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Journal Articles

A Review on Transient Thermal Management of Electronic Devices

John Mathew, Shankar Krishnan
Journal: Journal of Electronic Packaging
Article Type: Review Articles
J. Electron. Packag. March 2022, 144(1): 010801.
Paper No: EP-20-1113
DOI: https://doi.org/10.1115/1.4050002
Published Online: August 6, 2021
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Topics: Cooling, Heat, Heat pipes, Phase change materials, Temperature, Thermal management, Transients (Dynamics), Vapors, Boiling, Steady state
Journal Articles

Development and Application of a Thin Flat Heat Pipe Design Optimization Tool for Small Satellite Systems

Steven A. Isaacs, Caelan Lapointe, Peter E. Hamlington
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2021, 143(1): 011010.
Paper No: EP-19-1130
DOI: https://doi.org/10.1115/1.4047576
Published Online: July 10, 2020
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Topics: Design, Heat pipes, Optimization, Vapors, Flat heat pipes, Temperature, Condensers (steam plant), Computational fluid dynamics, Heat, Satellites
Journal Articles

Thermomechanical Interaction Between Thin Bare-Die Package and Thermal Solution in Next-Generation Mobile Computing Platforms

Aastha Uppal, Jerrod Peterson, Je-Young Chang, Xi Guo, Frank Liang, Weihua Tang
Journal: Journal of Electronic Packaging
Article Type: Review Articles
J. Electron. Packag. March 2019, 141(1): 010803.
Paper No: EP-18-1053
DOI: https://doi.org/10.1115/1.4042801
Published Online: March 4, 2019
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Topics: Design, Modeling, Thermomechanics, Stress, Heat pipes, Pressure
Journal Articles

Transient Response of an Oscillating Heat Pipe by a Pulsed Heating in a High Magnetic Field Environment

C. D. Smoot, A. A. Hathaway, H. B. Ma, M. T. Crawford, B. M. Huhman, Annie Sobel
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2015, 137(3): 031008.
Paper No: EP-13-1139
DOI: https://doi.org/10.1115/1.4030642
Published Online: September 1, 2015
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Topics: Copper, Heat, Heat pipes, Heating, Magnetic fields, Rails, Temperature, Transients (Dynamics), Fluids
Journal Articles

Thermal Performance of Nanofluid Charged Heat Pipe With Phase Change Material for Electronics Cooling

Sandesh S. Chougule, S. K. Sahu
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2015, 137(2): 021004.
Paper No: EP-14-1024
DOI: https://doi.org/10.1115/1.4028994
Published Online: June 1, 2015
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Topics: Computer cooling, Cooling, Heat pipes, Nanofluids, Phase change materials, Water, Temperature, Paraffin wax, Heating, Test facilities
Journal Articles

Two-Phase Thermal Ground Planes: Technology Development and Parametric Results

Avram Bar-Cohen, Kaiser Matin, Nicholas Jankowski, Darin Sharar
Journal: Journal of Electronic Packaging
Article Type: Review Articles
J. Electron. Packag. March 2015, 137(1): 010801.
Paper No: EP-14-1069
DOI: https://doi.org/10.1115/1.4028890
Published Online: November 14, 2014
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Topics: Cooling, Copper, Flat heat pipes, Fluids, Heat, Heat pipes, Silicon, Stress, Teams, Thermal conductivity
Journal Articles

Special Section on InterPACK 2013

Satish Chaparala, Ashish Gupta, Nils Hoivik, Y. C. Lee
Journal: Journal of Electronic Packaging
Article Type: Editorial
J. Electron. Packag. December 2014, 136(4): 040201.
Paper No: EP-14-1070
DOI: https://doi.org/10.1115/1.4028390
Published Online: September 19, 2014
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Topics: Copper, Design, Electronic packaging, Engineering mechanics, Manufacturing, Packaging, Reliability, Sensors, Silicon, Thermal management
Journal Articles

A New Analytical Approach for Dynamic Modeling of Passive Multicomponent Cooling Systems

A. Gholami, M. Ahmadi, M. Bahrami
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2014, 136(3): 031010.
Paper No: EP-14-1011
DOI: https://doi.org/10.1115/1.4027509
Published Online: May 12, 2014
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Topics: Cooling systems, Flat heat pipes, Heat, Heat pipes, Heat sinks, Network models, Temperature, Thermal resistance, Dynamic testing (Materials), Transients (Dynamics)
Journal Articles

Thermal Performance of an Al 2 O 3 –Water Nanofluid Pulsating Heat Pipe

Hamid Reza Seyf, Sejung Kim, Yuwen Zhang
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2013, 135(3): 031005.
Paper No: EP-12-1107
DOI: https://doi.org/10.1115/1.4024145
Published Online: June 4, 2013
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Topics: Displacement, Fluids, Heat pipes, Heat transfer, Latent heat, Nanofluids, Nanoparticles, Particulate matter, Pressure, Slug flows
Journal Articles

Promising Technology for Electronic Cooling: Nanofluidic Micro Pulsating Heat Pipes

Kambiz Jahani, Maziar Mohammadi, Mohammad Behshad Shafii, Zahra Shiee
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2013, 135(2): 021005.
Paper No: EP-12-1070
DOI: https://doi.org/10.1115/1.4023847
Published Online: March 28, 2013
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Topics: Computer cooling, Ferrofluids, Fluids, Heat pipes, Heating, Magnetic fields, Nanofluids, Thermal resistance, Water, Heat transfer
Journal Articles

An Investigation of Flat-Plate Oscillating Heat Pipes

Peng Cheng, Scott Thompson, Joe Boswell, H. B. Ma
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041009.
DOI: https://doi.org/10.1115/1.4002726
Published Online: November 24, 2010
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Topics: Diamonds, Flat plates, Fluids, Heat pipes, Heat transfer, Nanofluids, Temperature, Thermal resistance, Water, Operating temperature
Journal Articles

Study on a Pulsating Heat Pipe With Self-Rewetting Fluid

Koji Fumoto, Masahiro Kawaji, Tsuyoshi Kawanami
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. September 2010, 132(3): 031005.
DOI: https://doi.org/10.1115/1.4001855
Published Online: September 9, 2010
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Topics: Fluids, Heat pipes, Temperature, Water, Surface tension, Heat transfer, Thermal resistance, Heat
Journal Articles

Multiple Fan-Heat Sink Cooling System With Enhanced Evaporator Base: Design, Modeling, and Experiment

Pablo D. Quinones, Lawrence S. Mok
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031009.
DOI: https://doi.org/10.1115/1.3153407
Published Online: July 14, 2009
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Topics: Copper, Heat, Heat pipes, Heat sinks, Thermal conductivity, Thermal resistance, Cooling, Modeling, Flow (Dynamics), Finite element analysis
Journal Articles

Heat Transfer Limitation of a Micro Heat Pipe

K. N. Shukla
Journal: Journal of Electronic Packaging
Article Type: Technical Briefs
J. Electron. Packag. June 2009, 131(2): 024502.
DOI: https://doi.org/10.1115/1.3103970
Published Online: April 2, 2009
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Topics: Heat pipes, Heat transfer, Vapors, Heat
Journal Articles

An Experimental Investigation of a High Flux Heat Pipe Heat Sink

H. B. Ma, K. P. Lofgreen, G. P. Peterson
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. March 2006, 128(1): 18–22.
DOI: https://doi.org/10.1115/1.2159004
Published Online: May 10, 2005
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Topics: Air flow, Condensers (steam plant), Design, Heat, Heat pipes, Heat sinks, Heat transfer, Temperature, Particulate matter, Evaporation
Journal Articles

A Simplified Conduction Based Modeling Scheme for Design Sensitivity Study of Thermal Solution Utilizing Heat Pipe and Vapor Chamber Technology

Ravi S. Prasher
Journal: Journal of Electronic Packaging
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 378–385.
DOI: https://doi.org/10.1115/1.1602479
Published Online: September 17, 2003
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Topics: Cooling, Heat, Heat conduction, Heat pipes, Modeling, Temperature, Thermal conductivity, Vapors, Design, Heat sinks
Journal Articles

The Influence of the Thermal Conductivity on the Heat Transfer Performance in a Heat Sink

H. B. Ma, G. P. Peterson
Journal: Journal of Electronic Packaging
Article Type: Technical Papers
J. Electron. Packag. September 2002, 124(3): 164–169.
DOI: https://doi.org/10.1115/1.1478058
Published Online: July 26, 2002
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Topics: Heat sinks, Heat transfer, Thermal conductivity, Temperature distribution, Cooling, Heat pipes, Numerical analysis
Journal Articles

Thermal Management of Outdoor Electronic Cabinets Using Soil Heat Exchangers

Hisham E. Hegab, Assistant Professor,, Eric B. Zimmerman, Associate Professor,, Gene T. Colwell, Professor Emeritus,
Journal: Journal of Electronic Packaging
Article Type: Technical Papers
J. Electron. Packag. March 2002, 124(1): 7–11.
DOI: https://doi.org/10.1115/1.1392320
Published Online: March 1, 2002
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Topics: Computer simulation, Heat, Heat exchangers, Heat pipes, Soil, Stress, Temperature, Thermal management, Cooling systems, Transients (Dynamics)
Journal Articles

Thermal Performance of Integrated Plate Heat Pipe With a Heat Spreader

Koichiro Take, Ralph L. Webb
Journal: Journal of Electronic Packaging
Article Type: Technical Papers
J. Electron. Packag. September 2001, 123(3): 189–195.
DOI: https://doi.org/10.1115/1.1348010
Published Online: April 1, 2000
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Topics: Flat heat pipes, Heat, Heat pipes, Thermal resistance, Temperature, Laptop computers
Journal Articles

Investigation of a Heat Pipe Array for Convective Cooling

A. H. Howard, G. P. Peterson
Journal: Journal of Electronic Packaging
Article Type: Technical Papers
J. Electron. Packag. September 1995, 117(3): 208–214.
DOI: https://doi.org/10.1115/1.2792093
Published Online: September 1, 1995
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Topics: Cooling, Heat pipes, Heat, Copper, Electrical measurement, Fins, Flow (Dynamics), Pressure drop, Thermal resistance, Water