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Mudasir Ahmad
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Journal Articles

Erratum: “Solder Joint Shape Prediction Using a Modified Perzyna Viscoplastic Model” [ Journal of Electronic Packaging, 2005, 127(3), pp. 290–298 ]

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Mudasir Ahmad, Ken Hubbard, Mason Hu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Errata
J. Electron. Packag. March 2006, 128(1): 98.
https://doi.org/10.1115/1.2165648
Published Online: March 1, 2006
View Articletitled, Erratum: “Solder Joint Shape Prediction Using a Modified Perzyna Viscoplastic Model” [ Journal of Electronic Packaging, 2005, 127(3), pp. 290–298 ]
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Topics: Electronic packaging, Shapes, Solder joints
Journal Articles

Solder Joint Shape Prediction Using a Modified Perzyna Viscoplastic Model

Available to Purchase
Mudasir Ahmad, Ken Hubbard, Mason Hu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 290–298.
https://doi.org/10.1115/1.1938985
Published Online: October 5, 2004
View Articletitled, Solder Joint Shape Prediction Using a Modified Perzyna Viscoplastic Model
Open the PDF for Solder Joint Shape Prediction Using a Modified Perzyna Viscoplastic Model in another window
Topics: Shapes, Solder joints, Solders, Surface tension, Warping, Finite element analysis, Ball-Grid-Array packaging
Journal Articles

Study of Mechanical Behavior of Compliant Micro-Springs for Next Generation Probing Applications

Available to Purchase
Mudasir Ahmad, Suresh K. Sitaraman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. December 2002, 124(4): 411–418.
https://doi.org/10.1115/1.1512296
Published Online: December 12, 2002
View Articletitled, Study of Mechanical Behavior of Compliant Micro-Springs for Next Generation Probing Applications
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Topics: Springs, Stress