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Journal Articles

Experimental Investigation of Boiling Heat Transfer in a Liquid Chamber With Partially Soluble Nanofluids

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Noriyuki Unno, Kazuhisa Yuki, Risako Kibushi, Atsuyuki Mitani
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011104.
Paper No: EP-22-1019
https://doi.org/10.1115/1.4055841
Published Online: October 22, 2022
View Articletitled, Experimental Investigation of Boiling Heat Transfer in a Liquid Chamber With Partially Soluble Nanofluids
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Topics: Boiling, Critical heat flux, Heat flux, Heat transfer, Nanofluids, Water, Thermal resistance, Aluminum, Wall temperature, Temperature
Journal Articles

Parametric Effects on Pool Boiling Heat Transfer and Critical Heat Flux: A Critical Review

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Tolga Emir, Hamza Ourabi, Mete Budakli, Mehmet Arik
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. December 2022, 144(4): 040801.
Paper No: EP-21-1129
https://doi.org/10.1115/1.4054184
Published Online: April 28, 2022
View Articletitled, Parametric Effects on Pool Boiling Heat Transfer and Critical Heat Flux: A Critical Review
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Topics: Boiling, Bubbles, Critical heat flux, Heat transfer, Pool boiling, Pressure, Nucleation (Physics), Fluids, Water, Heat
Journal Articles

Numerical and Parametric Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics

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Wei Tong, Alireza Ganjali, Omidreza Ghaffari, Chady al Sayed, Luc Fréchette, Julien Sylvestre
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041011.
Paper No: EP-21-1119
https://doi.org/10.1115/1.4053310
Published Online: January 28, 2022
View Articletitled, Numerical and Parametric Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics
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Topics: Boiling, Cooling, Heat, Heat transfer coefficients, Temperature, Critical heat flux, Temperature distribution, Flat heat pipes
Journal Articles

Parametric Effects of Heater Size, Contact Angle, and Surrounding Vessel Size on Pool Boiling Critical Heat Flux From Horizontal Surfaces

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Zhenyu She, Vijay K. Dhir
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041113.
Paper No: EP-21-1108
https://doi.org/10.1115/1.4052716
Published Online: November 9, 2021
View Articletitled, Parametric Effects of Heater Size, Contact Angle, and Surrounding Vessel Size on Pool Boiling Critical Heat Flux From Horizontal Surfaces
Open the PDF for Parametric Effects of Heater Size, Contact Angle, and Surrounding Vessel Size on Pool Boiling Critical Heat Flux From Horizontal Surfaces in another window
Topics: Critical heat flux, Disks, Vapors, Vessels, Boiling, Wavelength, Pool boiling
Journal Articles

Microflow-Enhanced Bubble Dynamics Along With Gradient Porous Surfaces

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Cheng-Hui Lin, Yoonjin Won
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041112.
Paper No: EP-21-1105
https://doi.org/10.1115/1.4052790
Published Online: November 9, 2021
View Articletitled, Microflow-Enhanced Bubble Dynamics Along With Gradient Porous Surfaces
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Topics: Boiling, Bubbles, Critical heat flux, Electrodeposition, Heat transfer, Copper, Dynamics (Mechanics), Microscale devices, Fins, Flow (Dynamics)
Includes: Supplementary data
Journal Articles

A Novel Package-Integrated Cyclone Cooler for the Thermal Management of Power Electronics

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Rinaldo Miorini, Darin Sharar, Arun Gowda, Cathleen Hoel, Bryan Whalen, Peter de Bock
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021105.
Paper No: EP-21-1012
https://doi.org/10.1115/1.4052071
Published Online: September 24, 2021
View Articletitled, A Novel Package-Integrated Cyclone Cooler for the Thermal Management of Power Electronics
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Topics: Additive manufacturing, Bubbles, Ceramics, Cooling, Critical heat flux, Design, Electronics, Flow (Dynamics), Fluids, Heat
Journal Articles

Experimental Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics

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Omidreza Ghaffari, Wei Tong, Yaser Nabavi Larimi, Chady al Sayed, Alireza Ganjali, Jean-François Morissette, Francis Grenier, Simon Jasmin, Luc Fréchette, Julien Sylvestre
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041103.
Paper No: EP-21-1083
https://doi.org/10.1115/1.4051943
Published Online: August 27, 2021
View Articletitled, Experimental Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics
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Topics: Boiling, Cooling, Dielectric liquids, Heat, Temperature, Copper, Flat heat pipes, Pool boiling, Critical heat flux, Subcooling
Journal Articles

Spray Cooling on Enhanced Surfaces: A Review of the Progress and Mechanisms

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Ruina Xu, Gaoyuan Wang, Peixue Jiang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. March 2022, 144(1): 010802.
Paper No: EP-20-1114
https://doi.org/10.1115/1.4050046
Published Online: August 6, 2021
View Articletitled, Spray Cooling on Enhanced Surfaces: A Review of the Progress and Mechanisms
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Topics: Cooling, Heat transfer, Sprays, Critical heat flux, Drops
Journal Articles

Guidelines for Reduced-Order Thermal Modeling of Multifinger GaN HEMTs

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Robert Pearson, Bikramjit Chatterjee, Samuel Kim, Samuel Graham, Alexander Rattner, Sukwon Choi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2020, 142(2): 021012.
Paper No: EP-19-1087
https://doi.org/10.1115/1.4046620
Published Online: April 6, 2020
View Articletitled, Guidelines for Reduced-Order Thermal Modeling of Multifinger GaN HEMTs
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Topics: Gallium nitride, Gates (Closures), Heat, Modeling, Temperature, Heat flux, Heating, Critical heat flux, Heart failure, Approximation
Journal Articles

Enhanced Heat Transfer Using Microporous Copper Inverse Opals

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Hyoungsoon Lee, Tanmoy Maitra, James Palko, Daeyoung Kong, Chi Zhang, Michael T. Barako, Yoonjin Won, Mehdi Asheghi, Kenneth E. Goodson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2018, 140(2): 020906.
Paper No: EP-18-1003
https://doi.org/10.1115/1.4040088
Published Online: May 9, 2018
View Articletitled, Enhanced Heat Transfer Using Microporous Copper Inverse Opals
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Topics: Copper, Critical heat flux, Heat transfer, Pool boiling, Boiling, Heat transfer coefficients, Bubbles
Journal Articles

Two-Phase Microchannel Heat Sinks: Theory, Applications, and Limitations

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Issam Mudawar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041002.
https://doi.org/10.1115/1.4005300
Published Online: December 8, 2011
View Articletitled, Two-Phase Microchannel Heat Sinks: Theory, Applications, and Limitations
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Topics: Boiling, Cooling, Flow (Dynamics), Heat sinks, Microchannels, Critical heat flux, Microchannel flow, Pressure drop
Journal Articles

Film Thickness and Heat Transfer Measurements in a Spray Cooling System With R134a

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Eduardo Martínez-Galván, Juan Carlos Ramos, Raúl Antón, Rahmatollah Khodabandeh
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2011, 133(1): 011002.
https://doi.org/10.1115/1.4001857
Published Online: March 3, 2011
View Articletitled, Film Thickness and Heat Transfer Measurements in a Spray Cooling System With R134a
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Topics: Cooling, Film thickness, Heat flux, Heat transfer, Sprays, Refrigerants, Critical heat flux, Temperature, Boiling
Journal Articles

Single-Phase and Two-Phase Hybrid Cooling Schemes for High-Heat-Flux Thermal Management of Defense Electronics

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Myung Ki Sung, Issam Mudawar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021013.
https://doi.org/10.1115/1.3111253
Published Online: April 21, 2009
View Articletitled, Single-Phase and Two-Phase Hybrid Cooling Schemes for High-Heat-Flux Thermal Management of Defense Electronics
Open the PDF for Single-Phase and Two-Phase Hybrid Cooling Schemes for High-Heat-Flux Thermal Management of Defense Electronics in another window
Topics: Cooling, Flow (Dynamics), Heat, Jets, Microchannels, Temperature, Coolants, Defense industry, Electronics, Thermal management
Journal Articles

Optimization of Pool Boiling Heat Sinks Including the Effects of Confinement in the Interfin Spaces

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Karl J. L. Geisler, Avram Bar-Cohen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2008, 130(4): 041002.
https://doi.org/10.1115/1.2993135
Published Online: November 14, 2008
View Articletitled, Optimization of Pool Boiling Heat Sinks Including the Effects of Confinement in the Interfin Spaces
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Topics: Aluminum, Boiling, Heat sinks, Heat, Fins, Thermal conductivity, Critical heat flux, Silicon, Energy dissipation, Heat transfer coefficients
Journal Articles

A Systematic Approach to Predicting Critical Heat Flux for Inclined Sprays

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Milan Visaria, Issam Mudawar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 452–459.
https://doi.org/10.1115/1.2804095
Published Online: March 26, 2007
View Articletitled, A Systematic Approach to Predicting Critical Heat Flux for Inclined Sprays
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Topics: Critical heat flux, Nozzles, Sprays, Flow (Dynamics)
Journal Articles

Numerical Thermal Simulation of Cryogenic Power Modules Under Liquid Nitrogen Cooling

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Hua Ye, Harry Efstathiadis, Pradeep Haldar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 267–272.
https://doi.org/10.1115/1.2229226
Published Online: August 15, 2005
View Articletitled, Numerical Thermal Simulation of Cryogenic Power Modules Under Liquid Nitrogen Cooling
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Topics: Cooling, Heat, MOSFET transistors, Nitrogen, Simulation, Temperature, Critical heat flux, Junctions, Energy dissipation, Boiling
Journal Articles

Flow and Heat Transfer Characteristics of a Natural Circulation Evaporative Cooling System for Electronic Components

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Hiroshi Honda, ZhengGuo Zhang, Nobuo Takata
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 317–324.
https://doi.org/10.1115/1.1772412
Published Online: October 6, 2004
View Articletitled, Flow and Heat Transfer Characteristics of a Natural Circulation Evaporative Cooling System for Electronic Components
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Topics: Boiling, Critical heat flux, Electronic components, Flow (Dynamics), Heat transfer, Pool boiling, Ducts, Condensers (steam plant), Heat flux, Cooling
Journal Articles

Pumpless Loop for Narrow Channel and Micro-Channel Boiling

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Swaraj Mukherjee, Issam Mudawar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 431–441.
https://doi.org/10.1115/1.1602708
Published Online: September 17, 2003
View Articletitled, Pumpless Loop for Narrow Channel and Micro-Channel Boiling
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Topics: Boilers, Boiling, Cooling, Critical heat flux, Flow (Dynamics), Pressure drop, Water, Coolants, Heat, Temperature
Journal Articles

Impinging Jet Boiling of a Fluorinert Liquid on a Foil Heater Array

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Wataru Nakayama, Masud Behnia, Hiroaki Mishima
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2000, 122(2): 132–137.
https://doi.org/10.1115/1.483145
Published Online: February 18, 2000
View Articletitled, Impinging Jet Boiling of a Fluorinert Liquid on a Foil Heater Array
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Topics: Boiling, Coolants, Critical heat flux, Flow (Dynamics), Forced convection, Heat transfer, Strips, Subcooling, Temperature, Nozzles
Journal Articles

Combined Pressure and Subcooling Effects on Pool Boiling From a PPGA Chip Package

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A. A. Watwe, A. Bar-Cohen, A. McNeil
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1997, 119(2): 95–105.
https://doi.org/10.1115/1.2792226
Published Online: June 1, 1997
View Articletitled, Combined Pressure and Subcooling Effects on Pool Boiling From a PPGA Chip Package
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Topics: Pool boiling, Pressure, Subcooling, Critical heat flux, Boiling, Nucleate pool boiling