1-13 of 13
Y. Li
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Ripening Growth Kinetics of Cu 6 Sn 5 Grains in Sn-3.0Ag-0.5Cu- x TiO 2 /Cu Solder Joints During the Reflow Process

Available to Purchase
Y. Tang, S. M. Luo, G. Y. Li, Z. Yang, C. J. Hou
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 011003.
Paper No: EP-17-1089
https://doi.org/10.1115/1.4038861
Published Online: March 2, 2018
View Articletitled, Ripening Growth Kinetics of Cu 6 Sn 5 Grains in Sn-3.0Ag-0.5Cu- x TiO 2 /Cu Solder Joints During the Reflow Process
Open the PDF for Ripening Growth Kinetics of Cu 6 Sn 5 Grains in Sn-3.0Ag-0.5Cu- x TiO 2 /Cu Solder Joints During the Reflow Process in another window
Topics: Solder joints, Tin, Solders, Nanoparticles
Journal Articles

Rapid Temperature Cycling (RTC) Methodology for Reliability Assessment of Solder Interconnection in Tape Ball Grid Array (TBGA) Assembly

Available to Purchase
B. L. Chen, X. Q. Shi, G. Y. Li, K. H. Ang, Jason P. Pickering
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 466–473.
https://doi.org/10.1115/1.2056574
Published Online: February 24, 2005
View Articletitled, Rapid Temperature Cycling (RTC) Methodology for Reliability Assessment of Solder Interconnection in Tape Ball Grid Array (TBGA) Assembly
Open the PDF for Rapid Temperature Cycling (RTC) Methodology for Reliability Assessment of Solder Interconnection in Tape Ball Grid Array (TBGA) Assembly in another window
Topics: Rapid tooling, Reliability, Temperature, Failure, Ball-Grid-Array packaging, Solder joints, Manufacturing, Solders, Testing
Journal Articles

Impact Resistance of SM Joints Formed With ICA

Available to Purchase
C. M. Lawrence Wu, Robert K. Y. Li, N. H. Yeung
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 93–97.
https://doi.org/10.1115/1.1534842
Published Online: March 14, 2003
View Articletitled, Impact Resistance of SM Joints Formed With ICA
Open the PDF for Impact Resistance of SM Joints Formed With ICA in another window
Topics: Adhesives, Copper, Fracture (Materials), Impact testing, Shear (Mechanics), Shear strength, Solders, Silver, Resistors, Alloys
Journal Articles

Impact Resistance of SM Joints Formed With ICA

Available to Purchase
C. M. Lawrence Wu, Robert K. Y. Li, N. H. Yeung
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2002, 124(4): 374–378.
https://doi.org/10.1115/1.1502666
Published Online: December 12, 2002
View Articletitled, Impact Resistance of SM Joints Formed With ICA
Open the PDF for Impact Resistance of SM Joints Formed With ICA in another window
Topics: Adhesives, Copper, Fracture (Materials), Impact testing, Reliability, Shear (Mechanics), Shear strength, Solders, Silver, Resistors
Journal Articles

An Investigation of Intermetallics Formation Between Pd/Ag Metallization and Sn/Pb/Ag Solder

Available to Purchase
G. Y. Li, Y. C. Chan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2002, 124(3): 305–310.
https://doi.org/10.1115/1.1486012
Published Online: July 26, 2002
View Articletitled, An Investigation of Intermetallics Formation Between Pd/Ag Metallization and Sn/Pb/Ag Solder
Open the PDF for An Investigation of Intermetallics Formation Between Pd/Ag Metallization and Sn/Pb/Ag Solder in another window
Topics: Electron diffraction, Intermetallic compounds, Solder joints, Solders, Tin, X-ray diffraction, Silver, X-rays, Transmission electron microscopy, Thick films
Journal Articles

Nondestructive Evaluation of Ceramic Substrate With Embedded Passive Components by SAM

Available to Purchase
Z. Q. Yu, Y. C. Chan, D. P. Webb, G. Y. Li
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2000, 122(2): 172–177.
https://doi.org/10.1115/1.483151
Published Online: May 21, 1999
View Articletitled, Nondestructive Evaluation of Ceramic Substrate With Embedded Passive Components by SAM
Open the PDF for Nondestructive Evaluation of Ceramic Substrate With Embedded Passive Components by SAM in another window
Topics: Acoustics, Capacitors, Ceramics, Delamination, Nondestructive evaluation, Testing, Microscopy, Thermal shock, Reliability, Failure analysis
Journal Articles

The Effect of Underfill and Underfill Delamination on the Thermal Stress in Flip-Chip Solder Joints

Available to Purchase
S. Rzepka, M. A. Korhonen, E. Meusel, C.-Y. Li
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. December 1998, 120(4): 342–348.
https://doi.org/10.1115/1.2792644
Published Online: December 1, 1998
View Articletitled, The Effect of Underfill and Underfill Delamination on the Thermal Stress in Flip-Chip Solder Joints
Open the PDF for The Effect of Underfill and Underfill Delamination on the Thermal Stress in Flip-Chip Solder Joints in another window
Topics: Delamination, Flip-chip, Solder joints, Thermal stresses, Solders, Stress, Adhesion, Damage, Failure, Finite element analysis
Journal Articles

CBGA Solder Fillet Shape Prediction and Design Optimization

Available to Purchase
Y. Li, R. L. Mahajan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. June 1998, 120(2): 118–122.
https://doi.org/10.1115/1.2792592
Published Online: June 1, 1998
View Articletitled, CBGA Solder Fillet Shape Prediction and Design Optimization
Open the PDF for CBGA Solder Fillet Shape Prediction and Design Optimization in another window
Topics: Design, Optimization, Shapes, Solders, Reliability, Fatigue life, Ball-Grid-Array packaging, Ceramics, Composite materials, Engineering simulation
Journal Articles

The Effect of Stencil Printing Optimization on Reliability of CBGA and PBGA Solder Joints

Available to Purchase
Y. Li, R. L. Mahajan, G. Subbarayan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1998, 120(1): 54–60.
https://doi.org/10.1115/1.2792286
Published Online: March 1, 1998
View Articletitled, The Effect of Stencil Printing Optimization on Reliability of CBGA and PBGA Solder Joints
Open the PDF for The Effect of Stencil Printing Optimization on Reliability of CBGA and PBGA Solder Joints in another window
Topics: Optimization, Printing, Reliability, Solder joints, Solders, Ball-Grid-Array packaging, Ceramics, Fatigue life, Cycles, Design
Journal Articles

A Model Study of Thermal Stress-Induced Voiding in Electronic Packages

Available to Purchase
Y. Huang, K. X. Hu, C. P. Yeh, N.-Y. Li, K. C. Hwang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1996, 118(4): 229–234.
https://doi.org/10.1115/1.2792157
Published Online: December 1, 1996
View Articletitled, A Model Study of Thermal Stress-Induced Voiding in Electronic Packages
Open the PDF for A Model Study of Thermal Stress-Induced Voiding in Electronic Packages in another window
Topics: Electronic packages, Stress, Cavitation, Solids, Adhesives, Design, Failure mechanisms, Hardening, Hydrostatics, Integrated circuits
Journal Articles

Reliability Simulations for Solder Joints Using Stochastic Finite Element and Artificial Neural Network Models

Available to Purchase
G. Subbarayan, Y. Li, R. L. Mahajan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1996, 118(3): 148–156.
https://doi.org/10.1115/1.2792145
Published Online: September 1, 1996
View Articletitled, Reliability Simulations for Solder Joints Using Stochastic Finite Element and Artificial Neural Network Models
Open the PDF for Reliability Simulations for Solder Joints Using Stochastic Finite Element and Artificial Neural Network Models in another window
Topics: Artificial neural networks, Engineering simulation, Finite element analysis, Reliability, Simulation, Solder joints, Design, Manufacturing, Finite element model, Ball-Grid-Array packages
Journal Articles

Fine Pitch Stencil Printing Process Modeling and Optimization

Available to Purchase
Y. Li, R. L. Mahajan, N. Nikmanesh
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1996, 118(1): 1–6.
https://doi.org/10.1115/1.2792121
Published Online: March 1, 1996
View Articletitled, Fine Pitch Stencil Printing Process Modeling and Optimization
Open the PDF for Fine Pitch Stencil Printing Process Modeling and Optimization in another window
Topics: Modeling, Optimization, Printing, Solders, Design, Neural network models, Algorithms, Assembly lines, Engineering simulation, Machinery
Journal Articles

Elastic Analysis of Flip-Chip Solder Joints Undergoing Thermal Excursions

Available to Purchase
H. D. Conway, P. Bo̸rgesen, C.-Y. Li
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1994, 116(2): 110–115.
https://doi.org/10.1115/1.2905498
Published Online: June 1, 1994
View Articletitled, Elastic Analysis of Flip-Chip Solder Joints Undergoing Thermal Excursions
Open the PDF for Elastic Analysis of Flip-Chip Solder Joints Undergoing Thermal Excursions in another window
Topics: Elastic analysis, Flip-chip, Solder joints, Stress, Deformation, Thermodynamic power cycles