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Journal Articles

A Contribution to Printed Circuit Boards' Miniaturization by the Vertical Embedding of Passive Components

Peter Lukacs, Tibor Rovensky, Alexandr Otahal
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2024, 146(1): 011004.
Paper No: EP-23-1005
https://doi.org/10.1115/1.4062470
Published Online: May 18, 2023
View Article titled, A Contribution to Printed Circuit Boards' Miniaturization by the Vertical Embedding of Passive Components
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Topics: Cross section (Physics), Lead-free solders, Printed circuit boards, Solder joints, Soldering, Solders, Surface mount devices, Capacitors, Dislocations, Reliability
Journal Articles

The Nature of Centroidal Locus in Misaligned Flip-Chip Solder Joints

G. Subbarayan, A. Deshpande
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1997, 119(3): 156–162.
https://doi.org/10.1115/1.2792228
Published Online: September 1, 1997
View Article titled, The Nature of Centroidal Locus in Misaligned Flip-Chip Solder Joints
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Topics: Flip-chip, Solder joints, Cross section (Physics), Three-dimensional models, Design, Optoelectronic devices, Shapes
Journal Articles

Local PWB and Component Bowing of an Assembly Subjected to a Bending Moment

D. B. Barker, Sidharth
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1994, 116(2): 92–97.
https://doi.org/10.1115/1.2905511
Published Online: June 1, 1994
View Article titled, Local PWB and Component Bowing of an Assembly Subjected to a Bending Moment
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Topics: Manufacturing, Printed circuit boards, Cross section (Physics), Electronic components, Rotation, Stiffness, Stress
Journal Articles

Thermal Stress Analysis of Pin Grid Array Structures: Pin and Solder Joint Problems

Peter A. Engel, Kee Rong Wu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1992, 114(3): 314–321.
https://doi.org/10.1115/1.2905457
Published Online: September 1, 1992
View Article titled, Thermal Stress Analysis of Pin Grid Array Structures: Pin and Solder Joint Problems
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Topics: Solder joints, Thermal stresses, Stress, Cross section (Physics), Failure mechanisms, Finite element methods, Iterative methods, Plasticity, Pressure, Solders