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Journal Articles

Effects of Thermal-Moisture Coupled Field on Delamination Behavior of Electronic Packaging

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Meng-Kai Shih, Guan-Sian Lin, Jonny Yang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2024, 146(3): 031002.
Paper No: EP-23-1072
https://doi.org/10.1115/1.4064355
Published Online: January 12, 2024
View Articletitled, Effects of Thermal-Moisture Coupled Field on Delamination Behavior of Electronic Packaging
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Topics: Delamination, Diffusion (Physics), Fracture (Materials), Manufacturing, Stress, Temperature, Design, Adhesion, Thermal stresses, Modeling
Journal Articles

Effective Constitutive Relations for Sintered Nano Copper Joints

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Sanoop Thekkut, Rajesh Sharma Sivasubramony, Arun Raj, Yuki Kawana, Jones Assiedu, Kabir Mirpuri, Ninad Shahane, Patrick Thompson, Peter Borgesen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021010.
Paper No: EP-22-1043
https://doi.org/10.1115/1.4056113
Published Online: November 11, 2022
View Articletitled, Effective Constitutive Relations for Sintered Nano Copper Joints
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Topics: Constitutive equations, Copper, Creep, Deformation, Diffusion (Physics), Oxidation, Stress, Temperature, Transients (Dynamics), Sintering
Journal Articles

Hybrid Monte Carlo-Diffusion Studies of Modeling Self-Heating in Ballistic-Diffusive Regime for Gallium Nitride HEMTs

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Han-Ling Li, Yang Shen, Yu-Chao Hua, S. L. Sobolev, Bing-Yang Cao
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011203.
Paper No: EP-22-1007
https://doi.org/10.1115/1.4054698
Published Online: July 13, 2022
View Articletitled, Hybrid Monte Carlo-Diffusion Studies of Modeling Self-Heating in Ballistic-Diffusive Regime for Gallium Nitride HEMTs
Open the PDF for Hybrid Monte Carlo-Diffusion Studies of Modeling Self-Heating in Ballistic-Diffusive Regime for Gallium Nitride HEMTs in another window
Topics: Diffusion (Physics), Gallium nitride, Heat, Heating, Modeling, Phonons, Simulation, Temperature, Heat conduction, Junctions
Journal Articles

Damage Analysis in Ag Nanoparticle Interconnect Line Under High-Density Electric Current

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Daiki Saito, Kazuhiko Sasagawa, Takeshi Moriwaki, Kazuhiro Fujisaki
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041012.
Paper No: EP-21-1136
https://doi.org/10.1115/1.4053365
Published Online: January 28, 2022
View Articletitled, Damage Analysis in Ag Nanoparticle Interconnect Line Under High-Density Electric Current
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Topics: Damage, Density, Electric current, Inks, Nanoparticles, Reliability, Lasers, Diffusion (Physics), Atoms, Grain boundaries
Journal Articles

Guidelines for Designing Micropillar Structures for Enhanced Evaporative Heat Transfer

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Kidus Guye, De Dong, Yunseo Kim, Hyoungsoon Lee, Baris Dogruoz, Damena Agonafer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041106.
Paper No: EP-21-1120
https://doi.org/10.1115/1.4052465
Published Online: October 13, 2021
View Articletitled, Guidelines for Designing Micropillar Structures for Enhanced Evaporative Heat Transfer
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Topics: Design, Drops, Evaporation, Heat conduction, Heat transfer, Heat transfer coefficients, Optimization, Particle swarm optimization, Shapes, Vapors
Journal Articles

Inelastic Deformation of Copper Nanoparticle Based Joints and Bonds

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Sanoop Thekkut, Maan Zaid Kokash, Rajesh Sharma Sivasubramony, Yuki Kawana, Kabir Mirpuri, Ninad Shahane, Patrick Thompson, Christopher M. Greene, Peter Borgesen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031009.
Paper No: EP-21-1076
https://doi.org/10.1115/1.4051728
Published Online: September 15, 2021
View Articletitled, Inelastic Deformation of Copper Nanoparticle Based Joints and Bonds
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Topics: Creep, Deformation, Diffusion (Physics), Dislocations, Stress, Temperature, Annealing, Nanoparticles, Particulate matter, Copper
Journal Articles

Fatigue Testing of Copper Nanoparticle-Based Joints and Bonds

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Rajesh Sharma Sivasubramony, Maan Zaid Kokash, Sanoop Thekkut, Ninad Shahane, Patrick Thompson, Kabir Mirpuri, Yuki Kawana, Christopher M. Greene, Peter Borgesen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2022, 144(1): 011007.
Paper No: EP-20-1120
https://doi.org/10.1115/1.4050871
Published Online: August 6, 2021
View Articletitled, Fatigue Testing of Copper Nanoparticle-Based Joints and Bonds
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Topics: Annealing, Cycles, Damage, Deformation, Dislocations, Fatigue, Fatigue life, Nanoparticles, Particulate matter, Shear strength
Journal Articles

Numerical Investigation of Shape Effect on Microdroplet Evaporation

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Li Shan, Shuai Shuai, Binjian Ma, Zichen Du, Baris Dogruoz, Damena Agonafer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2019, 141(4): 041008.
Paper No: EP-19-1038
https://doi.org/10.1115/1.4044962
Published Online: October 18, 2019
View Articletitled, Numerical Investigation of Shape Effect on Microdroplet Evaporation
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Topics: Diffusion (Physics), Drops, Evaporation, Vapors, Shapes, Simulation
Journal Articles

Modeling of Moisture Transport Into an Electronic Enclosure Using the Resistor-Capacitor Approach

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Ž. Staliulionis, H. Conseil-Gudla, S. Mohanty, M. Jabbari, R. Ambat, J. H. Hattel
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031001.
Paper No: EP-17-1046
https://doi.org/10.1115/1.4039790
Published Online: May 10, 2018
View Articletitled, Modeling of Moisture Transport Into an Electronic Enclosure Using the Resistor-Capacitor Approach
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Topics: Capacitors, Circuits, Diffusion (Physics), Modeling, Resistors, Temperature, Wall thickness
Journal Articles

Display Light Guide Swelling Due to Moisture Absorption

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A. K. Cousins, G. H. Thiel, E. Wolak, G. Limaye, S. Tiku
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2017, 139(4): 041006.
Paper No: EP-17-1070
https://doi.org/10.1115/1.4037971
Published Online: October 5, 2017
View Articletitled, Display Light Guide Swelling Due to Moisture Absorption
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Topics: Absorption, Diffusion (Physics), Water, Water absorption, Polymers
Journal Articles

Effect of the Crystallinity on the Electromigration Resistance of Electroplated Copper Thin-Film Interconnections

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Takeru Kato, Ken Suzuki, Hideo Miura
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2017, 139(2): 020911.
Paper No: EP-16-1144
https://doi.org/10.1115/1.4036442
Published Online: June 12, 2017
View Articletitled, Effect of the Crystallinity on the Electromigration Resistance of Electroplated Copper Thin-Film Interconnections
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Topics: Atoms, Copper, Current density, Diffusion (Physics), Electrodiffusion, Grain boundaries, Reliability, Temperature, Thin films, Heating
Journal Articles

Moisture Ingress, Behavior, and Prediction Inside Semiconductor Packaging: A Review

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Bongtae Han, Dae-Suk Kim
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. March 2017, 139(1): 010802.
Paper No: EP-16-1107
https://doi.org/10.1115/1.4035598
Published Online: January 16, 2017
View Articletitled, Moisture Ingress, Behavior, and Prediction Inside Semiconductor Packaging: A Review
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Topics: Diffusion (Physics), Polymers, Temperature, Cavities, Semiconductors (Materials), Packaging, Water, Vapor pressure
Journal Articles

A Finite Difference Lattice Boltzmann Method to Simulate Multidimensional Subcontinuum Heat Conduction

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Cheng Chen, James Geer, Bahgat Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2016, 138(4): 041008.
Paper No: EP-16-1053
https://doi.org/10.1115/1.4034856
Published Online: October 20, 2016
View Articletitled, A Finite Difference Lattice Boltzmann Method to Simulate Multidimensional Subcontinuum Heat Conduction
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Topics: Diffusion (Physics), Heat conduction, Lattice Boltzmann methods, Phonons, Silicon, Temperature, Thermal conductivity, Density, Heat, Equilibrium (Physics)
Journal Articles

Growth Kinetics of Intermetallic Compounds Between Sn and Fe Liquid–Solid Reaction Couples

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Shou-Jen Hsu, Chin C. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2016, 138(4): 041006.
Paper No: EP-16-1095
https://doi.org/10.1115/1.4034842
Published Online: October 10, 2016
View Articletitled, Growth Kinetics of Intermetallic Compounds Between Sn and Fe Liquid–Solid Reaction Couples
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Topics: Annealing, Intermetallic compounds, Solders, Temperature, Tin, Diffusion (Physics), Carbon, Steel
Journal Articles

A Note on the Normalized Approach to Simulating Moisture Diffusion in a Multimaterial System Under Transient Thermal Conditions Using ansys 14 and 14.5

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Dapeng Liu, Seungbae Park
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2014, 136(3): 034501.
Paper No: EP-13-1094
https://doi.org/10.1115/1.4026661
Published Online: May 5, 2014
View Articletitled, A Note on the Normalized Approach to Simulating Moisture Diffusion in a Multimaterial System Under Transient Thermal Conditions Using ansys 14 and 14.5
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Topics: Diffusion (Physics), Simulation, Temperature, Transients (Dynamics), Materials properties
Journal Articles

Analytical Solutions and a Numerical Approach for Diffusion-Induced Stresses in Intermetallic Compound Layers of Solder Joints

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Tong An, Fei Qin, Guofeng Xia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2014, 136(1): 011001.
Paper No: EP-13-1028
https://doi.org/10.1115/1.4025863
Published Online: November 22, 2013
View Articletitled, Analytical Solutions and a Numerical Approach for Diffusion-Induced Stresses in Intermetallic Compound Layers of Solder Joints
Open the PDF for Analytical Solutions and a Numerical Approach for Diffusion-Induced Stresses in Intermetallic Compound Layers of Solder Joints in another window
Topics: Diffusion (Physics), Stress, Tin, Atoms, Solders, Solder joints
Journal Articles

Hygromechanical Analysis of Liquid Crystal Display Panels

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Toru Ikeda, Tomonori Mizutani, Kiyoshi Miyake, Noriyuki Miyazaki
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2013, 135(4): 041005.
Paper No: EP-10-1084
https://doi.org/10.1115/1.4025527
Published Online: November 5, 2013
View Articletitled, Hygromechanical Analysis of Liquid Crystal Display Panels
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Topics: Diffusion (Physics), Liquid crystals, Polarizers (Light), Temperature, Thermomechanics, Warping, Gas laws (Thermodynamics), Materials properties
Journal Articles

Enhanced Diffusion of Silver Atoms on the Surface of Nanoparticles at Low Temperatures

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Jung-Il Hong, Yong Ding, Kyoung-Sik Moon, C. P. Wong
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2013, 135(1): 011002.
Paper No: EP-11-1101
https://doi.org/10.1115/1.4023910
Published Online: March 26, 2013
View Articletitled, Enhanced Diffusion of Silver Atoms on the Surface of Nanoparticles at Low Temperatures
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Topics: Atoms, Diffusion (Physics), Low temperature, Nanoparticles, Silver, Temperature
Journal Articles

Numerical Simulations of Electromigration and Stressmigration Driven Void Evolution in Solder Interconnects

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Subramanya Sadasiva, Ganesh Subbarayan, Lei Jiang, Daniel Pantuso
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Photo Gallery
J. Electron. Packag. June 2012, 134(2): 020907.
https://doi.org/10.1115/1.4006707
Published Online: June 11, 2012
View Articletitled, Numerical Simulations of Electromigration and Stressmigration Driven Void Evolution in Solder Interconnects
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Topics: Diffusion (Physics), Electrodiffusion, Solder joints, Solders, Stress, Flip-chip, Finite element analysis, Grain boundary diffusion, Electric potential, Surface energy
Journal Articles

Evaluation of the Dominant Factor for Electromigration in Sputtered High Purity Al Films

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X. Zhao, M. Saka, M. Yamashita, F. Togoh
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2010, 132(2): 021003.
https://doi.org/10.1115/1.4001687
Published Online: June 11, 2010
View Articletitled, Evaluation of the Dominant Factor for Electromigration in Sputtered High Purity Al Films
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Topics: Current density, Diffusion (Physics), Electrodiffusion, Grain boundary diffusion, Grain size, Temperature, Sputtering (Irradiation), Circuits, Damage, Strips