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Journal Articles

High Gain and Wideband Antenna-in-Package Solution Using Fan-Out Technology

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Xuesong Zhang, Qian Wang, Chenhui Xia, Chaojie Zhou, Gang Wang, Jian Cai
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031009.
Paper No: EP-22-1039
https://doi.org/10.1115/1.4056991
Published Online: March 20, 2023
View Articletitled, High Gain and Wideband Antenna-in-Package Solution Using Fan-Out Technology
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Topics: Design, Dipoles (Electromagnetism), Manufacturing, Millimeter waves, Packaging, Radiation (Physics), Signals, Simulation, Warping, Waveguides
Journal Articles

A Hybrid Antenna in Package Solution Using FOWLP Technology

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Xuesong Zhang, Qian Wang, Bo Wang, Gang Wang, Xin Gu, Yu Chen, Lin Tan, Shengjuan Zhou, Jian Cai
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031005.
Paper No: EP-21-1024
https://doi.org/10.1115/1.4051379
Published Online: September 15, 2021
View Articletitled, A Hybrid Antenna in Package Solution Using FOWLP Technology
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Topics: Design, Manufacturing, Millimeter waves, Semiconductor wafers, Warping, Waveguides, Solders, Temperature, Molding
Journal Articles

Thermal Resistance Analysis of Sn-Bi Solder Paste Used as Thermal Interface Material for Power Electronics Applications

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Rui Zhang, Jian Cai, Qian Wang, Jingwei Li, Yang Hu, Hongda Du, Liangliang Li
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2014, 136(1): 011012.
Paper No: EP-13-1045
https://doi.org/10.1115/1.4026616
Published Online: February 18, 2014
View Articletitled, Thermal Resistance Analysis of Sn-Bi Solder Paste Used as Thermal Interface Material for Power Electronics Applications
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Topics: Electronics, Solders, Thermal resistance, Tin, Plates (structures), Lasers