1-4 of 4
Tao-Chih Chang
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Micro Solder Joint Reliability and Warpage Investigations of Extremely Thin Double-Layered Stacked-Chip Packaging

Available to Purchase
Chang-Chun Lee, Kuo-Shu Kao, Hou-Chun Liu, Chia-Ping Hsieh, Tao-Chih Chang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2022, 144(1): 011001.
Paper No: EP-20-1071
https://doi.org/10.1115/1.4050198
Published Online: August 6, 2021
View Articletitled, Micro Solder Joint Reliability and Warpage Investigations of Extremely Thin Double-Layered Stacked-Chip Packaging
Open the PDF for Micro Solder Joint Reliability and Warpage Investigations of Extremely Thin Double-Layered Stacked-Chip Packaging in another window
Topics: Creep, Fatigue, Packaging, Reliability, Solder joints, Warping, Finite element analysis, Stress, Solders, Silicon
Journal Articles

Influence of Glass Transition Temperature of Underfill on the Stress Behavior and Reliability of Microjoints Within a Chip Stacking Architecture

Available to Purchase
Jing-Yao Chang, Shin-Yi Huang, Chang-Chun Lee, Tung-Han Chuang, Tao-Chih Chang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2015, 137(3): 031007.
Paper No: EP-14-1083
https://doi.org/10.1115/1.4030392
Published Online: September 1, 2015
View Articletitled, Influence of Glass Transition Temperature of Underfill on the Stress Behavior and Reliability of Microjoints Within a Chip Stacking Architecture
Open the PDF for Influence of Glass Transition Temperature of Underfill on the Stress Behavior and Reliability of Microjoints Within a Chip Stacking Architecture in another window
Topics: Cycles, Glass transition, Reliability, Solders, Stress, Temperature, Numerical analysis, Failure, Tin, Failure mechanisms
Journal Articles

Failure Analysis of Halogen-Free Printed Circuit Board Assembly Under Board-Level Drop Test

Available to Purchase
Hung-Jen Chang, Chau-Jie Zhan, Tao-Chih Chang, Jung-Hua Chou
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2012, 134(1): 011011.
https://doi.org/10.1115/1.4005956
Published Online: March 19, 2012
View Articletitled, Failure Analysis of Halogen-Free Printed Circuit Board Assembly Under Board-Level Drop Test
Open the PDF for Failure Analysis of Halogen-Free Printed Circuit Board Assembly Under Board-Level Drop Test in another window
Topics: Failure, Failure analysis, Fracture (Materials), Intermetallic compounds, Lead-free solders, Printed circuit board assemblies, Solder joints, Solders, Stress, Tin
Journal Articles

Influence of Intermetallic Characteristics on the Solder Joint Strength of Halogen-Free Printed Circuit Board Assembly

Available to Purchase
Hung-Jen Chang, Jung-Hua Chou, Tao-Chih Chang, Chau-Jie Zhan, Min-Hsiung Hon, Chi-Shiung Hsi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021004.
https://doi.org/10.1115/1.4003989
Published Online: June 23, 2011
View Articletitled, Influence of Intermetallic Characteristics on the Solder Joint Strength of Halogen-Free Printed Circuit Board Assembly
Open the PDF for Influence of Intermetallic Characteristics on the Solder Joint Strength of Halogen-Free Printed Circuit Board Assembly in another window
Topics: Alloys, Ball-Grid-Array packaging, Intermetallic compounds, Lead-free solders, Solder joints, Solders, Tin, Fracture (Materials), Finishes, Printed circuit board assemblies