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Journal Articles

Transient Response of an Oscillating Heat Pipe by a Pulsed Heating in a High Magnetic Field Environment

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C. D. Smoot, A. A. Hathaway, H. B. Ma, M. T. Crawford, B. M. Huhman, Annie Sobel
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2015, 137(3): 031008.
Paper No: EP-13-1139
https://doi.org/10.1115/1.4030642
Published Online: September 1, 2015
View Articletitled, Transient Response of an Oscillating Heat Pipe by a Pulsed Heating in a High Magnetic Field Environment
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Topics: Copper, Heat, Heat pipes, Heating, Magnetic fields, Rails, Temperature, Transients (Dynamics), Fluids
Journal Articles

Thermal Performance of Nanofluid Charged Heat Pipe With Phase Change Material for Electronics Cooling

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Sandesh S. Chougule, S. K. Sahu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2015, 137(2): 021004.
Paper No: EP-14-1024
https://doi.org/10.1115/1.4028994
Published Online: June 1, 2015
View Articletitled, Thermal Performance of Nanofluid Charged Heat Pipe With Phase Change Material for Electronics Cooling
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Topics: Computer cooling, Cooling, Heat pipes, Nanofluids, Phase change materials, Water, Temperature, Paraffin wax, Heating, Test facilities
Journal Articles

Numerical and Experimental Study of the Effect of Underfloor Blockages on Data Center Performance

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Siddharth Bhopte, Bahgat Sammakia, Madhusudan Iyengar, Roger Schmidt
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2011, 133(1): 011007.
https://doi.org/10.1115/1.4003603
Published Online: March 9, 2011
View Articletitled, Numerical and Experimental Study of the Effect of Underfloor Blockages on Data Center Performance
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Topics: Data centers, Flow (Dynamics), Pipes, Tiles, Computer simulation, Air flow
Journal Articles

Study on a Pulsating Heat Pipe With Self-Rewetting Fluid

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Koji Fumoto, Masahiro Kawaji, Tsuyoshi Kawanami
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2010, 132(3): 031005.
https://doi.org/10.1115/1.4001855
Published Online: September 9, 2010
View Articletitled, Study on a Pulsating Heat Pipe With Self-Rewetting Fluid
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Topics: Fluids, Heat pipes, Temperature, Water, Surface tension, Heat transfer, Thermal resistance, Heat
Journal Articles

An Experimental Investigation in the Performance of Water-Filled Silicon Microheat Pipe Arrays

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D. K. Harris, A. Palkar, G. Wonacott, R. Dean, F. Simionescu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2010, 132(2): 021005.
https://doi.org/10.1115/1.4001745
Published Online: June 23, 2010
View Articletitled, An Experimental Investigation in the Performance of Water-Filled Silicon Microheat Pipe Arrays
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Topics: Manufacturing, Pipes, Silicon, Testing, Thermal conductivity, Water, Temperature, Thermal resistance
Journal Articles

Heat Transfer Limitation of a Micro Heat Pipe

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K. N. Shukla
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. June 2009, 131(2): 024502.
https://doi.org/10.1115/1.3103970
Published Online: April 2, 2009
View Articletitled, Heat Transfer Limitation of a Micro Heat Pipe
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Topics: Heat pipes, Heat transfer, Vapors, Heat
Journal Articles

Numerical Investigation of Thermal Dissipation on Quad Flat Package With Unattached Heat Spreader

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Tong Hong Wang, Yi-Shao Lai
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2007, 129(3): 366–370.
https://doi.org/10.1115/1.2753988
Published Online: September 12, 2006
View Articletitled, Numerical Investigation of Thermal Dissipation on Quad Flat Package With Unattached Heat Spreader
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Topics: Convection, Density, Energy dissipation, Flat heat pipes, Heat transfer, Temperature
Journal Articles

Thermal Behavior of Nominally Flat Silicon-Based Heat Spreaders

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Ta-Wei Lin, Ming-Chang Wu, Cheng-Hsien Peng, Po-Li Chen, Ying-Huei Hung
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 370–379.
https://doi.org/10.1115/1.2351902
Published Online: December 24, 2005
View Articletitled, Thermal Behavior of Nominally Flat Silicon-Based Heat Spreaders
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Topics: Flat heat pipes, Silicon, Surface roughness, Thermal resistance, Natural convection, Heat transfer, Heat
Journal Articles

Influence of the Fluid on the Experimental Performances of Triangular Silicon Microheat Pipes

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Guillaume Pandraud, Martine Le Berre, Panagiota Morfouli, Monique Lallemand
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2006, 128(3): 294–296.
https://doi.org/10.1115/1.2229233
Published Online: October 11, 2005
View Articletitled, Influence of the Fluid on the Experimental Performances of Triangular Silicon Microheat Pipes
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Topics: Fluids, Methanol, Microchannels, Pipes, Silicon, Thermal conductivity, Semiconductor wafers, Water, Bonding, Ethanol
Journal Articles

Impact of TXV and Compressor in the Stability of a High-End Computer Refrigeration System

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Yasin Makwana, Dereje Agonafer, Fellow ASME, Dan Manole
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 554–559.
https://doi.org/10.1115/1.1827272
Published Online: January 24, 2005
View Articletitled, Impact of TXV and Compressor in the Stability of a High-End Computer Refrigeration System
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Topics: Compressors, Refrigeration, Temperature, Stress, Computers, Stability, Vapors, Valves
Journal Articles

Effects of Two-Dimensional Roughness in Flow in Microchannels

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Xiang-Qi Wang, Christopher Yap, Arun Sadashiv Mujumdar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2005, 127(3): 357–361.
https://doi.org/10.1115/1.1997164
Published Online: August 5, 2004
View Articletitled, Effects of Two-Dimensional Roughness in Flow in Microchannels
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Topics: Poiseuille flow, Surface roughness, Friction, Flow (Dynamics), Microchannels
Journal Articles

A Simplified Conduction Based Modeling Scheme for Design Sensitivity Study of Thermal Solution Utilizing Heat Pipe and Vapor Chamber Technology

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Ravi S. Prasher
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 378–385.
https://doi.org/10.1115/1.1602479
Published Online: September 17, 2003
View Articletitled, A Simplified Conduction Based Modeling Scheme for Design Sensitivity Study of Thermal Solution Utilizing Heat Pipe and Vapor Chamber Technology
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Topics: Cooling, Heat, Heat conduction, Heat pipes, Modeling, Temperature, Thermal conductivity, Vapors, Design, Heat sinks
Journal Articles

Sizing of Heat Spreaders Above Dielectric Layers

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Calvin Chen, Marc Hodes, Lou Manzione
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2001, 123(3): 173–181.
https://doi.org/10.1115/1.1377271
Published Online: February 12, 2001
View Articletitled, Sizing of Heat Spreaders Above Dielectric Layers
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Topics: Flat heat pipes, Thermal resistance, Finite element analysis, Heat
Journal Articles

Thermal Performance of Integrated Plate Heat Pipe With a Heat Spreader

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Koichiro Take, Ralph L. Webb
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2001, 123(3): 189–195.
https://doi.org/10.1115/1.1348010
Published Online: April 1, 2000
View Articletitled, Thermal Performance of Integrated Plate Heat Pipe With a Heat Spreader
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Topics: Flat heat pipes, Heat, Heat pipes, Thermal resistance, Temperature, Laptop computers
Journal Articles

Effect of Heat-Spreader Sizes on the Thermal Performance of Large Cavity-Down Plastic Ball Grid Array Packages

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J. Lau, T. Chen, S.-W. R. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1999, 121(4): 242–248.
https://doi.org/10.1115/1.2793847
Published Online: December 1, 1999
View Articletitled, Effect of Heat-Spreader Sizes on the Thermal Performance of Large Cavity-Down Plastic Ball Grid Array Packages
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Topics: Ball-Grid-Array packages, Cavities, Flat heat pipes, Ball-Grid-Array packaging, Cooling, Epoxy adhesives, Epoxy resins, Glass, Printed circuit boards, Solders
Journal Articles

Thermal Management Enhancement for GaAs Devices Using CVD Diamond Heat Spreaders in a Plastic Package Environment

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Philip M. Fabis, Henry Windischmann
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2000, 122(2): 92–97.
https://doi.org/10.1115/1.483139
Published Online: September 21, 1999
View Articletitled, Thermal Management Enhancement for GaAs Devices Using CVD Diamond Heat Spreaders in a Plastic Package Environment
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Topics: Gallium arsenide, Synthetic diamonds, Thermal management, Flat heat pipes, Packaging
Journal Articles

Reliability of Underfill-Encapsulated Flip-Chips With Heat Spreaders

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H. Doi, K. Kawano, A. Yasukawa, T. Sato
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. December 1998, 120(4): 322–327.
https://doi.org/10.1115/1.2792641
Published Online: December 1, 1998
View Articletitled, Reliability of Underfill-Encapsulated Flip-Chips With Heat Spreaders
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Topics: Flat heat pipes, Flip-chip devices, Reliability, Solder joints, Delamination, Failure mechanisms, Fatigue life, Flip-chip packages, Mechanical properties, Shapes
Journal Articles

Thermal and Mechanical Evaluations of a Cost-Effective Plastic Ball Grid Array Package

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J. H. Lau, K.-L. Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1997, 119(3): 208–212.
https://doi.org/10.1115/1.2792236
Published Online: September 1, 1997
View Articletitled, Thermal and Mechanical Evaluations of a Cost-Effective Plastic Ball Grid Array Package
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Topics: Ball-Grid-Array packages, Ball-Grid-Array packaging, Copper, Deflection, Epoxy adhesives, Epoxy resins, Flat heat pipes, Glass, Printed circuit boards, Temperature distribution
Journal Articles

Investigation of a Heat Pipe Array for Convective Cooling

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A. H. Howard, G. P. Peterson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1995, 117(3): 208–214.
https://doi.org/10.1115/1.2792093
Published Online: September 1, 1995
View Articletitled, Investigation of a Heat Pipe Array for Convective Cooling
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Topics: Cooling, Heat pipes, Heat, Copper, Electrical measurement, Fins, Flow (Dynamics), Pressure drop, Thermal resistance, Water
Journal Articles

Steady-State Investigation of Vapor Deposited Micro Heat Pipe Arrays

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A. K. Mallik, G. P. Peterson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1995, 117(1): 75–81.
https://doi.org/10.1115/1.2792070
Published Online: March 1, 1995
View Articletitled, Steady-State Investigation of Vapor Deposited Micro Heat Pipe Arrays
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Topics: Heat pipes, Steady state, Vapors, Semiconductor wafers, Temperature, Temperature distribution, Temperature gradient, Thermal conductivity, Computer simulation, Flux (Metallurgy)