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Journal Articles

An Automatic Fem-bem Coupling Method for Elastic-plastic Problems of Multiscale Structures in Electronic Packaging

Fei Qin, Qi He, Yanpeng Gong, Chuantao Hou, Hao Cheng, Tong An, Yanwei Dai, Pei Chen

J. Electron. Packag.

Paper No: EP-22-1036

DOI: https://doi.org/10.1115/1.4055125

Published Online: August 1, 2022

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Topics: Boundary element methods, Electronic packaging, Finite element methods, Finite element model, Stiffness, Algorithms, Computer simulation, Deformation, Stress concentration

Journal Articles

Development and Validation of a Transient Heat Transfer Model for Evaluating Thermal Management Solutions for Packaging Next-Generation Smart City Infrastructure Devices

Shuv Dey, Luis Diego Monge Jimenez, J. Michael Brown, Yogendra Joshi

J. Electron. Packag.

Paper No: EP-22-1038

DOI: https://doi.org/10.1115/1.4055094

Published Online: July 26, 2022

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Topics: Packaging, Smart cities, Thermal management, Transient heat transfer, Climate, Computational fluid dynamics, Computer simulation, Poles (Building), Structures, Traffic

Journal Articles

Using a Multi-Inlet/Outlet Manifold to Improve Heat Transfer and Flow Distribution of a Pin Fin Heat Sink

Ahmad R. Gharaibeh, Yaman M. Manaserh, Mohammad I. Tradat, Firas W. AlShatnawi, Scott N. Schiffres, Bahgat G. Sammakia

J. Electron. Packag. September 2022, 144(3): 031017.

Paper No: EP-21-1164

DOI: https://doi.org/10.1115/1.4054461

Published Online: May 19, 2022

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Topics: Flow (Dynamics), Heat sinks, Manifolds, Pressure drop, Thermal resistance, Design, Computer simulation, Fluids, Temperature, Heat transfer

Journal Articles

Analytical Multi-Parametric Design Optimization for the Miniaturization of Flip-Chip Package

Fei Chong Ng, Mohamad Aizat Abas

J. Electron. Packag. December 2022, 144(4): 041009.

Paper No: EP-21-1137

DOI: https://doi.org/10.1115/1.4052920

Published Online: December 1, 2021

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Topics: Design, Flip-chip packages, Flow (Dynamics), Optimization, Fluids, Computer simulation

Journal Articles

Numerical Modeling of the Wave Soldering Process and Experimental Validation

Violeta Carvalho, Bruno Arcipreste, Delfim Soares, Luís Ribas, Nelson Rodrigues, Senhorinha F. C. F. Teixeira, José Carlos Teixeira

J. Electron. Packag. March 2022, 144(1): 011011.

Paper No: EP-21-1002

DOI: https://doi.org/10.1115/1.4050981

Published Online: August 6, 2021

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Topics: Computer simulation, Soldering, Solders, Wave soldering, Waves, Strain measurement, Fluids

Journal Articles

Numerical Modeling and Simulation of a Volumetric Resistance Blower Using Porous Rotor

Sanket Girhe, Ruander Cardenas, Mark MacDonald, Anandaroop Bhattacharya

J. Electron. Packag. June 2021, 143(2): 021004.

Paper No: EP-20-1046

DOI: https://doi.org/10.1115/1.4048036

Published Online: September 3, 2020

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Topics: Computer simulation, Flow (Dynamics), Pressure, Rotors, Porous materials, Simulation, Modeling

Journal Articles

Fabrication Steps and Thermal Modeling of Three-Dimensional Asynchronous Field Programmable Gate Array (3D-AFPGA) With Through Silicon Via and Copper Pillar Bonding Approach

Leila Choobineh, Robert Carrol, Carlos Gutierrez, Robert Geer

J. Electron. Packag. September 2020, 142(3): 031106.

Paper No: EP-19-1098

DOI: https://doi.org/10.1115/1.4046848

Published Online: April 24, 2020

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Topics: Bonding, Columns (Structural), Copper, Design, Gates (Closures), Manufacturing, Modeling, Semiconductor wafers, Silicon, Tiles

Journal Articles

Thermal Analysis of Cold Plate for Direct Liquid Cooling of High Performance Servers

Bharath Ramakrishnan, Yaser Hadad, Sami Alkharabsheh, Paul R. Chiarot, Bahgat Sammakia

J. Electron. Packag. December 2019, 141(4): 041005.

Paper No: EP-18-1069

DOI: https://doi.org/10.1115/1.4044130

Published Online: July 12, 2019

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Topics: Computer simulation, Coolants, Cooling, Flow (Dynamics), Pressure drop, Temperature, Thermal resistance, Heat, Heat transfer coefficients, Heat transfer

Journal Articles

Thermal-Hydraulic Performance and Optimization of Tube Ellipticity in a Plate Fin-And-Tube Heat Exchanger

Hua Zhu, Zhuo Yang, Tariq Amin Khan, Wei Li, Zhijian Sun, Jincai Du, Zhengjiang Zhang, Jianxin Zhou

J. Electron. Packag. September 2019, 141(3): 031008.

Paper No: EP-18-1108

DOI: https://doi.org/10.1115/1.4043482

Published Online: May 17, 2019

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Topics: Artificial neural networks, Computational fluid dynamics, Computer simulation, Flow (Dynamics), Heat exchangers, Heat transfer, Optimization, Friction, Reynolds number, Genetic algorithms

Journal Articles

Maximum Resolution of a Probe-Based, Steady-State Thermal Interface Material Characterization Instrument

Ronald J. Warzoha, Andrew N. Smith, Maurice Harris

J. Electron. Packag. March 2017, 139(1): 011004.

Paper No: EP-16-1075

DOI: https://doi.org/10.1115/1.4035178

Published Online: December 29, 2016

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Topics: Heat, Instrumentation, Probes, Resolution (Optics), Steady state, Uncertainty, Heat flux, Measurement uncertainty, Fillers (Materials), Temperature measurement

Journal Articles

Numerical and Experimental Investigation of Shell-and-Tube Phase-Change Material Thermal Energy Storage Unit

Thomas H. Sherer, II, Yogendra Joshi

J. Electron. Packag. September 2016, 138(3): 031008.

Paper No: EP-16-1014

DOI: https://doi.org/10.1115/1.4034101

Published Online: July 28, 2016

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Topics: Data centers, Flow (Dynamics), Temperature, Water, Computer simulation, Shells, Temperature profiles, Phase change materials, Cooling, Thermal energy storage

Journal Articles

Numerical and Experimental Study on the Transferred Volume in Phosphor Dip-Transfer Coating Process of Light-Emitting Diodes Packaging

Bofeng Shang, Xingjian Yu, Huai Zheng, Bin Xie, Qi Chen, Xiaobing Luo

J. Electron. Packag. June 2016, 138(2): 021003.

Paper No: EP-15-1057

DOI: https://doi.org/10.1115/1.4033165

Published Online: April 19, 2016

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Topics: Coating processes, Computer simulation, Light-emitting diodes, Phosphors, Coatings, Packaging, Fluids

Journal Articles

Multiphysics Analysis for Temperature Rise of Electronic Connectors Using a Multiscale Model

K.-C. Liao, H.-L. Lu

J. Electron. Packag. September 2015, 137(3): 031012.

Paper No: EP-15-1034

DOI: https://doi.org/10.1115/1.4030803

Published Online: September 1, 2015

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Topics: Computer simulation, Molten salt reactors, Temperature, Temperature distribution

Journal Articles

Special Section on InterPACK 2013

Satish Chaparala, Ashish Gupta, Nils Hoivik, Y. C. Lee

J. Electron. Packag. December 2014, 136(4): 040201.

Paper No: EP-14-1070

DOI: https://doi.org/10.1115/1.4028390

Published Online: September 19, 2014

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Topics: Copper, Design, Electronic packaging, Engineering mechanics, Manufacturing, Packaging, Reliability, Sensors, Silicon, Thermal management

Journal Articles

Flow and Heat Transfer Analysis of an Electro-Osmotic Flow Micropump for Chip Cooling

K. Pramod, A. K. Sen

J. Electron. Packag. September 2014, 136(3): 031012.

Paper No: EP-13-1137

DOI: https://doi.org/10.1115/1.4027657

Published Online: June 5, 2014

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Topics: Electroosmosis, Flow (Dynamics), Micropumps, Pressure, Temperature, Cascades (Fluid dynamics), Design, Cooling, Heat transfer, Pumps

Journal Articles

Investigation of Multiple Miniature Axial Fan Cooling Solutions and Thermal Modeling Approaches

Jason Stafford, Florian Fortune

J. Electron. Packag. March 2014, 136(1): 011008.

Paper No: EP-13-1025

DOI: https://doi.org/10.1115/1.4026351

Published Online: January 24, 2014

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Topics: Cooling, Design, Fans, Flow (Dynamics), Heat sinks, Heat transfer, Thermal resistance, Computer simulation, Modeling, Air flow

Journal Articles

Reliability Design of Multirow Quad Flat Nonlead Packages Based on Numerical Design of Experiment Method

Guofeng Xia, Fei Qin, Cha Gao, Tong An, Wenhui Zhu

J. Electron. Packag. December 2013, 135(4): 041007.

Paper No: EP-13-1018

DOI: https://doi.org/10.1115/1.4025597

Published Online: November 5, 2013

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Topics: Cycles, Design, Fatigue, Fatigue life, Reliability, Solder joints, Temperature, Materials properties, Stress, Taguchi methods

Journal Articles

Inviscid and Viscous Numerical Models Compared to Experimental Data in a Small Data Center Test Cell

Ethan Cruz, Yogendra Joshi

J. Electron. Packag. September 2013, 135(3): 030904.

Paper No: EP-12-1092

DOI: https://doi.org/10.1115/1.4024944

Published Online: July 24, 2013

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Topics: Computer simulation, Data centers, Flow (Dynamics), Temperature, Tiles, Turbulence, Computational fluid dynamics, Uncertainty

Journal Articles

Statistical Manufacturing Model of Printing Technology

Nam-Soo Kim, Sarah Luna, Jung-Hyou Lee, Tae-Eui Jeong

J. Electron. Packag. March 2013, 135(1): 011004.

Paper No: EP-12-1005

DOI: https://doi.org/10.1115/1.4007450

Published Online: February 26, 2013

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Topics: Packing (Shipments), Packings (Cushioning), Particulate matter, Printing, Computer simulation, Manufacturing, Inks, Particle size

Journal Articles

Comparison Between Numerical and Experimental Results of Airflow Distribution in Diffuser Based Data Center

Qifei Jian, Qiaoli Wang, Haoting Wang, Zheng Zuo

J. Electron. Packag. March 2012, 134(1): 011006.

DOI: https://doi.org/10.1115/1.4005912

Published Online: March 19, 2012

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Topics: Air flow, Data centers, Diffusers, Temperature, Computational fluid dynamics, Computer simulation

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Journal citation

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Manuscript

An Automatic Fem-bem Coupling Method for Elastic-plastic Problems of Multiscale Structures in Electronic Packaging

Development and Validation of a Transient Heat Transfer Model for Evaluating Thermal Management Solutions for Packaging Next-Generation Smart City Infrastructure Devices

Using a Multi-Inlet/Outlet Manifold to Improve Heat Transfer and Flow Distribution of a Pin Fin Heat Sink

Analytical Multi-Parametric Design Optimization for the Miniaturization of Flip-Chip Package

Numerical Modeling of the Wave Soldering Process and Experimental Validation

Numerical Modeling and Simulation of a Volumetric Resistance Blower Using Porous Rotor

Fabrication Steps and Thermal Modeling of Three-Dimensional Asynchronous Field Programmable Gate Array (3D-AFPGA) With Through Silicon Via and Copper Pillar Bonding Approach

Thermal Analysis of Cold Plate for Direct Liquid Cooling of High Performance Servers

Thermal-Hydraulic Performance and Optimization of Tube Ellipticity in a Plate Fin-And-Tube Heat Exchanger

Maximum Resolution of a Probe-Based, Steady-State Thermal Interface Material Characterization Instrument

Numerical and Experimental Investigation of Shell-and-Tube Phase-Change Material Thermal Energy Storage Unit

Numerical and Experimental Study on the Transferred Volume in Phosphor Dip-Transfer Coating Process of Light-Emitting Diodes Packaging

Multiphysics Analysis for Temperature Rise of Electronic Connectors Using a Multiscale Model

Special Section on InterPACK 2013

Flow and Heat Transfer Analysis of an Electro-Osmotic Flow Micropump for Chip Cooling

Investigation of Multiple Miniature Axial Fan Cooling Solutions and Thermal Modeling Approaches

Reliability Design of Multirow Quad Flat Nonlead Packages Based on Numerical Design of Experiment Method

Inviscid and Viscous Numerical Models Compared to Experimental Data in a Small Data Center Test Cell

Statistical Manufacturing Model of Printing Technology

Comparison Between Numerical and Experimental Results of Airflow Distribution in Diffuser Based Data Center

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