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Journal Articles

Design and Fabrication of Leadless Package Structure for Pressure Sensors

Junwang Tian, Zhong Jin, Xin Tang, Wenxian Peng, Junfu Liu, Yunpeng Liu, Taotao Chen, Jinqing Xiao, Junhui Li

J. Electron. Packag. December 2022, 144(4): 041005.

Paper No: EP-21-1036

DOI: https://doi.org/10.1115/1.4052246

Published Online: November 22, 2021

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Topics: Design, Glass, Manufacturing, Pressure, Pressure sensors, Silver, Thermal stresses, Bonding, Stress, Temperature

Journal Articles

Advancement of Chip Stacking Architectures and Interconnect Technologies for Image Sensors

Mei-Chien Lu

J. Electron. Packag. June 2022, 144(2): 020801.

Paper No: EP-21-1008

DOI: https://doi.org/10.1115/1.4052069

Published Online: September 24, 2021

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Topics: Sensors, Bonding, Electronics

Journal Articles

Application of Alumina-Based Ceramic Paste for High-Temperature Electronics Packaging

Ardalan Nasiri, Simon Ang

J. Electron. Packag. June 2021, 143(2): 020902.

Paper No: EP-20-1060

DOI: https://doi.org/10.1115/1.4049292

Published Online: February 22, 2021

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Topics: Bonding, Ceramics, Electronic packaging, Hardening (Curing), High temperature, Shear strength, Temperature, Fracture (Materials), Fourier transform infrared spectroscopy, Aluminum

Journal Articles

Effect of Cu Foam and Ag-Coated Layer on the Microstructure and Mechanical Behavior of Nano-Ag Sintered Joint

Yang Liu, Zhao Li, Min Zhou, Xianghua Zeng, Fenglian Sun

J. Electron. Packag. September 2021, 143(3): 031002.

Paper No: EP-20-1047

DOI: https://doi.org/10.1115/1.4049128

Published Online: January 19, 2021

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Topics: Bonding, Coating processes, Coatings, Composite materials, Mechanical behavior, Shear (Mechanics), Shear strength, Sintering, Fracture (Materials), Deformation

Journal Articles

Fabrication and Reliability Assessment of Cu Pillar Microbumps With Printed Polymer Cores

Xing Qiu, Jeffery C. C. Lo, Yuanjie Cheng, S. W. Ricky Lee, Yong Jhe Tseng, Peter Chiu

J. Electron. Packag. September 2021, 143(3): 031010.

Paper No: EP-20-1102

DOI: https://doi.org/10.1115/1.4049129

Published Online: January 19, 2021

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Topics: Columns (Structural), Manufacturing, Polymers, Reliability, Temperature, Silicon chips, Bonding

Journal Articles

Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel Three-Dimensional-Manifold Coolers (EMMC)—Part 3: Addressing Challenges in Laser Micromachining-Based Manufacturing of Three-Dimensional-Manifolded Microcooler Devices

Sougata Hazra, Ki Wook Jung, Madhusudan Iyengar, Chris Malone, Mehdi Asheghi, Kenneth E. Goodson

J. Electron. Packag. September 2020, 142(3): 031119.

Paper No: EP-20-1022

DOI: https://doi.org/10.1115/1.4047847

Published Online: August 17, 2020

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Topics: Coatings, Lasers, Manufacturing, Microcoolers, Micromachining, Silicon, Protective coatings, Bonding, Coating processes, Etching

Journal Articles

Fabrication Steps and Thermal Modeling of Three-Dimensional Asynchronous Field Programmable Gate Array (3D-AFPGA) With Through Silicon Via and Copper Pillar Bonding Approach

Leila Choobineh, Robert Carrol, Carlos Gutierrez, Robert Geer

J. Electron. Packag. September 2020, 142(3): 031106.

Paper No: EP-19-1098

DOI: https://doi.org/10.1115/1.4046848

Published Online: April 24, 2020

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Topics: Bonding, Columns (Structural), Copper, Design, Gates (Closures), Manufacturing, Modeling, Semiconductor wafers, Silicon, Tiles

Journal Articles

Low-Temperature Bonding of Cu Through Self-Propagating Reaction Under Various Temperatures and Pressures

Wenbo Zhu, Xiaoting Wang, Mingyu Li

J. Electron. Packag. June 2020, 142(2): 021006.

Paper No: EP-19-1070

DOI: https://doi.org/10.1115/1.4046341

Published Online: March 9, 2020

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Topics: Bonding, Temperature, Temperature profiles, Tin, Solders, Low temperature, Pressure, Shear strength, Heat, Melting

Journal Articles

Atomic Study on Copper–Copper Bonding Using Nanoparticles

Xiaohui Song, Rui Zhang, Huadong Zhao

J. Electron. Packag. June 2020, 142(2): 021005.

Paper No: EP-19-1105

DOI: https://doi.org/10.1115/1.4046164

Published Online: February 19, 2020

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Topics: Atoms, Bonding, Copper, Metals, Nanoparticles, Pressure, Temperature, Deformation, External pressure

Journal Articles

Novel Transient Liquid Phase Bonding for High-Temperature Automotive Power Electronics Systems

Yanghe Liu, Shailesh N. Joshi, Ercan M. Dede

J. Electron. Packag. March 2020, 142(1): 011003.

Paper No: EP-19-1014

DOI: https://doi.org/10.1115/1.4044476

Published Online: September 19, 2019

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Topics: Bonding, Electronics, High temperature, Manufacturing, Stress, Tension-leg platforms, Thermal stresses, Tin, Transients (Dynamics), Temperature

Journal Articles

Swing Touch Risk Assessment of Bonding Wires in High-Density Package Under Mechanical Shock Condition

Guicui Fu, Maogong Jiang, Bo Wan, Yanruoyue Li, Cheng Ma

J. Electron. Packag. March 2019, 141(1): 011004.

Paper No: EP-18-1055

DOI: https://doi.org/10.1115/1.4041984

Published Online: February 25, 2019

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Topics: Bonding, Shock (Mechanics), Wire, Risk assessment

Journal Articles

Micro Copper Pillar Interconnection Using Thermosonic Flip Chip Bonding

Bo Wu, Shuanghai Zhang, Fuliang Wang, Zhuo Chen

J. Electron. Packag. December 2018, 140(4): 044502.

Paper No: EP-18-1015

DOI: https://doi.org/10.1115/1.4040794

Published Online: August 6, 2018

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Topics: Bonding, Columns (Structural), Flip-chip, Copper, Flip-chip devices

Journal Articles

Edge Trimming Induced Defects on Direct Bonded Wafers

Fumihiro Inoue, Anne Jourdain, Lan Peng, Alain Phommahaxay, Daisuke Kosemura, Ingrid De Wolf, Kenneth June Rebibis, Andy Miller, Erik Sleeckx, Eric Beyne

J. Electron. Packag. September 2018, 140(3): 031004.

Paper No: EP-17-1127

DOI: https://doi.org/10.1115/1.4040002

Published Online: May 11, 2018

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Topics: Damage, Grinding, Semiconductor wafers, Stress, Bonding

Journal Articles

Low Temperature Cu–Cu Bonding Technology in Three-Dimensional Integration: An Extensive Review

Asisa Kumar Panigrahy, Kuan-Neng Chen

J. Electron. Packag. March 2018, 140(1): 010801.

Paper No: EP-17-1076

DOI: https://doi.org/10.1115/1.4038392

Published Online: March 2, 2018

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Topics: Bonding, Low temperature

Journal Articles

Solid-State Microjoining Mechanisms of Wire Bonding and Flip Chip Bonding

Yasuo Takahashi, Hiroki Fukuda, Yasuhiro Yoneshima, Hideki Kitamura, Masakatsu Maeda

J. Electron. Packag. December 2017, 139(4): 041010.

Paper No: EP-17-1026

DOI: https://doi.org/10.1115/1.4038143

Published Online: October 25, 2017

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Topics: Bonding, Vibration, Flip-chip, Flip-chip devices

Journal Articles

Enhanced Bonding by Applied Current in Cu-to-Cu Joints Fabricated Using 20 μ m Cu Microbumps

Sung Woo Ma, Chanho Shin, Young-Ho Kim

J. Electron. Packag. December 2017, 139(4): 041004.

Paper No: EP-17-1044

DOI: https://doi.org/10.1115/1.4037474

Published Online: September 5, 2017

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Topics: Bonding, Contact resistance, Electrodiffusion, Shear strength, Temperature, Heating, Joules

Journal Articles

Effect of Packaging Architecture on the Optical and Thermal Performances of High-Power Light Emitting Diodes

Thong Kok Law, Fannon Lim, Yun Li, XuePeng Puan, G. K. E. Sng, J. W. Ronnie Teo

J. Electron. Packag. September 2017, 139(3): 031003.

Paper No: EP-16-1108

DOI: https://doi.org/10.1115/1.4036066

Published Online: June 14, 2017

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Topics: Bonding, Energy dissipation, Heat, Light-emitting diodes, Operating temperature, Packaging, Phosphors, Temperature, Thermal resistance, Light emission

Journal Articles

Characterization and Benchmarking of the Low Intertier Thermal Resistance of Three-Dimensional Hybrid Cu/Dielectric Wafer-to-Wafer Bonding

Herman Oprins, Vladimir Cherman, Tomas Webers, Abdellah Salahouelhadj, Soon-Wook Kim, Lan Peng, Geert Van der Plas, Eric Beyne

J. Electron. Packag. March 2017, 139(1): 011008.

Paper No: EP-16-1096

DOI: https://doi.org/10.1115/1.4035597

Published Online: January 10, 2017

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Topics: Bonding, Semiconductor wafers, Thermal resistance, Transients (Dynamics), Temperature, Steady state

Journal Articles

Recent Advances and New Trends in Flip Chip Technology

John H. Lau

J. Electron. Packag. September 2016, 138(3): 030802.

Paper No: EP-16-1052

DOI: https://doi.org/10.1115/1.4034037

Published Online: July 25, 2016

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Topics: Bonding, Flip-chip, Flip-chip assemblies, Flip-chip devices, Manufacturing, Semiconductor wafers, Solders, Columns (Structural), Silicon, Packaging

Journal Articles

Erratum: “Identifying the Development State of Sintered Silver (Ag) as a Bonding Material in the Microelectronic Packaging Via a Patent Landscape Study” [ASME J. Electron. Packag., 2016, 138(2), p. 020804; DOI: 10.1115/1.4033069 ]

K. S. Siow, Y. T. Lin

J. Electron. Packag. September 2016, 138(3): 037001.

Paper No: EP-16-1057

DOI: https://doi.org/10.1115/1.4033633

Published Online: May 25, 2016

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Topics: Bonding, Electrons, Microelectronic packaging, Packaging, Patents, Silver, Solders

Journal citation

NARROW

Design and Fabrication of Leadless Package Structure for Pressure Sensors

Advancement of Chip Stacking Architectures and Interconnect Technologies for Image Sensors

Application of Alumina-Based Ceramic Paste for High-Temperature Electronics Packaging

Effect of Cu Foam and Ag-Coated Layer on the Microstructure and Mechanical Behavior of Nano-Ag Sintered Joint

Fabrication and Reliability Assessment of Cu Pillar Microbumps With Printed Polymer Cores

Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel Three-Dimensional-Manifold Coolers (EMMC)—Part 3: Addressing Challenges in Laser Micromachining-Based Manufacturing of Three-Dimensional-Manifolded Microcooler Devices

Fabrication Steps and Thermal Modeling of Three-Dimensional Asynchronous Field Programmable Gate Array (3D-AFPGA) With Through Silicon Via and Copper Pillar Bonding Approach

Low-Temperature Bonding of Cu Through Self-Propagating Reaction Under Various Temperatures and Pressures

Atomic Study on Copper–Copper Bonding Using Nanoparticles

Novel Transient Liquid Phase Bonding for High-Temperature Automotive Power Electronics Systems

Swing Touch Risk Assessment of Bonding Wires in High-Density Package Under Mechanical Shock Condition

Micro Copper Pillar Interconnection Using Thermosonic Flip Chip Bonding

Edge Trimming Induced Defects on Direct Bonded Wafers

Low Temperature Cu–Cu Bonding Technology in Three-Dimensional Integration: An Extensive Review

Solid-State Microjoining Mechanisms of Wire Bonding and Flip Chip Bonding

Enhanced Bonding by Applied Current in Cu-to-Cu Joints Fabricated Using 20 μ m Cu Microbumps

Effect of Packaging Architecture on the Optical and Thermal Performances of High-Power Light Emitting Diodes

Characterization and Benchmarking of the Low Intertier Thermal Resistance of Three-Dimensional Hybrid Cu/Dielectric Wafer-to-Wafer Bonding

Recent Advances and New Trends in Flip Chip Technology

Erratum: “Identifying the Development State of Sintered Silver (Ag) as a Bonding Material in the Microelectronic Packaging Via a Patent Landscape Study” [ASME J. Electron. Packag., 2016, 138(2), p. 020804; DOI: 10.1115/1.4033069 ]

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