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Journal Articles

Electrochemical Linked to Mechanical Simulation for an Assessment of State-of-Health of Thin-Flexible Li-Ion Batteries on Dynamic Flexing and Calendar Aging

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Pradeep Lall, Hyesoo Jang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2025, 147(2): 021006.
Paper No: EP-24-1003
https://doi.org/10.1115/1.4067266
Published Online: January 23, 2025
View Articletitled, Electrochemical Linked to Mechanical Simulation for an Assessment of State-of-Health of Thin-Flexible Li-Ion Batteries on Dynamic Flexing and Calendar Aging
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Topics: Batteries, Cycles, Simulation, Stress, Engineering simulation, Lithium-ion batteries, Electrodes
Journal Articles

Application of the Nonlinear Fracture Mechanics Parameter Δ T * to Wire-Liftoff Lifetime Estimation of Power Modules at Elevated Temperatures

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Nobuyuki Shishido, Yutaka Hayama, Yuki Akinaga, Shinya Taketomi, Masaaki Koganemaru, Seiya Hagihara, Noriyuki Miyazaki
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2025, 147(1): 011010.
Paper No: EP-24-1039
https://doi.org/10.1115/1.4066100
Published Online: August 24, 2024
View Articletitled, Application of the Nonlinear Fracture Mechanics Parameter Δ T * to Wire-Liftoff Lifetime Estimation of Power Modules at Elevated Temperatures
Open the PDF for Application of the Nonlinear Fracture Mechanics Parameter Δ T * to Wire-Liftoff Lifetime Estimation of Power Modules at Elevated Temperatures in another window
Topics: Creep, Cycles, Fatigue, Fracture (Materials), Fracture mechanics, Temperature, Wire, Computational methods, Finite element analysis
Journal Articles

Virtual Testbed for Economical and Reliability Analysis of Battery Thermal Management Control Strategies

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Mostafa Olyaei, Sagar Singh, Kaiying Jiang, Yashraj Gurumukhi, Kenneth Goodson, Mehdi Asheghi, Nenad Miljkovic
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041110.
Paper No: EP-24-1024
https://doi.org/10.1115/1.4065988
Published Online: August 9, 2024
View Articletitled, Virtual Testbed for Economical and Reliability Analysis of Battery Thermal Management Control Strategies
Open the PDF for Virtual Testbed for Economical and Reliability Analysis of Battery Thermal Management Control Strategies in another window
Topics: Batteries, Cycles, Temperature, Thermal management, Cooling
Journal Articles

Investigation of the Impacts of Solder Alloy Composition and Temperature Profile on Fatigue Life of Ball Grid Array Solder Joints Under Accelerated Thermal Cycling

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Rilwan Kayode Apalowo, Mohamad Aizat Abas, Muhamed Abdul Fatah Muhamed Mukhtar, Mohamad Riduwan Ramli
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2025, 147(1): 011005.
Paper No: EP-24-1049
https://doi.org/10.1115/1.4065805
Published Online: July 16, 2024
View Articletitled, Investigation of the Impacts of Solder Alloy Composition and Temperature Profile on Fatigue Life of Ball Grid Array Solder Joints Under Accelerated Thermal Cycling
Open the PDF for Investigation of the Impacts of Solder Alloy Composition and Temperature Profile on Fatigue Life of Ball Grid Array Solder Joints Under Accelerated Thermal Cycling in another window
Topics: Alloys, Fatigue life, Solder joints, Solders, Temperature profiles, Ball-Grid-Array packaging, Stress, Temperature, Cycles, Fatigue
Journal Articles

Special Issue on InterPACK2022

Free
Jin Yang, Sukwon Choi, Benjamin Leever, Cheng Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. December 2023, 145(4): 040301.
Paper No: EP-23-1077
https://doi.org/10.1115/1.4063893
Published Online: November 1, 2023
View Articletitled, Special Issue on InterPACK2022
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Topics: Aerosols, Artificial intelligence, Cloud computing, Cooling, Cycles, Density, Electric vehicles, Electronic packaging, Electronics, Energy conversion
Journal Articles

Model Establishment of Chip Air Cooling Process and Its Proportional Integral Differential Tuning

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Linmeng Xu, Wanying Zhao, Junhui Li
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031010.
Paper No: EP-22-1063
https://doi.org/10.1115/1.4062530
Published Online: June 23, 2023
View Articletitled, Model Establishment of Chip Air Cooling Process and Its Proportional Integral Differential Tuning
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Topics: Convection, Cooling, Cycles, Heat, Temperature, Heat conduction, Optimization, Thermal resistance, Matlab, Energy dissipation
Journal Articles

Surrogate Modeling for Creep Strain-Based Fatigue Prediction of a Ball Grid Array Component

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Markus Tauscher, Tobias Merk, Aniket Adsule, Andreas Linnemann, Jürgen Wilde
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2024, 146(1): 011003.
Paper No: EP-23-1001
https://doi.org/10.1115/1.4062404
Published Online: May 15, 2023
View Articletitled, Surrogate Modeling for Creep Strain-Based Fatigue Prediction of a Ball Grid Array Component
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Topics: Ball-Grid-Array packaging, Creep, Fatigue, Solders, Cycles, Deformation
Journal Articles

Effect of Heating Power on Ball Grid Array Thermal Shock Reliability for a Fanout Package

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Ke Zhong, Huanpeng Wang, Jingrou Wang, Yuehang Xu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2024, 146(1): 011002.
Paper No: EP-22-1090
https://doi.org/10.1115/1.4062344
Published Online: May 2, 2023
View Articletitled, Effect of Heating Power on Ball Grid Array Thermal Shock Reliability for a Fanout Package
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Topics: Ball-Grid-Array packaging, Fatigue life, Heat, Heating, Reliability, Solders, Stress, Temperature, Thermal shock, Cycles
Journal Articles

Investigation of Electromechanical Reliability and Radio Frequency Performance of a Highly Stretchable Liquid Metal Conductor for Wearable Electronics

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Behnam Garakani, Udara S. Somarathna, Ashraf Umar, Gurvinder Singh Khinda, Mohamed Youssef M. Abdelatty, El Mehdi Abbara, Sari Al Zerey, Mike Hopkins, Sai Srinivas, Chuck Kinzel, Christopher Halseth, Mark Ronay, Mark D. Poliks
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031006.
Paper No: EP-22-1008
https://doi.org/10.1115/1.4056640
Published Online: February 1, 2023
View Articletitled, Investigation of Electromechanical Reliability and Radio Frequency Performance of a Highly Stretchable Liquid Metal Conductor for Wearable Electronics
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Topics: Fatigue, Liquid metals, Tension, Transmission lines, Cycles, Fatigue testing, Reliability, Wearable devices, Metals, Simulation
Journal Articles

Assessing the SAC305 Solder Joint Fatigue in Ball Grid Array Assembly Using Strain-Controlled and Stress-Controlled Approaches

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Xin Wei, Sa'd Hamasha, Ali Alahmer, Mohamed El Amine Belhadi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031005.
Paper No: EP-22-1066
https://doi.org/10.1115/1.4056559
Published Online: January 27, 2023
View Articletitled, Assessing the SAC305 Solder Joint Fatigue in Ball Grid Array Assembly Using Strain-Controlled and Stress-Controlled Approaches
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Topics: Ball-Grid-Array packaging, Cycles, Fatigue, Finishes, Solder joints, Stress, Fatigue life, Solders, Alloys
Journal Articles

Mandrel Bend Test of Screen-Printed Silver Conductors

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Rui Chen, Justin Chow, Yi Zhou, Suresh K. Sitaraman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031004.
Paper No: EP-22-1072
https://doi.org/10.1115/1.4056530
Published Online: January 11, 2023
View Articletitled, Mandrel Bend Test of Screen-Printed Silver Conductors
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Topics: Cycles, Flexible electronics, Silver, Reliability, Inks, Damage, Imaging
Journal Articles

Multi-Physics Models of a Low-Voltage Power Semiconductor System-in-Package for Automotive Applications

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Giuseppe Mauromicale, Michele Calabretta, Giuseppe Scarcella, Giacomo Scelba, Alessandro Sitta
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031003.
Paper No: EP-22-1049
https://doi.org/10.1115/1.4056413
Published Online: December 23, 2022
View Articletitled, Multi-Physics Models of a Low-Voltage Power Semiconductor System-in-Package for Automotive Applications
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Topics: Power semiconductor devices, Simulation, Design, Automotive industry, System-in-package, Thermomechanics, Cycles
Journal Articles

Reliability of State-of-Health of the Flexible Li-Ion Batteries Under Various Flexing Conditions and Calendar Aging

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Pradeep Lall, Hyesoo Jang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011108.
Paper No: EP-22-1030
https://doi.org/10.1115/1.4056412
Published Online: December 23, 2022
View Articletitled, Reliability of State-of-Health of the Flexible Li-Ion Batteries Under Various Flexing Conditions and Calendar Aging
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Topics: Batteries, Cycles, Lithium-ion batteries, Machine learning, Regression models, Reliability, Stress
Journal Articles

Design Optimization by Virtual Prototyping Using Numerical Simulation to Ensure Thermomechanical Reliability in the Assembly and Interconnection of Electronic Assemblies

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Ralf Döring, R. Dudek, S. Rzepka, L. Scheiter, E. Noack, B. Seiler
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011107.
Paper No: EP-22-1020
https://doi.org/10.1115/1.4056445
Published Online: December 23, 2022
View Articletitled, Design Optimization by Virtual Prototyping Using Numerical Simulation to Ensure Thermomechanical Reliability in the Assembly and Interconnection of Electronic Assemblies
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Topics: Design, Reliability, Simulation, Thermomechanics, Manufacturing, Solders, Computer simulation, Creep, Stress, Cycles
Journal Articles

Module-Level Thermal Interface Material Degradation in HALT

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Joshua Tompkins, Alicia Medina Garcia, David Huitink, Haitao Liao
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011106.
Paper No: EP-22-1021
https://doi.org/10.1115/1.4056030
Published Online: November 23, 2022
View Articletitled, Module-Level Thermal Interface Material Degradation in HALT
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Topics: Cycles, Life testing, Stress, Temperature, Testing, Thermal resistance, Vibration, Electronics, Reliability, Heating
Includes: Supplementary data
Journal Articles

Dynamic Modeling Framework for Evaluating Electromagnetic-Electro-Thermal Behavior of Power Conversion System During Load Operation

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Hsien-Chie Cheng, Yan-Cheng Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021005.
Paper No: EP-22-1012
https://doi.org/10.1115/1.4055591
Published Online: September 28, 2022
View Articletitled, Dynamic Modeling Framework for Evaluating Electromagnetic-Electro-Thermal Behavior of Power Conversion System During Load Operation
Open the PDF for Dynamic Modeling Framework for Evaluating Electromagnetic-Electro-Thermal Behavior of Power Conversion System During Load Operation in another window
Topics: Capacitance, Circuits, Computational fluid dynamics, Energy dissipation, Heat conduction, Junctions, Modeling, MOSFET transistors, Network models, Power conversion systems
Journal Articles

Development and Validation of a Transient Heat Transfer Model for Evaluating Thermal Management Solutions for Packaging Next-Generation Smart City Infrastructure Devices

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Shuv Dey, Luis Diego Monge Jimenez, J. Michael Brown, Yogendra Joshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021004.
Paper No: EP-22-1038
https://doi.org/10.1115/1.4055094
Published Online: August 18, 2022
View Articletitled, Development and Validation of a Transient Heat Transfer Model for Evaluating Thermal Management Solutions for Packaging Next-Generation Smart City Infrastructure Devices
Open the PDF for Development and Validation of a Transient Heat Transfer Model for Evaluating Thermal Management Solutions for Packaging Next-Generation Smart City Infrastructure Devices in another window
Topics: Climate, Design, Solar energy, Temperature, Thermal management, Transients (Dynamics), Solar radiation, Smart cities, Computer simulation, Cycles
Journal Articles

Electrical Reliability of Flexible Silicon Package Integrated on Polymer Substrate During Repeated Bending Deformations

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Tae-Wook Kim, Jae-Min Kim, Hyeon-Ji Yun, Jong-Sung Lee, Jae-Hak Lee, Jun-Yeob Song, Young-Chang Joo, Won-Jun Lee, Byoung-Joon Kim
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041017.
Paper No: EP-21-1014
https://doi.org/10.1115/1.4054183
Published Online: April 22, 2022
View Articletitled, Electrical Reliability of Flexible Silicon Package Integrated on Polymer Substrate During Repeated Bending Deformations
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Topics: Deformation, Electrical resistance, Fatigue, Metals, Molding, Polymers, Reliability, Silicon, Simulation, Stress
Includes: Supplementary data
Journal Articles

A Reduced Model Based on Proper Generalized Decomposition for the Fast Analysis of IGBT Power Modules Lifetime

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Louis Schuler, Ludovic Chamoin, Zoubir Khatir, Mounira Berkani, Merouane Ouhab, Nicolas Degrenne
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031013.
Paper No: EP-21-1138
https://doi.org/10.1115/1.4053767
Published Online: March 7, 2022
View Articletitled, A Reduced Model Based on Proper Generalized Decomposition for the Fast Analysis of IGBT Power Modules Lifetime
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Topics: Design, Solder joints, Temperature, Thermomechanics, Geometry, Finite element analysis, Convection, Cycles, Sensitivity analysis
Journal Articles

Effect of U-Flex-to-Install and Dynamic U-Flexing on Li-Ion Battery State of Health Degradation Subjected to Varying Fold Orientations, Folding Speeds, Depths of Charge, C-Rates, and Temperatures

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Pradeep Lall, Ved Soni, Scott Miller
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021112.
Paper No: EP-21-1058
https://doi.org/10.1115/1.4052750
Published Online: January 4, 2022
View Articletitled, Effect of U-Flex-to-Install and Dynamic U-Flexing on Li-Ion Battery State of Health Degradation Subjected to Varying Fold Orientations, Folding Speeds, Depths of Charge, C-Rates, and Temperatures
Open the PDF for Effect of U-Flex-to-Install and Dynamic U-Flexing on Li-Ion Battery State of Health Degradation Subjected to Varying Fold Orientations, Folding Speeds, Depths of Charge, C-Rates, and Temperatures in another window
Topics: Batteries, Cycles, Lithium-ion batteries, Temperature, Regression models, Operating temperature, Reliability