1-5 of 5
Ocean, Offshore & Arctic Engineering
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Transient Liquid Phase Bond Acceleration Using Copper Nanowires

Available to Purchase
John Harris, David Huitink
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2025, 147(1): 011008.
Paper No: EP-24-1038
https://doi.org/10.1115/1.4066042
Published Online: August 17, 2024
View Articletitled, Transient Liquid Phase Bond Acceleration Using Copper Nanowires
Open the PDF for Transient Liquid Phase Bond Acceleration Using Copper Nanowires in another window
Topics: Copper, Nanowires, Solders, Tension-leg platforms, Transients (Dynamics), Temperature
Journal Articles

High Gain Compact Antenna-in-Package Solution Using Like Mushroom Electromagnetic Band Gap for Industrial, Scientific, and Medical Band

Available to Purchase
El Amjed Hajlaoui, Ziyad M. Almohaimeed, Abdullah Almohaimeed, Wazie Abdulkawi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2025, 147(1): 011002.
Paper No: EP-23-1079
https://doi.org/10.1115/1.4065145
Published Online: April 12, 2024
View Articletitled, High Gain Compact Antenna-in-Package Solution Using Like Mushroom Electromagnetic Band Gap for Industrial, Scientific, and Medical Band
Open the PDF for High Gain Compact Antenna-in-Package Solution Using Like Mushroom Electromagnetic Band Gap for Industrial, Scientific, and Medical Band in another window
Topics: Biomedicine, Energy gap, Radiation (Physics), Design, Reflectance, Surface waves (Fluid)
Journal Articles

Novel Transient Liquid Phase Bonding for High-Temperature Automotive Power Electronics Systems

Available to Purchase
Yanghe Liu, Shailesh N. Joshi, Ercan M. Dede
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2020, 142(1): 011003.
Paper No: EP-19-1014
https://doi.org/10.1115/1.4044476
Published Online: September 19, 2019
View Articletitled, Novel Transient Liquid Phase Bonding for High-Temperature Automotive Power Electronics Systems
Open the PDF for Novel Transient Liquid Phase Bonding for High-Temperature Automotive Power Electronics Systems in another window
Topics: Bonding, Electronics, High temperature, Manufacturing, Stress, Tension-leg platforms, Thermal stresses, Tin, Transients (Dynamics), Temperature
Journal Articles

Overheating and Frequent Thermal Cycling of Outdoor Electronic Cabinets in Cold Climates

Available to Purchase
E. B. Zimmerman, H. Hegab, G. T. Colwell
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1999, 121(1): 50–54.
https://doi.org/10.1115/1.2792661
Published Online: March 1, 1999
View Articletitled, Overheating and Frequent Thermal Cycling of Outdoor Electronic Cabinets in Cold Climates
Open the PDF for Overheating and Frequent Thermal Cycling of Outdoor Electronic Cabinets in Cold Climates in another window
Topics: Axial flow, Cold climates, Computer simulation, Containers, Convection, Cooling, Cooling systems, Electronics, Fans, Flow (Dynamics)
Journal Articles

Statistical Energy Analysis for Electronic Equipment

Available to Purchase
L. Lu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 1991, 113(3): 322–325.
https://doi.org/10.1115/1.2905413
Published Online: September 1, 1991
View Articletitled, Statistical Energy Analysis for Electronic Equipment
Open the PDF for Statistical Energy Analysis for Electronic Equipment in another window
Topics: Electronic equipment, Seas, Vibration, Finite element model, Instrumentation, Vibration analysis