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M. M. Yovanovich
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Journal Articles

Optimization of Pin-Fin Heat Sinks in Bypass Flow Using Entropy Generation Minimization Method

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W. A. Khan, J. R. Culham, M. M. Yovanovich
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2008, 130(3): 031010.
https://doi.org/10.1115/1.2965209
Published Online: August 1, 2008
View Articletitled, Optimization of Pin-Fin Heat Sinks in Bypass Flow Using Entropy Generation Minimization Method
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Topics: Entropy, Flow (Dynamics), Heat sinks, Optimization, Pressure drop, Heat transfer, Clearances (Engineering)
Journal Articles

The Role of Fin Geometry in Heat Sink Performance

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W. A. Khan, J. R. Culham, M. M. Yovanovich
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 324–330.
https://doi.org/10.1115/1.2351896
Published Online: February 24, 2006
View Articletitled, The Role of Fin Geometry in Heat Sink Performance
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Topics: Drag (Fluid dynamics), Entropy, Geometry, Heat sinks, Heat transfer, Reynolds number, Thermal resistance, Heat transfer coefficients, Viscosity
Journal Articles

Thermal Joint Resistance of Polymer-Metal Rough Interfaces

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M. Bahrami, M. M. Yovanovich, E. E. Marotta
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2006, 128(1): 23–29.
https://doi.org/10.1115/1.2159005
Published Online: May 11, 2005
View Articletitled, Thermal Joint Resistance of Polymer-Metal Rough Interfaces
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Topics: Deformation, Metals, Polymers, Surface roughness, Thermal resistance, Temperature, Microhardness
Journal Articles

Thermal Resistances of Circular Source on Finite Circular Cylinder With Side and End Cooling

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M. M. Yovanovich, Distinguished Professor Emeritus, Principal Scientific Advisor,
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2003, 125(2): 169–177.
https://doi.org/10.1115/1.1568124
Published Online: June 10, 2003
View Articletitled, Thermal Resistances of Circular Source on Finite Circular Cylinder With Side and End Cooling
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Topics: Circular cylinders, Cooling, Cylinders, Disks, Heat flux, Temperature, Boundary-value problems, Thermal resistance, Approximation
Journal Articles

Thermal Spreading Resistance of Eccentric Heat Sources on Rectangular Flux Channels

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Y. S. Muzychka, Assistant Professor,, J. R. Culham, Associate Professor, Mem. ASME, M. M. Yovanovich, Distinguished Professor Emeritus, Fellow ASME
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2003, 125(2): 178–185.
https://doi.org/10.1115/1.1568125
Published Online: June 10, 2003
View Articletitled, Thermal Spreading Resistance of Eccentric Heat Sources on Rectangular Flux Channels
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Topics: Heat, Temperature
Journal Articles

Simplified Analytical Models for Forced Convection Heat Transfer From Cuboids of Arbitrary Shape

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J. R. Culham, Associate Professor and Director, Mem. ASME, M. M. Yovanovich, Distinguished Professor Emeritus, Fellow ASME, P. Teertstra, Research Associate, C.-S. Wang, G. Refai-Ahmed, Mem. ASME, Ra-Min Tain
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2001, 123(3): 182–188.
https://doi.org/10.1115/1.1347993
Published Online: October 13, 2000
View Articletitled, Simplified Analytical Models for Forced Convection Heat Transfer From Cuboids of Arbitrary Shape
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Topics: Boundary layers, Dimensions, Flat plates, Flow (Dynamics), Forced convection, Reynolds number, Shapes, Computer simulation, Heat transfer, Computational fluid dynamics
Journal Articles

Thermal Characterization of Electronic Packages Using a Three-Dimensional Fourier Series Solution

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J. R. Culham, Associate Professor and Director, Mem. ASME,, M. M. Yovanovich, Professor Emeritus and Principal Scientific Advisor, Fellow ASME,, T. F. Lemczyk, Project Engineer,
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2000, 122(3): 233–239.
https://doi.org/10.1115/1.1287928
Published Online: September 1, 2000
View Articletitled, Thermal Characterization of Electronic Packages Using a Three-Dimensional Fourier Series Solution
Open the PDF for Thermal Characterization of Electronic Packages Using a Three-Dimensional Fourier Series Solution in another window
Topics: Boundary-value problems, Cavities, Electronic packages, Fourier series, Multi-chip modules, Temperature, Thermal characterization, Laplace equations, Modeling, Junctions
Journal Articles

Thermal Management of Surface Mount Power Magnetic Components

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G. Refai-Ahmed, Mem. ASME,, M. M. Yovanovich, Fellow ASME,
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2000, 122(4): 323–327.
https://doi.org/10.1115/1.1289634
Published Online: November 25, 1999
View Articletitled, Thermal Management of Surface Mount Power Magnetic Components
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Topics: Computer simulation, Heat conduction, Surface mount packaging, Temperature, Thermal management, Thermal resistance, Winding (process), Heat transfer, Wings, Packaging
Journal Articles

Modeling Natural Convection From Horizontal Isothermal Annular Heat Sinks

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C.-S. Wang, M. M. Yovanovich, J. R. Culham
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1999, 121(1): 44–49.
https://doi.org/10.1115/1.2792660
Published Online: March 1, 1999
View Articletitled, Modeling Natural Convection From Horizontal Isothermal Annular Heat Sinks
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Topics: Heat sinks, Modeling, Natural convection, Heat transfer, Boundary layers, Cylinders, Disks, Flow (Dynamics), Geometry
Journal Articles

PCB Trace Thermal Analysis and Effective Conductivity

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T. F. Lemczyk, B. L. Mack, J. R. Culham, M. M. Yovanovich
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1992, 114(4): 413–419.
https://doi.org/10.1115/1.2905474
Published Online: December 1, 1992
View Articletitled, PCB Trace Thermal Analysis and Effective Conductivity
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Topics: Thermal analysis, Thermal conductivity, Heat, Printed circuit boards, Electric current, Glass reinforced plastics, Heat conduction, Microelectronic devices, Operating temperature, Steady state
Journal Articles

Influence of Discrete Heat Source Location on Natural Convection Heat Transfer in a Vertical Square Enclosure

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G. Refai Ahmed, M. M. Yovanovich
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1991, 113(3): 268–274.
https://doi.org/10.1115/1.2905406
Published Online: September 1, 1991
View Articletitled, Influence of Discrete Heat Source Location on Natural Convection Heat Transfer in a Vertical Square Enclosure
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Topics: Heat, Heat transfer, Natural convection, Heat conduction, Rayleigh number, Thermal conductivity
Journal Articles

Buoyancy-Induced Flows and Transport

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Benjamin Gebhart, Author, Yogesh Jaluria, Author, Roop L. Mahajan, Author, Bahgat Sammakia, Author, M. M. Yovanovich, Reviewer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. December 1989, 111(4): 321.
https://doi.org/10.1115/1.3226555
Published Online: December 1, 1989
View Articletitled, Buoyancy-Induced Flows and Transport
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Topics: Buoyancy, Flow (Dynamics)
Journal Articles

Conjugate Heat Transfer From a Vertical Plate With Discrete Heat Sources Under Natural Convection

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S. Lee, M. M. Yovanovich
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1989, 111(4): 261–267.
https://doi.org/10.1115/1.3226545
Published Online: December 1, 1989
View Articletitled, Conjugate Heat Transfer From a Vertical Plate With Discrete Heat Sources Under Natural Convection
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Topics: Heat, Heat transfer, Natural convection, Vertical plates, Fluids, Radiation (Physics), Temperature, Boundary layers, Clearances (Engineering), Convection