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Journal Articles

Computational Framework for Computational Fluid Dynamics Analysis of Loop Thermosiphon Based Embedded Cooling Systems

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Caner Ekin Kiper, Ignacio Gallego-Marcos, Stevin Van Wyk, Yigit Akkus
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2025, 147(3): 031003.
Paper No: EP-24-1110
https://doi.org/10.1115/1.4068209
Published Online: April 7, 2025
View Articletitled, Computational Framework for Computational Fluid Dynamics Analysis of Loop Thermosiphon Based Embedded Cooling Systems
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Topics: Flow (Dynamics), Fluids, Relaxation (Physics), Simulation, Temperature, Vapors, Heat, Pressure, Computational fluid dynamics, Turbulence
Includes: Supplementary data
Journal Articles

Flow Characterization of Capillary Underfill in Multi-Chip Heterogenous Integration Using Computational Fluid Dynamics

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Muhammad Aqil Azman, Mohd Zulkifly Abdullah, Wei Keat Loh, Chun Keang Ooi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2025, 147(3): 031002.
Paper No: EP-24-1099
https://doi.org/10.1115/1.4068143
Published Online: March 28, 2025
View Articletitled, Flow Characterization of Capillary Underfill in Multi-Chip Heterogenous Integration Using Computational Fluid Dynamics
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Topics: Computational fluid dynamics, Flow (Dynamics), Simulation, Viscosity
Journal Articles

Methodology to Characterize Row Manifolds for High Power Direct to Chip Liquid Cooling Data Centers

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Pardeep Shahi, Ali Heydari, Bahareh Eslami, Vahideh Radmard, Chandraprakash Hinge, Himanshu Modi, Lochan Sai Reddy Chinthaparthy, Mohammad Tradat, Dereje Agonafer, Jeremy Rodriguez
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041117.
Paper No: EP-24-1030
https://doi.org/10.1115/1.4065948
Published Online: August 17, 2024
View Articletitled, Methodology to Characterize Row Manifolds for High Power Direct to Chip Liquid Cooling Data Centers
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Topics: Cooling, Data centers, Flow (Dynamics), Manifolds, Pressure, Pressure drop, Temperature, Modeling, Coolants, Calibration
Journal Articles

Process Recipe and Functional Circuitry Performance on Aerosol Jet Printed Water-Based Silver Ink

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Pradeep Lall, Sabina Bimali, Scott Miller
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041116.
Paper No: EP-24-1029
https://doi.org/10.1115/1.4066041
Published Online: August 17, 2024
View Articletitled, Process Recipe and Functional Circuitry Performance on Aerosol Jet Printed Water-Based Silver Ink
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Topics: Circuits, Design, Inks, Printing, Shear (Mechanics), Silver, Sintering, Aerosols, Stress, Water
Journal Articles

Convection Cooling of Power Electronics Operating in Deep-Space

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Jessica Harsono, Joseph P. Kozak, Hala Tomey, William Yerkes, Jonathan Neville
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041111.
Paper No: EP-24-1027
https://doi.org/10.1115/1.4065947
Published Online: August 9, 2024
View Articletitled, Convection Cooling of Power Electronics Operating in Deep-Space
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Topics: Design, Electronics, Fans, Forced convection, Heat, Simulation, Temperature, Thermal management, Packaging, Cooling
Journal Articles

Cold Gas Spraying Copper Metal on AlN Ceramics as an Alternative to Thick Direct Bond Copper Substrates for Power Electronics

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Margie Guerrero-Fernandez, Pedro Quintero, Ozan Cagatay Ozdemir
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041107.
Paper No: EP-24-1022
https://doi.org/10.1115/1.4065943
Published Online: July 26, 2024
View Articletitled, Cold Gas Spraying Copper Metal on AlN Ceramics as an Alternative to Thick Direct Bond Copper Substrates for Power Electronics
Open the PDF for Cold Gas Spraying Copper Metal on AlN Ceramics as an Alternative to Thick Direct Bond Copper Substrates for Power Electronics in another window
Topics: Coating processes, Coatings, Copper, Plasma spraying, Spraying (Coating processes), Sprays, Surface roughness, Ceramics, Electronics, Experimental design
Journal Articles

Variable Area Jet Impingement for Enhanced Junction Temperature Control of High-Power Electronics

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Reece Whitt, David Huitink
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041104.
Paper No: EP-24-1025
https://doi.org/10.1115/1.4065944
Published Online: July 25, 2024
View Articletitled, Variable Area Jet Impingement for Enhanced Junction Temperature Control of High-Power Electronics
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Topics: Electronics, Flow (Dynamics), Heat transfer, Junctions, Nozzles, Temperature, Temperature control, Testing, Transients (Dynamics), Actuators
Journal Articles

Performance Analysis of Liquid-to-Air Heat Exchanger of High-Power Density Racks

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Ali Heydari, Ahmad R. Gharaibeh, Mohammad Tradat, Qusai Soud, Yaman Manaserh, Vahideh Radmard, Bahareh Eslami, Jeremy Rodriguez, Bahgat Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041102.
Paper No: EP-24-1007
https://doi.org/10.1115/1.4065537
Published Online: June 17, 2024
View Articletitled, Performance Analysis of Liquid-to-Air Heat Exchanger of High-Power Density Racks
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Topics: Coolants, Cooling, Data centers, Density, Heat, Heat exchangers, Temperature, Fluids, Stress, Cooling systems
Journal Articles

Correlation Study on Voiding in Underfill of Large Quantity Ball Grid Array Chip Using Machine Learning

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Calvin Ling, Muhammad Taufik Azahari, Mohamad Aizat Abas, Fei Chong Ng
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2025, 147(1): 011001.
Paper No: EP-22-1076
https://doi.org/10.1115/1.4065077
Published Online: April 5, 2024
View Articletitled, Correlation Study on Voiding in Underfill of Large Quantity Ball Grid Array Chip Using Machine Learning
Open the PDF for Correlation Study on Voiding in Underfill of Large Quantity Ball Grid Array Chip Using Machine Learning in another window
Topics: Ball-Grid-Array packaging, Computer simulation, Machine learning, Pressure, Solders, Valves, Epoxy adhesives, Epoxy resins, Simulation, Temperature
Journal Articles

A Comparative Numerical Analysis of Cold Plates for Thermal Management of Chips With Hotspots

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Mahdi Farahikia, Ping-Chuan Wang, Louis Reyes, Matthew Krumholtz
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2024, 146(3): 034501.
Paper No: EP-23-1066
https://doi.org/10.1115/1.4064523
Published Online: February 7, 2024
View Articletitled, A Comparative Numerical Analysis of Cold Plates for Thermal Management of Chips With Hotspots
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Topics: Coolants, Fins, Numerical analysis, Plates (structures), Pumps, Temperature, Temperature distribution, Thermal management, Thermal resistance, Flow (Dynamics)
Journal Articles

Numerical and Experimental Investigation of a Volumetric Resistance Blower Performance and Its Optimization for Portable Computing Device Applications

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Amit Kumar, Ayan Majumder, Ruander Cardenas, Mark MacDonald, Anandaroop Bhattacharya
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2024, 146(2): 021008.
Paper No: EP-23-1043
https://doi.org/10.1115/1.4063917
Published Online: December 11, 2023
View Articletitled, Numerical and Experimental Investigation of a Volumetric Resistance Blower Performance and Its Optimization for Portable Computing Device Applications
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Topics: Acoustics, Blades, Experimental design, Flow (Dynamics), Noise (Sound), Pressure, Rotors, Optimization, Geometry
Includes: Supplementary data
Journal Articles

Converging Jet Impingement for Enhanced Liquid Cooling

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Reece Whitt, Rafael Estrella, David Huitink
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2023, 145(4): 041103.
Paper No: EP-23-1032
https://doi.org/10.1115/1.4063484
Published Online: October 9, 2023
View Articletitled, Converging Jet Impingement for Enhanced Liquid Cooling
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Topics: Additive manufacturing, Cooling, Electronics, Fluids, Heat transfer, Jets, Nozzles, Pressure, Reynolds number, Simulation
Journal Articles

Multi-Level Embedded Three-Dimensional Manifold Microchannel Heat Sink of Aluminum Nitride Direct Bonded Copper for the High-Power Electronic Module

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Yujui Lin, Tiwei Wei, Wyatt Jason Moy, Hao Chen, Man Prakash Gupta, Michael Degner, Mehdi Asheghi, H. Alan Mantooth, Kenneth E. Goodson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2024, 146(1): 011006.
Paper No: EP-22-1093
https://doi.org/10.1115/1.4062384
Published Online: June 7, 2023
View Articletitled, Multi-Level Embedded Three-Dimensional Manifold Microchannel Heat Sink of Aluminum Nitride Direct Bonded Copper for the High-Power Electronic Module
Open the PDF for Multi-Level Embedded Three-Dimensional Manifold Microchannel Heat Sink of Aluminum Nitride Direct Bonded Copper for the High-Power Electronic Module in another window
Topics: Manifolds, Microchannels, Pressure drop, Flow (Dynamics), Thermal resistance, Cooling, Computational fluid dynamics
Journal Articles

Numerical Analysis of Flow and Heat Transfer Characteristics of Lattice-Based Compact Heat Sinks

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Inderjot Kaur, Shiraz Mujahid, YubRaj Paudel, Hongjoo Rhee, Prashant Singh
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031002.
Paper No: EP-22-1051
https://doi.org/10.1115/1.4056305
Published Online: December 21, 2022
View Articletitled, Numerical Analysis of Flow and Heat Transfer Characteristics of Lattice-Based Compact Heat Sinks
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Topics: Flow (Dynamics), Fluids, Heat transfer, Heat transfer coefficients, Topology, Temperature
Journal Articles

Process Development for Printed Copper With Surface Mount Devices on Inkjet Metallization

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Pradeep Lall, Kartik Goyal, Curtis Hill
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021011.
Paper No: EP-22-1029
https://doi.org/10.1115/1.4055986
Published Online: November 23, 2022
View Articletitled, Process Development for Printed Copper With Surface Mount Devices on Inkjet Metallization
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Topics: Copper, Sintering, Surface mount devices, Electrical resistivity, Printing, Drops, Electronics
Journal Articles

HFE7500 Coolant Dielectric Strength Augmentation Under Convective Conditions

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Ange Christian Iradukunda, David Huitink, Kevin Kayijuka, Tarek Gebrael, Nenad Miljkovic
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011105.
Paper No: EP-22-1022
https://doi.org/10.1115/1.4056031
Published Online: November 11, 2022
View Articletitled, HFE7500 Coolant Dielectric Strength Augmentation Under Convective Conditions
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Topics: Coolants, Electrodes, Flow (Dynamics), Fluids, Temperature, Cooling
Journal Articles

Numerical Study of Large Footprint (24 × 24 mm 2 ) Silicon-Based Embedded Microchannel Three-Dimensional Manifold Coolers

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Tiwei Wei, Sougata Hazra, Yujui Lin, Man Prakash Gupta, Michael Degner, Mehdi Asheghi, Kenneth E. Goodson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021008.
Paper No: EP-22-1046
https://doi.org/10.1115/1.4055468
Published Online: September 28, 2022
View Articletitled, Numerical Study of Large Footprint (24 × 24 mm 2 ) Silicon-Based Embedded Microchannel Three-Dimensional Manifold Coolers
Open the PDF for Numerical Study of Large Footprint (24 × 24 mm 2 ) Silicon-Based Embedded Microchannel Three-Dimensional Manifold Coolers in another window
Topics: Flow (Dynamics), Manifolds, Microchannels, Silicon, Pressure, Temperature, Intake manifolds, Pressure drop
Journal Articles

Using a Multi-Inlet/Outlet Manifold to Improve Heat Transfer and Flow Distribution of a Pin Fin Heat Sink

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Ahmad R. Gharaibeh, Yaman M. Manaserh, Mohammad I. Tradat, Firas W. AlShatnawi, Scott N. Schiffres, Bahgat G. Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031017.
Paper No: EP-21-1164
https://doi.org/10.1115/1.4054461
Published Online: May 19, 2022
View Articletitled, Using a Multi-Inlet/Outlet Manifold to Improve Heat Transfer and Flow Distribution of a Pin Fin Heat Sink
Open the PDF for Using a Multi-Inlet/Outlet Manifold to Improve Heat Transfer and Flow Distribution of a Pin Fin Heat Sink in another window
Topics: Flow (Dynamics), Heat sinks, Manifolds, Pressure drop, Thermal resistance, Design, Computer simulation, Fluids, Temperature, Heat transfer
Journal Articles

Multilayer Conductive Metallization With Offset Vias Using Aerosol Jet Technology

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Pradeep Lall, Kartik Goyal, Scott Miller
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021119.
Paper No: EP-21-1057
https://doi.org/10.1115/1.4054131
Published Online: April 22, 2022
View Articletitled, Multilayer Conductive Metallization With Offset Vias Using Aerosol Jet Technology
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Topics: Aerosols, Sintering, Metals, Inks, Stress, Shear (Mechanics), Failure, Design, Temperature
Journal Articles

Experimental and Numerical Analysis of Data Center Pressure and Flow Fields Induced by Backward and Forward CRAH Technology

Free
Mohammad I. Tradat, Yaman “Mohammad Ali” Manaserh, Ahmad Gharaibeh, Bahgat G. Sammakia, Dave Hall, Kourosh Nemati, Mark Seymour
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031015.
Paper No: EP-21-1151
https://doi.org/10.1115/1.4053890
Published Online: March 8, 2022
View Articletitled, Experimental and Numerical Analysis of Data Center Pressure and Flow Fields Induced by Backward and Forward CRAH Technology
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Topics: Air flow, Computational fluid dynamics, Cooling, Data centers, Flow (Dynamics), Pressure, Temperature, Tiles, Modeling