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T. J. Lu
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Journal Articles

Heat Transfer and Pressure Drop Characteristics of Finned Metal Foam Heat Sinks Under Uniform Impinging Flow

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S. S. Feng, J. J. Kuang, T. J. Lu, K. Ichimiya
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2015, 137(2): 021014.
Paper No: EP-13-1131
https://doi.org/10.1115/1.4029722
Published Online: June 1, 2015
View Articletitled, Heat Transfer and Pressure Drop Characteristics of Finned Metal Foam Heat Sinks Under Uniform Impinging Flow
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Topics: Flow (Dynamics), Heat sinks, Heat transfer, Metal foams, Pressure drop
Journal Articles

The Effects of Material Properties on Heat Dissipation in High Power Electronics

Available to Purchase
T. J. Lu, A. G. Evans, J. W. Hutchinson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1998, 120(3): 280–289.
https://doi.org/10.1115/1.2792634
Published Online: September 1, 1998
View Articletitled, The Effects of Material Properties on Heat Dissipation in High Power Electronics
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Topics: Electronics, Energy dissipation, Heat, Materials properties, Thermal conductivity, Cooling, Approximation, Diamonds, Dimensions, Insulation