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Xianjie Yang
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Journal Articles

Constitutive Modeling on Time-Dependent Deformation Behavior of 96.5 Sn - 3.5 Ag Solder Alloy Under Cyclic Multiaxial Straining

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Xianjie Yang, Yan Luo, Qing Gao
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 41–47.
https://doi.org/10.1115/1.2429708
Published Online: May 18, 2006
View Articletitled, Constitutive Modeling on Time-Dependent Deformation Behavior of 96.5 Sn - 3.5 Ag Solder Alloy Under Cyclic Multiaxial Straining
Open the PDF for Constitutive Modeling on Time-Dependent Deformation Behavior of 96.5 Sn - 3.5 Ag Solder Alloy Under Cyclic Multiaxial Straining in another window
Topics: Deformation, Modeling, Solders, Stress, Alloys, Tin, Constitutive equations
Journal Articles

Time Integration Algorithm for a Cyclic Damage Coupled Thermo-Viscoplasticity Model for 63Sn-37Pb Solder Applications

Available to Purchase
Xianjie Yang, C. L. Chow, K. J. Lau
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 148–158.
https://doi.org/10.1115/1.1649246
Published Online: April 30, 2004
View Articletitled, Time Integration Algorithm for a Cyclic Damage Coupled Thermo-Viscoplasticity Model for 63Sn-37Pb Solder Applications
Open the PDF for Time Integration Algorithm for a Cyclic Damage Coupled Thermo-Viscoplasticity Model for 63Sn-37Pb Solder Applications in another window
Topics: Algorithms, Computer simulation, Constitutive equations, Damage, Hardening, Shear (Mechanics), Solders, Stress, Viscoplasticity, Finite element analysis