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Yogendra Joshi
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Journal Articles

Automotive Silicon Carbide Power Module Cooling With a Novel Modular Manifold and Embedded Heat Sink

Available to Purchase
Ammar Osman, Gilberto Moreno, Steve Myers, Joshua Major, Xuhui Feng, Sreekant V. J. Narumanchi, Yogendra Joshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2024, 146(2): 021007.
Paper No: EP-23-1026
https://doi.org/10.1115/1.4062869
Published Online: December 6, 2023
View Articletitled, Automotive Silicon Carbide Power Module Cooling With a Novel Modular Manifold and Embedded Heat Sink
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Journal Articles

Development and Validation of a Transient Heat Transfer Model for Evaluating Thermal Management Solutions for Packaging Next-Generation Smart City Infrastructure Devices

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Shuv Dey, Luis Diego Monge Jimenez, J. Michael Brown, Yogendra Joshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021004.
Paper No: EP-22-1038
https://doi.org/10.1115/1.4055094
Published Online: August 18, 2022
View Articletitled, Development and Validation of a Transient Heat Transfer Model for Evaluating Thermal Management Solutions for Packaging Next-Generation Smart City Infrastructure Devices
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Topics: Climate, Design, Solar energy, Temperature, Thermal management, Transients (Dynamics), Solar radiation, Smart cities, Computer simulation, Cycles
Journal Articles

Validation and Parametric Investigations of an Internal Permanent Magnet Motor Using a Lumped Parameter Thermal Model

Free
Sebastien Sequeira, Kevin Bennion, J. Emily Cousineau, Sreekant Narumanchi, Gilbert Moreno, Satish Kumar, Yogendra Joshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021114.
Paper No: EP-21-1052
https://doi.org/10.1115/1.4053121
Published Online: February 7, 2022
View Articletitled, Validation and Parametric Investigations of an Internal Permanent Magnet Motor Using a Lumped Parameter Thermal Model
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Topics: Engines, Finite element analysis, Lamination, Motors, Stators, Temperature, Thermal conductivity, Winding (process), Sensitivity analysis, Contact resistance
Journal Articles

Compact Transient Thermal Model of Microfluidically Cooled Three-Dimensional Stacked Chips With Pin-Fin Enhanced Microgap

Free
Yuanchen Hu, Md Obaidul Hossen, Zhimin Wan, Muhannad S. Bakir, Yogendra Joshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2021, 143(3): 031007.
Paper No: EP-20-1045
https://doi.org/10.1115/1.4049814
Published Online: February 19, 2021
View Articletitled, Compact Transient Thermal Model of Microfluidically Cooled Three-Dimensional Stacked Chips With Pin-Fin Enhanced Microgap
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Topics: Computational fluid dynamics, Cooling, Integrated circuits, Leakage, Simulation, Temperature, Transients (Dynamics), Fins, Steady state, Heat
Journal Articles

A Review of Thermo-Hydraulic Performance of Metal Foam and Its Application as Heat Sinks for Electronics Cooling

Available to Purchase
Yongtong Li, Liang Gong, Minghai Xu, Yogendra Joshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. September 2021, 143(3): 030801.
Paper No: EP-19-1124
https://doi.org/10.1115/1.4048861
Published Online: January 19, 2021
View Articletitled, A Review of Thermo-Hydraulic Performance of Metal Foam and Its Application as Heat Sinks for Electronics Cooling
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Topics: Heat sinks, Metal foams, Heat transfer
Journal Articles

Thermal Performance of Metal Foam Heat Sink With Pin Fins for Nonuniform Heat Flux Electronics Cooling

Available to Purchase
Yongtong Li, Liang Gong, Minghai Xu, Yogendra Joshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2021, 143(1): 011006.
Paper No: EP-19-1100
https://doi.org/10.1115/1.4046756
Published Online: June 4, 2020
View Articletitled, Thermal Performance of Metal Foam Heat Sink With Pin Fins for Nonuniform Heat Flux Electronics Cooling
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Topics: Heat flux, Heat sinks, Metal foams, Heat transfer, Temperature, Fluids
Journal Articles

Vandal Glass Heat Distribution and the Effect of Glass Gap Adjustments in Outdoor Digital Display Components

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Jeho Kim, J. Michael Brown, Yogendra Joshi, Kevin O'Connor, Marcos Diaz, Zhuomin Zhang, Peiyan Yang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031120.
Paper No: EP-19-1127
https://doi.org/10.1115/1.4046933
Published Online: May 4, 2020
View Articletitled, Vandal Glass Heat Distribution and the Effect of Glass Gap Adjustments in Outdoor Digital Display Components
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Topics: Glass, Heat, Manufacturing, Solar energy, Solar radiation, Temperature, Testing, Simulation, Liquid crystals, Computational fluid dynamics
Journal Articles

Predictive Model Development and Validation for Raised Floor Plenum Data Center

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Yogesh Fulpagare, Atul Bhargav, Yogendra Joshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2020, 142(2): 021009.
Paper No: EP-18-1078
https://doi.org/10.1115/1.4046554
Published Online: March 19, 2020
View Articletitled, Predictive Model Development and Validation for Raised Floor Plenum Data Center
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Topics: Computational fluid dynamics, Data centers, Temperature, Testing, Transients (Dynamics), Heat, Stress
Journal Articles

Dynamic Load Balancing Using Actual Workload Traces Based on Central Processing Unit Temperatures

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Yusuke Nakajo, Jayati Athavale, Minami Yoda, Yogendra Joshi, Hiroaki Nishi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2019, 141(3): 031014.
Paper No: EP-18-1110
https://doi.org/10.1115/1.4044262
Published Online: September 19, 2019
View Articletitled, Dynamic Load Balancing Using Actual Workload Traces Based on Central Processing Unit Temperatures
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Topics: Data centers, Stress, Temperature, Rotation
Journal Articles

Experimentally Validated Computational Fluid Dynamics Model for Data Center With Active Tiles

Available to Purchase
Jayati Athavale, Yogendra Joshi, Minami Yoda
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 010902.
Paper No: EP-17-1087
https://doi.org/10.1115/1.4039025
Published Online: March 2, 2018
View Articletitled, Experimentally Validated Computational Fluid Dynamics Model for Data Center With Active Tiles
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Topics: Tiles, Data centers, Flow (Dynamics), Temperature
Journal Articles

Measurement of Air Flow Rate Through Perforated Floor Tiles in a Raised Floor Data Center

Open Access
Vaibhav K. Arghode, Taegyu Kang, Yogendra Joshi, Wally Phelps, Murray Michaels
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2017, 139(1): 011007.
Paper No: EP-15-1115
https://doi.org/10.1115/1.4035596
Published Online: January 10, 2017
View Articletitled, Measurement of Air Flow Rate Through Perforated Floor Tiles in a Raised Floor Data Center
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Topics: Air flow, Flow (Dynamics), Tiles, Porosity, Data centers
Journal Articles

Flow Boiling in Microgaps for Thermal Management of High Heat Flux Microsystems

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Xuefei Han, Andrei Fedorov, Yogendra Joshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. December 2016, 138(4): 040801.
Paper No: EP-16-1013
https://doi.org/10.1115/1.4034317
Published Online: August 24, 2016
View Articletitled, Flow Boiling in Microgaps for Thermal Management of High Heat Flux Microsystems
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Topics: Boiling, Flow (Dynamics), Heat flux, Water, Temperature, Pressure, Heat transfer coefficients, Heat sinks
Journal Articles

Numerical and Experimental Investigation of Shell-and-Tube Phase-Change Material Thermal Energy Storage Unit

Available to Purchase
Thomas H. Sherer, II, Yogendra Joshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2016, 138(3): 031008.
Paper No: EP-16-1014
https://doi.org/10.1115/1.4034101
Published Online: July 28, 2016
View Articletitled, Numerical and Experimental Investigation of Shell-and-Tube Phase-Change Material Thermal Energy Storage Unit
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Topics: Data centers, Flow (Dynamics), Temperature, Water, Computer simulation, Shells, Temperature profiles, Phase change materials, Cooling, Thermal energy storage
Journal Articles

Modified Body Force Model for Air Flow Through Perforated Floor Tiles in Data Centers

Available to Purchase
Vaibhav K. Arghode, Yogendra Joshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2016, 138(3): 031002.
Paper No: EP-15-1116
https://doi.org/10.1115/1.4033464
Published Online: May 16, 2016
View Articletitled, Modified Body Force Model for Air Flow Through Perforated Floor Tiles in Data Centers
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Topics: Momentum, Tiles, Air flow, Pressure, Flow (Dynamics), Data centers
Journal Articles

Three-Dimensional Integrated Circuit With Embedded Microfluidic Cooling: Technology, Thermal Performance, and Electrical Implications

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Xuchen Zhang, Xuefei Han, Thomas E. Sarvey, Craig E. Green, Peter A. Kottke, Andrei G. Fedorov, Yogendra Joshi, Muhannad S. Bakir
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 010910.
Paper No: EP-15-1107
https://doi.org/10.1115/1.4032496
Published Online: March 10, 2016
View Articletitled, Three-Dimensional Integrated Circuit With Embedded Microfluidic Cooling: Technology, Thermal Performance, and Electrical Implications
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Topics: Cooling, Design, Fins, Flow (Dynamics), Heat flux, Heat sinks, Heat transfer coefficients, Microfluidics, Temperature, Testing
Journal Articles

A Review of Two-Phase Forced Cooling in Three-Dimensional Stacked Electronics: Technology Integration

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Craig Green, Peter Kottke, Xuefei Han, Casey Woodrum, Thomas Sarvey, Pouya Asrar, Xuchen Zhang, Yogendra Joshi, Andrei Fedorov, Suresh Sitaraman, Muhannad Bakir
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. December 2015, 137(4): 040802.
Paper No: EP-15-1068
https://doi.org/10.1115/1.4031481
Published Online: September 25, 2015
View Articletitled, A Review of Two-Phase Forced Cooling in Three-Dimensional Stacked Electronics: Technology Integration
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Topics: Coolants, Cooling, Design, Flow (Dynamics), Fluids, Heat sinks, Heat, Flux (Metallurgy), Temperature, Pressure
Journal Articles

A Brief Overview of Recent Developments in Thermal Management in Data Centers

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Sami Alkharabsheh, John Fernandes, Betsegaw Gebrehiwot, Dereje Agonafer, Kanad Ghose, Alfonso Ortega, Yogendra Joshi, Bahgat Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2015, 137(4): 040801.
Paper No: EP-14-1117
https://doi.org/10.1115/1.4031326
Published Online: September 10, 2015
View Articletitled, A Brief Overview of Recent Developments in Thermal Management in Data Centers
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Topics: Computational fluid dynamics, Cooling, Data centers, Modeling, Temperature, Tiles, Thermal management
Journal Articles

Double-Sided Transferred Carbon Nanotube Arrays for Improved Thermal Interface Materials

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Andrew J. McNamara, Yogendra Joshi, Zhuomin Zhang, Kyoung-sik Moon, Ziyin Lin, Yagang Yao, Ching-Ping Wong, Wei Lin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2015, 137(3): 031014.
Paper No: EP-14-1043
https://doi.org/10.1115/1.4030802
Published Online: September 1, 2015
View Articletitled, Double-Sided Transferred Carbon Nanotube Arrays for Improved Thermal Interface Materials
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Topics: Carbon nanotubes, Steady state, Temperature, Thermal resistance, Solders, Thermal conductivity
Journal Articles

Measurement of Air Flow Rate Sensitivity to the Differential Pressure Across a Server Rack in a Data Center

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Vaibhav K. Arghode, Yogendra Joshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2015, 137(4): 041002.
Paper No: EP-14-1112
https://doi.org/10.1115/1.4031079
Published Online: July 28, 2015
View Articletitled, Measurement of Air Flow Rate Sensitivity to the Differential Pressure Across a Server Rack in a Data Center
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Topics: Air flow, Pressure, Server racks, Data centers
Journal Articles

Experimental Investigation of Air Flow Through a Perforated Tile in a Raised Floor Data Center

Available to Purchase
Vaibhav K. Arghode, Yogendra Joshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2015, 137(1): 011011.
Paper No: EP-14-1017
https://doi.org/10.1115/1.4028835
Published Online: March 1, 2015
View Articletitled, Experimental Investigation of Air Flow Through a Perforated Tile in a Raised Floor Data Center
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Topics: Air flow, Tiles, Porosity, Data centers