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Journal Articles

Transient Liquid Phase Bond Acceleration Using Copper Nanowires

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John Harris, David Huitink
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2025, 147(1): 011008.
Paper No: EP-24-1038
https://doi.org/10.1115/1.4066042
Published Online: August 17, 2024
View Articletitled, Transient Liquid Phase Bond Acceleration Using Copper Nanowires
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Topics: Copper, Nanowires, Solders, Tension-leg platforms, Transients (Dynamics), Temperature
Journal Articles

Evaluating the Reliability of Passive Server Components for Single-Phase Immersion Cooling

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Jimil M. Shah, Keerthivasan Padmanaban, Hrishabh Singh, Surya Duraisamy Asokan, Satyam Saini, Dereje Agonafer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021109.
Paper No: EP-21-1016
https://doi.org/10.1115/1.4052536
Published Online: October 14, 2021
View Articletitled, Evaluating the Reliability of Passive Server Components for Single-Phase Immersion Cooling
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Topics: Cables, Cooling, Cycles, Fluids, Mineral oil, Printed circuit boards, Reliability, Temperature, Capacitance, Optical cables
Journal Articles

A Novel Activated Carbon Enabled Steam Generation System Under Simulated Solar Light

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Ashreet Mishra, Agwu A. G. Nnanna
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2019, 141(3): 031015.
Paper No: EP-18-1090
https://doi.org/10.1115/1.4044716
Published Online: September 24, 2019
View Articletitled, A Novel Activated Carbon Enabled Steam Generation System Under Simulated Solar Light
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Topics: Activated carbon, Evaporation, Nanofluids, Nanoparticles, Steam, Sunlight, Water, Solar energy
Journal Articles

Novel Transient Liquid Phase Bonding for High-Temperature Automotive Power Electronics Systems

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Yanghe Liu, Shailesh N. Joshi, Ercan M. Dede
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2020, 142(1): 011003.
Paper No: EP-19-1014
https://doi.org/10.1115/1.4044476
Published Online: September 19, 2019
View Articletitled, Novel Transient Liquid Phase Bonding for High-Temperature Automotive Power Electronics Systems
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Topics: Bonding, Electronics, High temperature, Manufacturing, Stress, Tension-leg platforms, Thermal stresses, Tin, Transients (Dynamics), Temperature
Journal Articles

Evaluation and Improvement of the Adhesive Fracture Toughness of CVD Diamond on Silicon Substrate

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Shoji Kamiya, Hironori Takahashi, Masumi Saka, Hiroyuki Abe´
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Papers On Reliability
J. Electron. Packag. September 2002, 124(3): 271–276.
https://doi.org/10.1115/1.1481374
Published Online: July 26, 2002
View Articletitled, Evaluation and Improvement of the Adhesive Fracture Toughness of CVD Diamond on Silicon Substrate
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Topics: Adhesives, Diamonds, Fracture toughness, Methane, Particulate matter, Silicon, Synthetic diamonds, Fracture (Materials), Graphite
Journal Articles

Development of Glass-Free Metal Electrically Conductive Thick Films

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Zongrong Liu, D. D. L. Chung
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2001, 123(1): 64–69.
https://doi.org/10.1115/1.1329131
Published Online: July 13, 2000
View Articletitled, Development of Glass-Free Metal Electrically Conductive Thick Films
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Topics: Electrical resistivity, Glass, Metals, Thick films, Adhesion, Alloys
Journal Articles

A Study of Process-Induced Residual Stress in PBGA Packages

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Zhu Wu, Jian Lu, Mem. ASME, Yifan Guo, Mem. ASME
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2000, 122(3): 262–266.
https://doi.org/10.1115/1.1285983
Published Online: December 8, 1999
View Articletitled, A Study of Process-Induced Residual Stress in PBGA Packages
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Topics: Calibration, Displacement, Stress, Residual stresses, Interferometry
Journal Articles

Drill Wear Monitoring in Circuit Board Manufacturing Using Drilling Forces and Their Spectra

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Ciro N. Ramirez, R. Joe Thornhill
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1992, 114(3): 342–348.
https://doi.org/10.1115/1.2905461
Published Online: September 1, 1992
View Articletitled, Drill Wear Monitoring in Circuit Board Manufacturing Using Drilling Forces and Their Spectra
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Topics: Drilling, Drills (Tools), Manufacturing, Printed circuit boards, Spectra (Spectroscopy), Wear, Computer simulation, Cutting, Vibration
Journal Articles

Theoretical and Experimental Investigation of Laser Drilling in a Partially Transparent Medium

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T. Nowak, R. J. Pryputniewicz
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1992, 114(1): 71–80.
https://doi.org/10.1115/1.2905444
Published Online: March 1, 1992
View Articletitled, Theoretical and Experimental Investigation of Laser Drilling in a Partially Transparent Medium
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Topics: Drilling, Lasers, Transparency, Laser beams, Shapes, Computer simulation, Errors, Experimental analysis, Geometry, Temperature
Journal Articles

Reliability Monitoring in Drilling Electronic Circuit Boards

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H. Hocheng, C. L. Jiaa
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1991, 113(3): 263–267.
https://doi.org/10.1115/1.2905405
Published Online: September 1, 1991
View Articletitled, Reliability Monitoring in Drilling Electronic Circuit Boards
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Topics: Drilling, Printed circuit boards, Reliability, Delamination, Acoustic emissions, Composite materials, Damage, Energy levels (Quantum mechanics), Manufacturing, Mechanical structures
Journal Articles

Ceramic Materials for Electronic Packaging

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E. M. Rabinovich
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1989, 111(3): 183–191.
https://doi.org/10.1115/1.3226532
Published Online: September 1, 1989
View Articletitled, Ceramic Materials for Electronic Packaging
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Topics: Ceramics, Electronic packaging, Firing, Glass ceramics, Packaging, Sol-gel processing