jung-Hua Chou, Tao-Chih Chang, Chau-Jie Zhan, Min-Hsiung Hon, Chi-Shiung Hsi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021004.
https://doi.org/10.1115/1.4003989
Published Online: June 23, 2011
View Articletitled, Influence of Intermetallic Characteristics on the Solder Joint Strength of Halogen-Free Printed Circuit Board Assembly
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Topics: Alloys, Ball-Grid-Array packaging, Intermetallic compounds, Lead-free solders, Solder joints, Solders, Tin, Fracture (Materials), Finishes, Printed circuit board assemblies
Journal Articles

The Effect of Intermetallic Growth on Bump Pull Test Responses of SAC105 Solder Bumps

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Jose Omar S. Amistoso, Alberto V. Amorsolo, Jr.
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2009, 131(4): 041004.
https://doi.org/10.1115/1.4000206
Published Online: October 21, 2009
View Articletitled, The Effect of Intermetallic Growth on Bump Pull Test Responses of SAC105 Solder Bumps
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Topics: Intermetallic compounds, Solders, Temperature, Tin, Semiconductor wafers, Failure mechanisms
Journal Articles

Reliability of BGA and CSP on Metal-Backed Printed Circuit Boards in Harsh Environments

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Pradeep Lall, Nokibul Islam, John Evans, Jeff Suhling
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 382–390.
https://doi.org/10.1115/1.2804086
Published Online: March 7, 2007
View Articletitled, Reliability of BGA and CSP on Metal-Backed Printed Circuit Boards in Harsh Environments
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Topics: Ball-Grid-Array packaging, Crack propagation, Cycles, Fracture (Materials), Lumber, Metals, Reliability, Resistors, Solder joints, Printed circuit boards