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Ronald J. Warzoha
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Journal Articles

Special Issue on InterPACK2023

Free
Ronald J. Warzoha, Damena Agonofer, Ashutosh Giri, Jimil Shah
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. December 2024, 146(4): 040301.
Paper No: EP-24-1089
https://doi.org/10.1115/1.4066727
Published Online: October 22, 2024
View Articletitled, Special Issue on InterPACK2023
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Topics: Electronic packaging, Electronics, Packaging, Cutting, Data centers, Energy storage, Engineering teachers, Machine learning, Mechanical engineers, Microelectromechanical systems
Journal Articles

Special Issue Dedicated to Professor Avram Bar-Cohen

Free
Ronald J. Warzoha, Darin J. Sharar, Raffaele Luca Amalfi, Andrew Tay
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. December 2021, 143(4): 040301.
Paper No: EP-21-1127
https://doi.org/10.1115/1.4052174
Published Online: September 13, 2021
View Articletitled, Special Issue Dedicated to Professor Avram Bar-Cohen
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Topics: Engineering teachers
Journal Articles

Special Section on Nanoscale/Microscale Energy Transport, Conversion and Storage in Electronics Packaging

Free
Ronald J. Warzoha
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. June 2021, 143(2): 020301.
Paper No: EP-21-1004
https://doi.org/10.1115/1.4050407
Published Online: March 19, 2021
View Articletitled, Special Section on Nanoscale/Microscale Energy Transport, Conversion and Storage in Electronics Packaging
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Topics: Electronic packaging, Microscale devices, Nanoscale phenomena, Storage
Journal Articles

Applications and Impacts of Nanoscale Thermal Transport in Electronics Packaging

Available to Purchase
Ronald J. Warzoha, Adam A. Wilson, Brian F. Donovan, Nazli Donmezer, Ashutosh Giri, Patrick E. Hopkins, Sukwon Choi, Darshan Pahinkar, Jingjing Shi, Samuel Graham, Zhiting Tian, Laura Ruppalt
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. June 2021, 143(2): 020804.
Paper No: EP-20-1070
https://doi.org/10.1115/1.4049293
Published Online: February 22, 2021
View Articletitled, Applications and Impacts of Nanoscale Thermal Transport in Electronics Packaging
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Topics: Electronics, Gallium nitride, Heat, Nanoscale phenomena, Phonons, Temperature, Thermal conductivity, Electromagnetic scattering, Energy gap, Diamonds
Journal Articles

Maximum Resolution of a Probe-Based, Steady-State Thermal Interface Material Characterization Instrument

Available to Purchase
Ronald J. Warzoha, Andrew N. Smith, Maurice Harris
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2017, 139(1): 011004.
Paper No: EP-16-1075
https://doi.org/10.1115/1.4035178
Published Online: December 29, 2016
View Articletitled, Maximum Resolution of a Probe-Based, Steady-State Thermal Interface Material Characterization Instrument
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Topics: Heat, Instrumentation, Probes, Resolution (Optics), Steady state, Uncertainty, Heat flux, Measurement uncertainty, Fillers (Materials), Temperature measurement