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Journal Articles

Optimization of the Reliability of Ball Grid Array Solder Joints Under Random Vibration Conditions Using an Improved Back Propagation Neural Network-Based Particle Swarm Algorithm

Available to Purchase
Miao Zhu, Xuexia Yang, Yanxi Sun, Jinbao Lin, Erqiang Liu, Ze Wang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2025, 147(3): 031005.
Paper No: EP-24-1084
https://doi.org/10.1115/1.4068450
Published Online: May 16, 2025
View Articletitled, Optimization of the Reliability of Ball Grid Array Solder Joints Under Random Vibration Conditions Using an Improved Back Propagation Neural Network-Based Particle Swarm Algorithm
Open the PDF for Optimization of the Reliability of Ball Grid Array Solder Joints Under Random Vibration Conditions Using an Improved Back Propagation Neural Network-Based Particle Swarm Algorithm in another window
Topics: Algorithms, Artificial neural networks, Ball-Grid-Array packaging, Optimization, Particulate matter, Random vibration, Reliability, Response surface methodology, Simulation, Solder joints
Journal Articles

Flow Characterization of Capillary Underfill in Multi-Chip Heterogenous Integration Using Computational Fluid Dynamics

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Muhammad Aqil Azman, Mohd Zulkifly Abdullah, Wei Keat Loh, Chun Keang Ooi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2025, 147(3): 031002.
Paper No: EP-24-1099
https://doi.org/10.1115/1.4068143
Published Online: March 28, 2025
View Articletitled, Flow Characterization of Capillary Underfill in Multi-Chip Heterogenous Integration Using Computational Fluid Dynamics
Open the PDF for Flow Characterization of Capillary Underfill in Multi-Chip Heterogenous Integration Using Computational Fluid Dynamics in another window
Topics: Computational fluid dynamics, Flow (Dynamics), Simulation, Viscosity
Journal Articles

Enhancing Image Segmentation Model in Computing Void Percentage With Mask RCNN

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Calvin Ling, Aizat Abas, Chew Cheng Kai, Muhammad Taufik Azahari
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2025, 147(3): 031001.
Paper No: EP-24-1090
https://doi.org/10.1115/1.4067897
Published Online: March 14, 2025
View Articletitled, Enhancing Image Segmentation Model in Computing Void Percentage With Mask RCNN
Open the PDF for Enhancing Image Segmentation Model in Computing Void Percentage With Mask RCNN in another window
Topics: Convolutional neural networks, Image segmentation, Ball-Grid-Array packaging, Algorithms, Flip-chip devices, Flip-chip, Manufacturing
Journal Articles

Wideband Equivalent Circuit Modeling and Parameter Extraction Method for Through Via in Ceramic Package Substrate

Available to Purchase
Pan Ren, Chulin Wang, Yaya Liang, Xuan Zhao, Xiaojie Li, Du Pingan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2025, 147(2): 021004.
Paper No: EP-24-1071
https://doi.org/10.1115/1.4067269
Published Online: December 20, 2024
View Articletitled, Wideband Equivalent Circuit Modeling and Parameter Extraction Method for Through Via in Ceramic Package Substrate
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Topics: Capacitance, Ceramics, Circuits, Skin effect
Journal Articles

Understanding the Impact of Data Center Liquid Cooling on Energy and Performance of Machine Learning and Artificial Intelligence Workloads

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Bharath Ramakrishnan, Cam Turner, Husam Alissa, Dennis Trieu, Felipe Rivera, Luke Melton, Muralikrishna Rao, Sruti Chigullapalli, Tatek Getachew, Vladimir Prodanovic, Robert Lankston, Christian Belady, Vaidehi Oruganti
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2025, 147(2): 021003.
Paper No: EP-24-1082
https://doi.org/10.1115/1.4067136
Published Online: December 11, 2024
View Articletitled, Understanding the Impact of Data Center Liquid Cooling on Energy and Performance of Machine Learning and Artificial Intelligence Workloads
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Topics: Artificial intelligence, Cooling, Data centers, Energy consumption, Graphics processing units, Machine learning, Temperature, Stress, Coolants
Journal Articles

Special Issue on InterPACK2023

Free
Ronald J. Warzoha, Damena Agonofer, Ashutosh Giri, Jimil Shah
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. December 2024, 146(4): 040301.
Paper No: EP-24-1089
https://doi.org/10.1115/1.4066727
Published Online: October 22, 2024
View Articletitled, Special Issue on InterPACK2023
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Topics: Electronic packaging, Electronics, Packaging, Cutting, Data centers, Energy storage, Engineering teachers, Machine learning, Mechanical engineers, Microelectromechanical systems
Journal Articles

Thermal Property Estimation of Thin-Layered Structures by Means of Thermoreflectance Measurement and Network Identification by Deconvolution Algorithm

Open Access
Daiki Higuma, João Vitor Thomsen Silveira, Byunggi Kim, Masahiro Nomura, Kazuyoshi Fushinobu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041115.
Paper No: EP-24-1015
https://doi.org/10.1115/1.4066086
Published Online: August 17, 2024
View Articletitled, Thermal Property Estimation of Thin-Layered Structures by Means of Thermoreflectance Measurement and Network Identification by Deconvolution Algorithm
Open the PDF for Thermal Property Estimation of Thin-Layered Structures by Means of Thermoreflectance Measurement and Network Identification by Deconvolution Algorithm in another window
Topics: Algorithms, Lasers, Thermal conductivity, Thermal properties, Thermoreflectance, Temperature, Heat, Flow (Dynamics), Thermal resistance, Interfacial thermal resistance
Journal Articles

Effect of Dispensing Type on Void Formation Using Convolutional Neural Network

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Muhammad Taufik Azahari, Calvin Ling, Aizat Abas, Fei Chong Ng
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2025, 147(1): 011006.
Paper No: EP-23-1004
https://doi.org/10.1115/1.4065078
Published Online: August 9, 2024
View Articletitled, Effect of Dispensing Type on Void Formation Using Convolutional Neural Network
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Topics: Convolutional neural networks, Epoxy adhesives, Epoxy resins, Flip-chip devices, Flip-chip, Flow (Dynamics), Image processing
Journal Articles

Electrochemical Additive Manufacturing-Based Design of a Heat Sink for Single-Phase Natural Convection Immersion Cooling Application

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Jacob Lamotte-Dawaghreh, Joseph Herring, Sai Abhideep Pundla, Rohit Suthar, Vivek Nair, Pratik Bansode, Gautam Gupta, Dereje Agonafer, Joseph Madril, Tim Ouradnik, Michael Matthews, Ian Winfield
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041113.
Paper No: EP-24-1048
https://doi.org/10.1115/1.4065987
Published Online: August 9, 2024
View Articletitled, Electrochemical Additive Manufacturing-Based Design of a Heat Sink for Single-Phase Natural Convection Immersion Cooling Application
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Topics: Computational fluid dynamics, Cooling, Design, Heat sinks, Natural convection, Temperature, Triply periodic minimal surfaces, Manufacturing, Porosity
Journal Articles

High Gain Compact Antenna-in-Package Solution Using Like Mushroom Electromagnetic Band Gap for Industrial, Scientific, and Medical Band

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El Amjed Hajlaoui, Ziyad M. Almohaimeed, Abdullah Almohaimeed, Wazie Abdulkawi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2025, 147(1): 011002.
Paper No: EP-23-1079
https://doi.org/10.1115/1.4065145
Published Online: April 12, 2024
View Articletitled, High Gain Compact Antenna-in-Package Solution Using Like Mushroom Electromagnetic Band Gap for Industrial, Scientific, and Medical Band
Open the PDF for High Gain Compact Antenna-in-Package Solution Using Like Mushroom Electromagnetic Band Gap for Industrial, Scientific, and Medical Band in another window
Topics: Biomedicine, Energy gap, Radiation (Physics), Design, Reflectance, Surface waves (Fluid)
Journal Articles

Correlation Study on Voiding in Underfill of Large Quantity Ball Grid Array Chip Using Machine Learning

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Calvin Ling, Muhammad Taufik Azahari, Mohamad Aizat Abas, Fei Chong Ng
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2025, 147(1): 011001.
Paper No: EP-22-1076
https://doi.org/10.1115/1.4065077
Published Online: April 5, 2024
View Articletitled, Correlation Study on Voiding in Underfill of Large Quantity Ball Grid Array Chip Using Machine Learning
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Topics: Ball-Grid-Array packaging, Computer simulation, Machine learning, Pressure, Solders, Valves, Epoxy adhesives, Epoxy resins, Simulation, Temperature
Journal Articles

Forward Kinematics Analysis of High-Precision Optoelectronic Packaging Platform

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Ziyang Wang, Haibo Zhou, Linjiao Xiao, Lian Duan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2024, 146(3): 031005.
Paper No: EP-23-1069
https://doi.org/10.1115/1.4064704
Published Online: February 28, 2024
View Articletitled, Forward Kinematics Analysis of High-Precision Optoelectronic Packaging Platform
Open the PDF for Forward Kinematics Analysis of High-Precision Optoelectronic Packaging Platform in another window
Topics: Errors, Kinematics, Packaging, Particle swarm optimization, Artificial neural networks, Design, Particulate matter, Trajectories (Physics), Simulation, Displacement
Journal Articles

Interface Reliability Modeling of Coaxial Through Silicon Via Based on WOA-BP Neural Network

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Liwen Zhang, Chen Yang, He Yang, Jinchan Wang, Jincan Zhang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2024, 146(3): 031003.
Paper No: EP-23-1065
https://doi.org/10.1115/1.4064522
Published Online: February 7, 2024
View Articletitled, Interface Reliability Modeling of Coaxial Through Silicon Via Based on WOA-BP Neural Network
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Topics: Algorithms, Artificial neural networks, Errors, Fracture (Materials), Neural network models, Optimization algorithms, Reliability, Silicon, Finite element methods, Modeling
Journal Articles

Printed Circuit Board Defect Image Recognition Based on the Multimodel Fusion Algorithm

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Jiantao Zhang, Zhengfang Chang, Haida Xu, Dong Qu, Xinyu Shi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2024, 146(2): 021009.
Paper No: EP-23-1046
https://doi.org/10.1115/1.4064098
Published Online: December 11, 2023
View Articletitled, Printed Circuit Board Defect Image Recognition Based on the Multimodel Fusion Algorithm
Open the PDF for Printed Circuit Board Defect Image Recognition Based on the Multimodel Fusion Algorithm in another window
Topics: Algorithms, Network models, Printed circuit boards, Artificial neural networks, Flaw detection
Journal Articles

Numerical and Experimental Investigation of a Volumetric Resistance Blower Performance and Its Optimization for Portable Computing Device Applications

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Amit Kumar, Ayan Majumder, Ruander Cardenas, Mark MacDonald, Anandaroop Bhattacharya
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2024, 146(2): 021008.
Paper No: EP-23-1043
https://doi.org/10.1115/1.4063917
Published Online: December 11, 2023
View Articletitled, Numerical and Experimental Investigation of a Volumetric Resistance Blower Performance and Its Optimization for Portable Computing Device Applications
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Topics: Acoustics, Blades, Experimental design, Flow (Dynamics), Noise (Sound), Pressure, Rotors, Optimization, Geometry
Includes: Supplementary data
Journal Articles

Special Issue on InterPACK2022

Free
Jin Yang, Sukwon Choi, Benjamin Leever, Cheng Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. December 2023, 145(4): 040301.
Paper No: EP-23-1077
https://doi.org/10.1115/1.4063893
Published Online: November 1, 2023
View Articletitled, Special Issue on InterPACK2022
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Topics: Aerosols, Artificial intelligence, Cloud computing, Cooling, Cycles, Density, Electric vehicles, Electronic packaging, Electronics, Energy conversion
Journal Articles

Machine Learning Analysis of Autonomous Vehicle Sensors Under Extreme Conditions in Alaska

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Jewoo Park, Nhi V. Quach, Yonghwi Kim, Ruey-Hwa Cheng, Michal Jenco, Chenxi Yin, Alex K. Lee, Yoonjin Won
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2023, 145(4): 044501.
Paper No: EP-23-1039
https://doi.org/10.1115/1.4063486
Published Online: October 5, 2023
View Articletitled, Machine Learning Analysis of Autonomous Vehicle Sensors Under Extreme Conditions in Alaska
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Topics: Autonomous vehicles, Drops, Machine learning, Sensors, Temperature, Vehicles
Journal Articles

Erratum: “Understanding Thermal Lagging Behaviors in Thermoelectric Elements With the Dual-Phase-Lag Model” [ASME J. Electron. Packag., 2022, 144(3), p. 031011; DOI: 10.1115/1.4052948 ]

Free
Wing K. Yeung, Tung T. Lam
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Errata
J. Electron. Packag. March 2024, 146(1): 017001.
Paper No: EP-23-1056
https://doi.org/10.1115/1.4063174
Published Online: August 25, 2023
View Articletitled, Erratum: “Understanding Thermal Lagging Behaviors in Thermoelectric Elements With the Dual-Phase-Lag Model” [ASME J. Electron. Packag., 2022, 144(3), p. 031011; DOI: 10.1115/1.4052948 ]
Open the PDF for Erratum: “Understanding Thermal Lagging Behaviors in Thermoelectric Elements With the Dual-Phase-Lag Model” [ASME J. Electron. Packag., 2022, 144(3), p. 031011; DOI: 10.1115/1.4052948 ] in another window
Topics: Electrons, Current density
Journal Articles

Special Section on InterPACK2021

Free
Jin Yang, Przemyslaw Gromala, Sukwon Choi, Damena Agonafer, Patrick McCluskey
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. March 2023, 145(1): 010301.
Paper No: EP-22-1094
https://doi.org/10.1115/1.4056558
Published Online: January 11, 2023
View Articletitled, Special Section on InterPACK2021
Open the PDF for Special Section on InterPACK2021 in another window
Topics: Additive manufacturing, Artificial intelligence, Data centers, Electronic packaging, Electronics, Engineering teachers, Integrated circuit packaging, Integrated circuits, Microelectromechanical systems, Microelectronic devices
Journal Articles

Multi-Physics Models of a Low-Voltage Power Semiconductor System-in-Package for Automotive Applications

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Giuseppe Mauromicale, Michele Calabretta, Giuseppe Scarcella, Giacomo Scelba, Alessandro Sitta
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031003.
Paper No: EP-22-1049
https://doi.org/10.1115/1.4056413
Published Online: December 23, 2022
View Articletitled, Multi-Physics Models of a Low-Voltage Power Semiconductor System-in-Package for Automotive Applications
Open the PDF for Multi-Physics Models of a Low-Voltage Power Semiconductor System-in-Package for Automotive Applications in another window
Topics: Power semiconductor devices, Simulation, Design, Automotive industry, System-in-package, Thermomechanics, Cycles