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Journal Articles

Enhancing Image Segmentation Model in Computing Void Percentage With Mask RCNN

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Calvin Ling, Aizat Abas, Chew Cheng Kai, Muhammad Taufik Azahari
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2025, 147(3): 031001.
Paper No: EP-24-1090
https://doi.org/10.1115/1.4067897
Published Online: March 14, 2025
View Articletitled, Enhancing Image Segmentation Model in Computing Void Percentage With Mask RCNN
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Topics: Convolutional neural networks, Image segmentation, Ball-Grid-Array packaging, Algorithms, Flip-chip devices, Flip-chip, Manufacturing
Journal Articles

Understanding the Impact of Data Center Liquid Cooling on Energy and Performance of Machine Learning and Artificial Intelligence Workloads

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Bharath Ramakrishnan, Cam Turner, Husam Alissa, Dennis Trieu, Felipe Rivera, Luke Melton, Muralikrishna Rao, Sruti Chigullapalli, Tatek Getachew, Vladimir Prodanovic, Robert Lankston, Christian Belady, Vaidehi Oruganti
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2025, 147(2): 021003.
Paper No: EP-24-1082
https://doi.org/10.1115/1.4067136
Published Online: December 11, 2024
View Articletitled, Understanding the Impact of Data Center Liquid Cooling on Energy and Performance of Machine Learning and Artificial Intelligence Workloads
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Topics: Artificial intelligence, Cooling, Data centers, Energy consumption, Graphics processing units, Machine learning, Temperature, Stress, Coolants
Journal Articles

Special Issue on InterPACK2023

Free
Ronald J. Warzoha, Damena Agonofer, Ashutosh Giri, Jimil Shah
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. December 2024, 146(4): 040301.
Paper No: EP-24-1089
https://doi.org/10.1115/1.4066727
Published Online: October 22, 2024
View Articletitled, Special Issue on InterPACK2023
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Topics: Electronic packaging, Electronics, Packaging, Cutting, Data centers, Energy storage, Engineering teachers, Machine learning, Mechanical engineers, Microelectromechanical systems
Journal Articles

Enhancing Mechanical Reliability of Silver-Sintered Joints With Copper Nanowires in High-Power Electronic Devices

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Alicia Medina Garcia, John Harris, David R. Huitink
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041122.
Paper No: EP-24-1043
https://doi.org/10.1115/1.4066834
Published Online: October 22, 2024
View Articletitled, Enhancing Mechanical Reliability of Silver-Sintered Joints With Copper Nanowires in High-Power Electronic Devices
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Topics: Copper, Nanowires, Reliability, Silver, Temperature, Sinter (Metallurgy), Shear strength
Journal Articles

Transient Liquid Phase Bond Acceleration Using Copper Nanowires

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John Harris, David Huitink
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2025, 147(1): 011008.
Paper No: EP-24-1038
https://doi.org/10.1115/1.4066042
Published Online: August 17, 2024
View Articletitled, Transient Liquid Phase Bond Acceleration Using Copper Nanowires
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Topics: Copper, Nanowires, Solders, Tension-leg platforms, Transients (Dynamics), Temperature
Journal Articles

Effect of Dispensing Type on Void Formation Using Convolutional Neural Network

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Muhammad Taufik Azahari, Calvin Ling, Aizat Abas, Fei Chong Ng
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2025, 147(1): 011006.
Paper No: EP-23-1004
https://doi.org/10.1115/1.4065078
Published Online: August 9, 2024
View Articletitled, Effect of Dispensing Type on Void Formation Using Convolutional Neural Network
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Topics: Convolutional neural networks, Epoxy adhesives, Epoxy resins, Flip-chip devices, Flip-chip, Flow (Dynamics), Image processing
Journal Articles

Electrically Conductive Adhesives in Microelectronics Packaging

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Mukund Ayalasomayajula, Mohit Ravi Khurana, Prince Shiva Chaudhary
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041109.
Paper No: EP-23-1091
https://doi.org/10.1115/1.4065939
Published Online: August 9, 2024
View Articletitled, Electrically Conductive Adhesives in Microelectronics Packaging
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Topics: Adhesives, Fillers (Materials), Anisotropy, Particulate matter
Journal Articles

Forward Kinematics Analysis of High-Precision Optoelectronic Packaging Platform

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Ziyang Wang, Haibo Zhou, Linjiao Xiao, Lian Duan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2024, 146(3): 031005.
Paper No: EP-23-1069
https://doi.org/10.1115/1.4064704
Published Online: February 28, 2024
View Articletitled, Forward Kinematics Analysis of High-Precision Optoelectronic Packaging Platform
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Topics: Errors, Kinematics, Packaging, Particle swarm optimization, Artificial neural networks, Design, Particulate matter, Trajectories (Physics), Simulation, Displacement
Journal Articles

Interface Reliability Modeling of Coaxial Through Silicon Via Based on WOA-BP Neural Network

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Liwen Zhang, Chen Yang, He Yang, Jinchan Wang, Jincan Zhang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2024, 146(3): 031003.
Paper No: EP-23-1065
https://doi.org/10.1115/1.4064522
Published Online: February 7, 2024
View Articletitled, Interface Reliability Modeling of Coaxial Through Silicon Via Based on WOA-BP Neural Network
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Topics: Algorithms, Artificial neural networks, Errors, Fracture (Materials), Neural network models, Optimization algorithms, Reliability, Silicon, Finite element methods, Modeling
Journal Articles

Printed Circuit Board Defect Image Recognition Based on the Multimodel Fusion Algorithm

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Jiantao Zhang, Zhengfang Chang, Haida Xu, Dong Qu, Xinyu Shi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2024, 146(2): 021009.
Paper No: EP-23-1046
https://doi.org/10.1115/1.4064098
Published Online: December 11, 2023
View Articletitled, Printed Circuit Board Defect Image Recognition Based on the Multimodel Fusion Algorithm
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Topics: Algorithms, Network models, Printed circuit boards, Artificial neural networks, Flaw detection
Journal Articles

Special Issue on InterPACK2022

Free
Jin Yang, Sukwon Choi, Benjamin Leever, Cheng Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. December 2023, 145(4): 040301.
Paper No: EP-23-1077
https://doi.org/10.1115/1.4063893
Published Online: November 1, 2023
View Articletitled, Special Issue on InterPACK2022
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Topics: Aerosols, Artificial intelligence, Cloud computing, Cooling, Cycles, Density, Electric vehicles, Electronic packaging, Electronics, Energy conversion
Journal Articles

The Resistor Network Approach to Modeling Screen-Printed Silver Ink Under Uniaxial Stretch

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Justin H. Chow, Suresh K. Sitaraman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2023, 145(4): 041104.
Paper No: EP-23-1035
https://doi.org/10.1115/1.4063485
Published Online: October 9, 2023
View Articletitled, The Resistor Network Approach to Modeling Screen-Printed Silver Ink Under Uniaxial Stretch
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Topics: Inks, Particulate matter, Percolation theory, Resistors, Silver, Modeling
Journal Articles

Point-Contact Bonding of Integrated Three-Dimensional Manifold Microchannel Cooling Within Direct Bonded Copper Platform

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Yujui Lin, Tiwei Wei, Wyatt Jason Moy, Hao Chen, Man Prakash Gupta, Michael Degner, Mehdi Asheghi, H. Alan Mantooth, Kenneth E. Goodson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2024, 146(2): 021003.
Paper No: EP-22-1092
https://doi.org/10.1115/1.4062924
Published Online: September 20, 2023
View Articletitled, Point-Contact Bonding of Integrated Three-Dimensional Manifold Microchannel Cooling Within Direct Bonded Copper Platform
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Topics: Bonding, Copper, Microchannels, Polishing, Manifolds, Solders
Journal Articles

Multi-Level Embedded Three-Dimensional Manifold Microchannel Heat Sink of Aluminum Nitride Direct Bonded Copper for the High-Power Electronic Module

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Yujui Lin, Tiwei Wei, Wyatt Jason Moy, Hao Chen, Man Prakash Gupta, Michael Degner, Mehdi Asheghi, H. Alan Mantooth, Kenneth E. Goodson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2024, 146(1): 011006.
Paper No: EP-22-1093
https://doi.org/10.1115/1.4062384
Published Online: June 7, 2023
View Articletitled, Multi-Level Embedded Three-Dimensional Manifold Microchannel Heat Sink of Aluminum Nitride Direct Bonded Copper for the High-Power Electronic Module
Open the PDF for Multi-Level Embedded Three-Dimensional Manifold Microchannel Heat Sink of Aluminum Nitride Direct Bonded Copper for the High-Power Electronic Module in another window
Topics: Manifolds, Microchannels, Pressure drop, Flow (Dynamics), Thermal resistance, Cooling, Computational fluid dynamics
Journal Articles

Coupled Electrical–Thermal–Fluidic Multi-Physics Analysis of Through Silicon Via Pin Fin Microchannel in the Three-Dimensional Integrated Circuit

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Ping Sun, Bing-Huan Huang, Kui Li, Liang Gong, Chuan-Yong Zhu, Ying Zheng
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2024, 146(1): 011005.
Paper No: EP-22-1080
https://doi.org/10.1115/1.4062531
Published Online: June 6, 2023
View Articletitled, Coupled Electrical–Thermal–Fluidic Multi-Physics Analysis of Through Silicon Via Pin Fin Microchannel in the Three-Dimensional Integrated Circuit
Open the PDF for Coupled Electrical–Thermal–Fluidic Multi-Physics Analysis of Through Silicon Via Pin Fin Microchannel in the Three-Dimensional Integrated Circuit in another window
Topics: Flow (Dynamics), Heat transfer, Microchannels, Shapes, Temperature, Fins, Circuits, Cooling, Integrated circuits
Journal Articles

Special Section on InterPACK2021

Free
Jin Yang, Przemyslaw Gromala, Sukwon Choi, Damena Agonafer, Patrick McCluskey
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. March 2023, 145(1): 010301.
Paper No: EP-22-1094
https://doi.org/10.1115/1.4056558
Published Online: January 11, 2023
View Articletitled, Special Section on InterPACK2021
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Topics: Additive manufacturing, Artificial intelligence, Data centers, Electronic packaging, Electronics, Engineering teachers, Integrated circuit packaging, Integrated circuits, Microelectromechanical systems, Microelectronic devices
Journal Articles

Mandrel Bend Test of Screen-Printed Silver Conductors

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Rui Chen, Justin Chow, Yi Zhou, Suresh K. Sitaraman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031004.
Paper No: EP-22-1072
https://doi.org/10.1115/1.4056530
Published Online: January 11, 2023
View Articletitled, Mandrel Bend Test of Screen-Printed Silver Conductors
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Topics: Cycles, Flexible electronics, Silver, Reliability, Inks, Damage, Imaging
Journal Articles

Artificial Intelligence for Power Electronics in Electric Vehicles: Challenges and Opportunities

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Paul Paret, Donal Finegan, Sreekant Narumanchi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2023, 145(3): 034501.
Paper No: EP-22-1053
https://doi.org/10.1115/1.4056306
Published Online: December 9, 2022
View Articletitled, Artificial Intelligence for Power Electronics in Electric Vehicles: Challenges and Opportunities
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Topics: Artificial intelligence, Design, Electric vehicles, Electronics, Thermal management, Semiconductor devices, Reliability, Manufacturing, Semiconductors (Materials)
Journal Articles

Process Development for Printed Copper With Surface Mount Devices on Inkjet Metallization

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Pradeep Lall, Kartik Goyal, Curtis Hill
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021011.
Paper No: EP-22-1029
https://doi.org/10.1115/1.4055986
Published Online: November 23, 2022
View Articletitled, Process Development for Printed Copper With Surface Mount Devices on Inkjet Metallization
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Topics: Copper, Sintering, Surface mount devices, Electrical resistivity, Printing, Drops, Electronics
Journal Articles

Multilayer Conductive Metallization With Offset Vias Using Aerosol Jet Technology

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Pradeep Lall, Kartik Goyal, Scott Miller
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021119.
Paper No: EP-21-1057
https://doi.org/10.1115/1.4054131
Published Online: April 22, 2022
View Articletitled, Multilayer Conductive Metallization With Offset Vias Using Aerosol Jet Technology
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Topics: Aerosols, Sintering, Metals, Inks, Stress, Shear (Mechanics), Failure, Design, Temperature