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Journal Articles

A Model of Crack Nucleation in Layered Electronic Assemblies Under Thermal Cycling

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A. Chandra, Y. Huang, Z. Q. Jiang, K. X. Hu, G. Fu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2000, 122(3): 220–226.
https://doi.org/10.1115/1.1286100
Published Online: November 5, 1999
View Articletitled, A Model of Crack Nucleation in Layered Electronic Assemblies Under Thermal Cycling
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Topics: Damage, Fracture (Materials), Nucleation (Physics), Stress, Cycles, Microscale devices
Journal Articles

The Green Function and Its Application to Heat Transfer in a Low Permeability Porous Channel

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C. Cui, X. Y. Huang, C. Y. Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2000, 122(3): 274–278.
https://doi.org/10.1115/1.1287929
Published Online: July 11, 1999
View Articletitled, The Green Function and Its Application to Heat Transfer in a Low Permeability Porous Channel
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Topics: Heat, Heat transfer, Permeability, Porous materials, Temperature, Flow (Dynamics), Heat flux, Heat sinks
Journal Articles

Thermal Stresses in Layered Electronic Assemblies

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Z. Q. Jiang, Y. Huang, A. Chandra
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1997, 119(2): 127–132.
https://doi.org/10.1115/1.2792218
Published Online: June 1, 1997
View Articletitled, Thermal Stresses in Layered Electronic Assemblies
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Topics: Thermal stresses, Adhesives, Design, Stress, Electronic packages, Electronics, Euler-Bernoulli beam theory, Failure, Finite element analysis, Finite element methods
Journal Articles

A Model Study of Thermal Stress-Induced Voiding in Electronic Packages

Available to Purchase
Y. Huang, K. X. Hu, C. P. Yeh, N.-Y. Li, K. C. Hwang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1996, 118(4): 229–234.
https://doi.org/10.1115/1.2792157
Published Online: December 1, 1996
View Articletitled, A Model Study of Thermal Stress-Induced Voiding in Electronic Packages
Open the PDF for A Model Study of Thermal Stress-Induced Voiding in Electronic Packages in another window
Topics: Electronic packages, Stress, Cavitation, Solids, Adhesives, Design, Failure mechanisms, Hardening, Hydrostatics, Integrated circuits
Journal Articles

Stress Analysis of Printed Circuit Boards With Highly Populated Solder Joints and Components: A Micromechanics Approach

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K. X. Hu, Y. Huang, C. P. Yeh, K. W. Wyatt
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1996, 118(2): 87–93.
https://doi.org/10.1115/1.2792137
Published Online: June 1, 1996
View Articletitled, Stress Analysis of Printed Circuit Boards With Highly Populated Solder Joints and Components: A Micromechanics Approach
Open the PDF for Stress Analysis of Printed Circuit Boards With Highly Populated Solder Joints and Components: A Micromechanics Approach in another window
Topics: Micromechanics (Engineering), Printed circuit boards, Solder joints, Stress analysis (Engineering), Lumber, Accounting, Composite materials, Energy budget (Physics), Finite element analysis, Stress concentration