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Journal Articles

Investigation of Microporous Coatings and Mesoscale Evaporator Enhancements for Two-Phase Cooling of Electronic Components

Mark A. Trautman, Murli Tirumala, S. M. You
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2008, 130(1): 011007.
https://doi.org/10.1115/1.2837509
Published Online: February 4, 2008
View Articletitled, Investigation of Microporous Coatings and Mesoscale Evaporator Enhancements for Two-Phase Cooling of Electronic Components
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Topics: Boiling, Coatings, Cooling, Heat, Fluids, Fins, Heat conduction, Coating processes
Journal Articles

Pool Boiling Heat Transfer With an Array of Flush-Mounted, Square Heaters on a Vertical Surface

S. M. You, T. W. Simon, A. Bar-Cohen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1997, 119(1): 17–25.
https://doi.org/10.1115/1.2792195
Published Online: March 1, 1997
View Articletitled, Pool Boiling Heat Transfer With an Array of Flush-Mounted, Square Heaters on a Vertical Surface
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Topics: Heat transfer, Pool boiling, Boiling, Bubbles, Fluids, Heat, Heating, Aluminum, Computer cooling, Platinum